A universal barrier system includes universal barrier components that may be assembled together to shield floors and walls from moisture and provide a thermal break in an operational area of the universal barrier component. A lap zone of the universal barrier component may allow universal barrier components to be assembled and installed to protect floors, walls, ceilings, footings and the like from moisture and heat gain or loss by minimizing the need for tapes and other joining methods. The universal barrier system may also act as a sound deadening material. The operational area and lap zone of the universal barrier component may be disposed on a vapor block layer to provide some rigidity. The operational area of the universal barrier component may include a thermal break disposed upon the vapor block layer. The thermal break may include an outer protective layer. In addition, universal barrier tape and universal barrier edging may be provided to couple adjoining universal barrier components.

A splice tape is provided. The splice tape includes two internal support layers bonded at interface between opposing inner surfaces of the internal support layers. The support layers are formed utilizing a process and/or materials that ensure that the two internal support layers separate cleanly and consistently along the interface of the two internal support layers.

A protective film comprising a release liner, a pressure sensitive adhesive layer, and a base material film laminated in this order in a thickness direction thereof, wherein the base material film contains polyurethane or poly(vinyl chloride), and information is printed on an opposite side, of the release liner, from the pressure sensitive adhesive layer.

A composite dry adhesive includes (a) an adhesive layer comprising a shape memory polymer and (b) a resistive heating layer comprising a shape memory polymer composite on the adhesive layer. The shape memory polymer composite includes conductive particles dispersed in a shape memory polymer matrix, where the conductive particles have a concentration sufficient to form a conductive path through the resistive heating layer.

The present invention relates to a diecut especially for the permanent closing of holes especially in metal sheets or in plastics parts, having a carrier composed of an assembly, more particularly laminate in the specified layer sequence, of optionally at least one first layer, which is formed by a metallic layer having a thickness of 10 to 40 μm, optionally at least one second layer, which is formed by a woven glass fabric or laid glass fabric having a basis weight of 30 to 200 g/m2, optionally at least one third layer, which is formed by a first pressure-sensitive adhesive having a basis weight of 70 to 200 g/m2, at least one fourth layer, which is formed by a flame-retardant foam having a thickness of at least 0.5 to 2.5 mm, and at least one fifth layer, which is formed by a second, acrylate-based pressure-sensitive adhesive having a basis weight of 300 to 1800 g/m2, preferably 360 to 1500 g/m2 and/or a thickness of 400 to 1800 μm, preferably 800 to 1500 μm.

The present invention relates to a protective film for a windshield of a vehicle, which can be installed on a curved portion of the windshield of the vehicle without a thermoforming process, thereby improving the workability of a worker, and improving impact resistance to effectively protect the windshield of the vehicle.

The present invention relates to a protective film for a windshield of a vehicle, which can be installed on a curved portion of the windshield of the vehicle without a thermoforming process, thereby improving the workability of a worker, and improving impact resistance to effectively protect the windshield of the vehicle.

The pressure sensitive adhesive tape for semiconductor processing includes a base which has a Young's modulus of 1000 MPa or more at 23° C., a buffer layer which is provided on at least one surface of this base, and a pressure sensitive adhesive layer provided on the other surface of the base. The buffer layer has a tensile storage elastic modulus (E.sub.23) of 100-2000 MPa at 23° C., and a tensile storage elastic modulus (E.sub.60) of 20-1000 MPa at 60° C.

The pressure sensitive adhesive tape for semiconductor processing includes a base which has a Young's modulus of 1000 MPa or more at 23° C., a buffer layer which is provided on at least one surface of this base, and a pressure sensitive adhesive layer provided on the other surface of the base. The buffer layer has a tensile storage elastic modulus (E.sub.23) of 100-2000 MPa at 23° C., and a tensile storage elastic modulus (E.sub.60) of 20-1000 MPa at 60° C.

The invention relates to a method for producing a single-sided adhesive film (1). Said method consists of providing a support layer (2) and coating a first side of the support layer (2) with an adhesive film (3), a lubricant coating (4) is applied to a second side of the support layer (2), the support layer (2) being in the form of a polyester film. Said method is characterised in that the polyester film, prior to bonding to the adhesive layer (3), and the lubricant coating (4) is treated with trichloroacetic acid, sodium persulphate, iron chloride or copper chloride in order to increase the surface energy of the polyester film. The invention also relates to a one-sided adhesive film (1) produced according to the above-mentioned method.