C09J2477/006

FLEXIBLE HARDGOODS WITH ENHANCED PEEL REMOVABILITY
20220022668 · 2022-01-27 ·

The present disclosure provides adhesive mounting articles that can be removed from surfaces without damage by having reduced contribution of a hardgood to the peel force generated by the adhesive article during removal. In some instances, this can be accomplished by a hardgood that is flexible in a peel direction and rigid in a weight hanging direction. Such hardgoods may include a plurality of minimally connected body segments arranged about the transverse axis of the hardgood body.

TEMPORARY PROTECTIVE FILM FOR SEMICONDUCTOR ENCAPSULATION MOLDING, LEAD FRAME PROVIDED WITH TEMPORARY PROTECTIVE FILM, ENCAPSULATED MOLDED BODY PROVIDED WITH TEMPORARY PROTECTIVE FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
20220020606 · 2022-01-20 ·

A temporary protective film for semiconductor sealing molding includes a support film and an adhesive layer provided on one surface or both surfaces of the support film and containing a resin and a silane coupling agent. The content of the silane coupling agent in the temporary protective film may be more than 5% by mass and less than or equal to 35% by mass with respect to the total mass of the resin.

CURABLE HEAT-SEAL ADHESIVES FOR BONDING POLYMERS
20220017674 · 2022-01-20 ·

Curable compositions include a urethane (meth)acrylate oligomer having a number—average molecular weight of at least 6000 g/mol; at least one mono(meth)acrylate monomer; a multifunctional crosslinking monomer chosen from acrylate monomers, methacrylate monomers, or combinations thereof; and an ethylene-vinyl acetate grafted terpolymer. The mono(meth)acrylate monomers may include a first mono(meth)acrylate with Tg between 50° C. and 175° C. and a second mono(meth)acrylate with Tg between −50° C. and 30° C. The curable compositions may be applied onto a surface of a substrate then cured to form a low-tack adhesive layer on the surface. The curable compositions may be cured by exposure to visible radiation, UV radiation, LED radiation, laser radiation, electron-beam radiation, peroxide, accelerator, or heat. Methods for bonding substrates include contacting a second substrate to a tow-tack adhesive layer on a first substrate, then heating the low-tack adhesive layer to bond the substrates and form a laminate.

METHOD AND APPARATUS FOR MAKING ADHESIVE TAPE
20230278142 · 2023-09-07 ·

A method of making adhesive tape has the steps of advancing a substrate band longitudinally in a machine direction from a supply to an array of laser units, cutting the band longitudinally with the laser units into a plurality of longitudinal strips, and then cutting each of the longitudinal strips longitudinally into a plurality of tapes. An adhesive is applied to a face of each of the tapes, and the tapes are wound up individually.

Self-adhesive pervious membrane and method for manufacturing such a self-adhesive pervious membrane

A self-adhesive vapor-permeable membrane for use on a building, comprising a support that is permeable to air and water vapor, and a pressure-sensitive adhesive layer that is permeable to air and water vapor, and is secured to the underside of the support, wherein the membrane is noteworthy in that it comprises gas bubbles trapped between the support and the adhesive layer.

Plasma-treated sheets for additive manufacturing
11654622 · 2023-05-23 · ·

Illustrative examples of forming and using suitably adapted material in an additive manufacturing process includes operations of: exposing a first polymer sheet to a first plasma, such that an amine-functionalized sheet surface is formed; exposing a second polymer sheet to a second plasma, such that an epoxide-functionalized sheet surface is formed; and combining the amine-functionalized sheet and the epoxide-functionalized sheet, such that the amine-functionalized sheet surface contacts the epoxide-functionalized sheet surface. The workpiece is subsequently heated to form a structure, where heating of the workpiece causes covalent chemical bonds to form between the plasma-treated first polymer sheet and the plasma-treaded second polymer sheet.

LINERLESS FILM STACK
20230348756 · 2023-11-02 ·

A film stack is described. In particular, a film stack that includes a co-extrudable first base substrate, a first pressure sensitive adhesive, a release layer, a second pressure sensitive adhesive, and a second base substrate is described. Such film stacks may benefit from reduced waste, simpler manufacturing, and a thinner overall construction versus conventional film stacks.

Curable heat-seal adhesives for bonding polymers
11542354 · 2023-01-03 · ·

Curable compositions include a urethane (meth)acrylate oligomer having a number—average molecular weight of at least 6000 g/mol; at least one mono(meth)acrylate monomer; a multifunctional crosslinking monomer chosen from acrylate monomers, methacrylate monomers, or combinations thereof; and an ethylene-vinyl acetate grafted terpolymer. The mono(meth)acrylate monomers may include a first mono(meth)acrylate with Tg between 50° C. and 175° C. and a second mono(meth)acrylate with Tg between −50° C. and 30° C. The curable compositions may be applied onto a surface of a substrate then cured to form a low-tack adhesive layer on the surface. The curable compositions may be cured by exposure to visible radiation, UV radiation, LED radiation, laser radiation, electron-beam radiation, peroxide, accelerator, or heat. Methods for bonding substrates include contacting a second substrate to a tow-tack adhesive layer on a first substrate, then heating the low-tack adhesive layer to bond the substrates and form a laminate.

DIRECT APPLICATION OF THERMOSETTING COMPOSITE SURFACING FILMS TO UV-TREATED THERMOPLASTIC SURFACES AND RELATED COMPOSITE STRUCTURES

This disclosure is directed to methods directly adhering epoxy-based, and other thermosetting surfacing films to solid thermoplastic surfaces and the structures derived or derivable from these methods. In some embodiments, the disclosure is also directed to composite structures comprising a thermoplastic substrate directly bonded to a thermoset(ting) surfacing film; wherein the direct bonding defines an interface between a thermoplastic surface of the thermoplastic substrate and a first surface of the thermoset(ting) surfacing film.

Multilayer film for use in air bag and air bag

The present disclosure is directed to provide a multilayer film for use in an air bag, which provides sufficient adhesiveness and blocking tendency in a well-balanced manner. The multilayer film for use in an air bag according to the present disclosure includes an adhesive layer and an outer layer. The adhesive layer includes a resin having a glass transition temperature from 0° C. to 80° C. and a melting point from 100° C. to 160° C. The outer layer includes a resin having a melting point higher than the melting point of the resin included in the adhesive layer by 20° C. or higher. Further, an air bag according to the present disclosure includes a synthetic fiber fabric and the aforementioned multilayer film for use in an air bag, in which the adhesive layer in multilayer film is laminated with the synthetic fiber fabric.