Provided is a composite film for attachment to an elastomeric substrate. The composite film comprises the following layers, in the order below: an elastomeric layer comprising a thermoplastic polyurethane; an ink layer; and a pressure sensitive adhesive layer comprising a styrenic block copolymer blended with a phenolic resin. Advantageously, the provided composite films can withstand harsh outdoor environments and stresses while providing high anchorage to elastomeric substrates, such as car tires, for a long service life.

The present invention relates to an adhesive tape of thickness 40 to 300 μm that can be redetached without residue or destruction by stretching essentially in the plane of the bond, comprising at least one carrier of thickness 10 to 150 μm comprising at least one layer based on preferably uncrosslinked thermoplastic polyurethane that has typically been produced by means of extrusion and has a Shore A hardness of not more than 87, where the carrier has a ratio of force at 400% elongation F.sub.400% to breaking force F.sub.break of not more than 45%, and on which a pressure-sensitive adhesive layer is disposed on at least one side, and wherein the adhesive tape has a ratio of stripping force F.sub.strip to breaking force F.sub.break of less than 60%. The invention also relates to an adhesive tape of thickness 40 to 300 μm that can be redetached without residue or destruction by stretching essentially in the plane of the bond, comprising at least one carrier of thickness 10 to 150 μm comprising at least one layer based on preferably uncrosslinked polyurethane that has been produced from a dispersion and has a modulus at 100% elongation of not more than 1.8 MPa, where the carrier has a ratio of force at 400% elongation F.sub.400% to breaking force F.sub.break of not more than 30%, and on which a pressure-sensitive adhesive layer is disposed on at least one side, and wherein the adhesive tape has a ratio of stripping force F.sub.strip to breaking force F.sub.break of less than 60%. The invention also relates to a process for producing the adhesive tapes and to the use thereof for bonding of components in electronic devices.

A semiconductor processing adhesive tape that includes a substrate, a buffer layer which is provided on at least one side of the substrate, and an adhesive layer which is provided on the other side of the substrate, wherein the buffer layer has an energy to break at 23° C. of 13 to 80 MJ/m.sup.3.

A semiconductor processing adhesive tape that includes a substrate, a buffer layer which is provided on at least one side of the substrate, and an adhesive layer which is provided on the other side of the substrate, wherein the buffer layer has an energy to break at 23° C. of 13 to 80 MJ/m.sup.3.

In-situ polymerized polymer film facilitates improved paint film appliques with reduced defects. The paint film appliques comprise the in-situ polymerized polymer film as a carrier layer. The carrier layer is colored and, preferably defect-free.

An adhesive tape includes a substrate [I] and an adhesive agent layer of a polyester adhesive agent provided on at least one of opposite surfaces of the substrate [I]. The substrate [I] is one selected from a polyolefin resin foam substrate, a urethane resin foam substrate, and an acrylic resin foam substrate. The polyester adhesive agent is made from a polyester adhesive agent composition [II] which contains a polyester resin (A) having a weight average molecular weight of 5,000 to 300,000, and having a structural unit derived from a polyol and a structural unit derived from a polyvalent carboxylic acid compound containing an aromatic structure-containing compound in a proportion of not greater than 80 mol %. The adhesive tape is excellent in adherence between a polyester adhesive agent layer and a polyolefin resin foam substrate, a urethane resin foam substrate, or an acrylic resin foam substrate.

In-situ polymerized polymer film facilitates improved paint film appliques with reduced defects. The paint film appliques comprise the in-situ polymerized polymer film as a carrier layer and at least one color layer assembled as a laminate, optionally further comprising at least one topcoat layer on one major surface of the laminate and an adhesive layer on the other major surface of the laminate.

A thermal indicator, a thermal indicating composition (1), as well as two kinds of thermal indicating structures (11) are disclosed. The thermal indicator comprises an organic solid material (2) having a melting point higher than ambient temperature and a dye (3) which contacts the organic solid material (2) and is capable of being dissolved in the organic solid material (2) when the thermal indicator is heated to the melting point of the organic solid material (2). The thermal indicator, the thermal indicating composition (1), as well as these two kinds of thermal indicating structures (1) have simple structures and can be manufactured by a simple process. Furthermore, the existence of the dye (3) in its crystalline state offers significant resistance to UV radiation in outdoor applications.

In-situ polymerized polymer film facilitates improved paint film appliques with reduced defects. The paint film appliques comprise the in-situ polymerized polymer film as a carrier layer and at least one color layer assembled as a laminate, optionally further comprising at least one topcoat layer on one major surface of the laminate and an adhesive layer on the other major surface of the laminate.

In-situ polymerized polymer film facilitates improved paint film appliques with reduced defects. The paint film appliques comprise the in-situ polymerized polymer film as a carrier layer. The carrier layer is colored and, preferably defect-free.