C09J2477/006

ADHESIVE TAPE FOR WRAPPING CABLES
20220348794 · 2022-11-03 ·

The invention relates to an adhesive tape, in particular wrapping tape, for sheathing automotive cables, having a textile support and at least one adhesive coating layer applied to one side or both sides of the textile support, and the textile support being manufactured entirely or partially from bio-based polymer fibers and/or polymer yarns, characterized in that the textile support is constituted of multi-weft yarns and/or multi-warp yarns.

REACTIVE ADHESIVE FILM WITH GOOD HEAT-AND-HUMIDITY RESISTANCE, IN PARTICULAR FOR BONDING POLYAMIDE

Reactive adhesive film for bonding various materials, including plastic to metal, the adhesive film comprising (a) a polymeric film-forming matrix, (b) at least one epoxide-functionalized (meth)acrylate or vinyl monomer and (c) a reagent selected from an initiator, in particular a free-radical initiator, or an activator. Further disclosed are reactive adhesive film systems comprising two reactive adhesive films. Methods for producing reactive adhesive films, and methods are also disclosed.

Laminate film structures having barrier adhesive layer

Laminate film structures including an adhesive layer having gas and moisture barrier properties are disclosed. The disclosed laminate film structures comprise films bonded together with an adhesive composition, the adhesive composition having barrier properties, e.g., controlling oxygen and/or water vapor transmission rates. The disclosed laminate film structures comprise films made from polymers and/or metallized polymers whereby the weight, thickness, and/or number of film layers has been reduced by using a barrier adhesive in place of a standard adhesive while still achieving similar barrier properties. Methods for forming laminate structures having a desired barrier performance are also disclosed, the methods comprising determining the desired barrier performance of the laminate structure, selecting a barrier adhesive, selecting two or more film layers, including at least a first film layer and a second film layer, applying the barrier adhesive on a surface of the first film layer, and bringing a surface of the second film layer into contact with the barrier adhesive applied on the surface of the first film layer, thereby forming the laminate structure having a desired barrier performance.

Modified ethylene vinyl acetate compositions, polymer blends and films made therefrom

Compositions may include an EVA copolymer produced from ethylene, vinyl acetate, and one or more polar comonomers, wherein at least one of the one or more polar comonomers include an amine moiety. Methods may include preparing a polymer composition by adding ethylene, vinyl acetate and one or more polar comonomers to a reactor or extruder, wherein at least one of the one or more polar comonomers include an amine moiety; and reacting the ethylene, vinyl acetate and one or more comonomers to produce the polymer composition. Compositions may include an adhesive film composition that include at least one layer including a polymer produced from ethylene, vinyl acetate, and one or more polar comonomers, wherein at least one of the one or more polar comonomers include an amine moiety.

ADHESIVE TAPE FOR WRAPPING CABLES
20230065871 · 2023-03-02 ·

The invention relates to an adhesive tape, in particular wrapping tape, for sheathing automotive cables, having a mostly textile support and at least one adhesive coating layer applied to one side or both sides of the textile support, and the textile support being manufactured entirely or partially from bio-based polymer fibers and/or polymer yarns, characterized in that the textile support is a velours support or includes such a velours support.

SELF-ADHESIVE MILLABLE SILICONE RUBBER COMPOSITION
20230159708 · 2023-05-25 · ·

An self-adhesive millable silicone rubber composition contains: 100 parts by mass of (A) an organopolysiloxane having at least two alkenyl groups bonded to silicon atoms per molecule and an average polymerization degree of 100 or more; 5 to 50 parts by mass of (B) a reinforcing silica having a specific surface area of 50 m.sup.2/g or more; 0.1 to 5 parts by mass of (C) an organosilicon compound having epoxy and alkoxy groups per molecule; 0.1 to 5 parts by mass of (D) an organosilicon compound having isocyanate group and alkoxy groups per molecule; and an effective curing amount of (E) a curing agent. The content of an organosilicon compound having a siloxane bond and benzene ring per molecule is 0 to 0.1 parts by mass, and the content of an organosilicon compound having a siloxane bond and an epoxy group per molecule is 0 to 0.1 parts by mass.

Temporary protective film for semiconductor encapsulation molding, lead frame provided with temporary protective film, encapsulated molded body provided with temporary protective film, and method for manufacturing semiconductor device

A temporary protective film for semiconductor sealing molding includes a support film and an adhesive layer provided on one surface or both surfaces of the support film and containing a resin and a silane coupling agent. The content of the silane coupling agent in the temporary protective film may be more than 5% by mass and less than or equal to 35% by mass with respect to the total mass of the resin.

NOVEL THERMORESPONSIVE ADHESIVE MATERIAL, METHOD OF MAKING THE MATERIAL AND METHODS OF USE

The present disclosure is directed to a thermoresponsive adhesive material. The material comprises a linear, phase-separated polymer having fluorinated polymer units and hydrophobic polymer units. The fluorinated polymer units and the hydrophobic polymer units are randomly ordered along the polymer. The hydrophobic polymer units include a first hydrophobic polymer unit and a second hydrophobic polymer unit. The first hydrophobic polymer unit is chosen from acrylate units or methacrylate units each substituted with one or more linear alkyl groups, linear alkenyl groups or a combination thereof, where at least one of the linear alkyl groups or alkenyl groups has 16 to 20 carbon atoms. The second hydrophobic polymer unit is chosen from acrylate units or methacrylate units each substituted with one or more linear alkyl groups, linear alkenyl groups or a combination thereof, where at least one of the linear alkyl or alkenyl groups of the second hydrophobic polymer unit has 5 to 14 carbon atoms. A peak adhesive strength of the thermoresponsive adhesive material is modifiable and reversible with a change in temperature. Methods of making thermoresponsive adhesive materials, methods employing thermoresponsive adhesive materials and self-adhesive objects that include thermoresponsive adhesive materials are also disclosed.

Flexible hardgoods with enhanced peel removability

The present disclosure provides adhesive mounting articles that can be removed from surfaces without damage by having reduced contribution of a hardgood to the peel force generated by the adhesive article during removal. In some instances, this can be accomplished by a hardgood that is flexible in a peel direction and rigid in a weight hanging direction. Such hardgoods may include a plurality of minimally connected body segments arranged about the transverse axis of the hardgood body.

Adhesive film and method for manufacturing semiconductor device

An adhesive film of the present invention includes a base material layer and a self-peeling adhesive layer laminated therein. The base material layer has a thermal contraction percentage in a direction of flow (thermal contraction percentage in an MD direction) and a thermal contraction percentage in an orthogonal direction with respect to the direction of flow (thermal contraction percentage in a TD direction) that satisfy the following conditions: (1) after heating at 150° C. for 30 minutes, 0.4≦|thermal contraction percentage in MD direction/thermal contraction percentage in TD direction|≦2.5 and average of thermal contraction percentage in MD direction and thermal contraction percentage in TD direction≦2%, and (2) after heating at 200° C. for 10 minutes, 0.4≦|thermal contraction percentage in MD direction/thermal contraction percentage in TD direction|≦2.5 and average of thermal contraction percentage in MD direction and thermal contraction percentage in TD direction≧3%.