A breast tape for supporting and lifting breasts and a method of applying the same are provided. The breast tape includes a body of lace, an adhesive applied to one surface of the lace, and a segmented protective material overlaying the adhesive. The breast tape supports and lifts the breasts by molding thereto and is attractive, easy to apply, has a smooth appearance, does not lose adhesiveness with ongoing wear, is breathable, comfortable and does not require heat activation or a lengthy gripping time. The method includes removing a first segment of protective material attached to a base of the breast tape and applying the base to a bottom of the breast, removing a second segment of the protective material, lifting the breast tape to achieve a desired support and lift, and applying the remainder of the breast tape to the skin and molding to the skin.

Provided are a film for manufacturing semiconductor component, a film for electronic component manufacture, a method for manufacturing a semiconductor component using such a film for manufacturing semiconductor component, and a method for manufacturing an electronic component using such a film for electronic component manufacture. The film for component manufacture includes a base layer and an adhesive layer provided on one surface side of the base layer, and the Ra (μm) of the surface of one side of the base layer on which the adhesive layer is not provided is 0.1 to 2.0, and the Rz (μm) is 1.0 to 15. The method using the film for component manufacture includes a segmenting step, a pickup step, and an evaluation step prior to the pickup step.

The present invention provides a UV debondable pressure sensitive adhesive composition and an adhesive tape comprising the same. The UV debondable pressure sensitive adhesive composition comprises a polyacrylate pressure sensitive adhesive, a UV-light polymerizable polyurethane oligomer, a cationic photoinitiator and a free radical photoinitiator, wherein polymerization monomers of the polyacrylate pressure sensitive adhesive comprise an acrylic monomer having an epoxy functional group. The UV debondable pressure sensitive adhesive composition has a bonding force dropping significantly upon UV irradiation, and leaves no residual adhesive.

A bonding composition joins polymer components by material engagement. The bonding composition includes a solvent and a polymer material, which may be made from similar polymers from which the polymer components are made. There may be a kit for producing a polymer components and a bonding composition. The polymer production includes volatilization of the solvent and optionally melting the polymer materials.

A rug tab is provided. The rug tab can include a support material, having an upper side and a lower side; an upper adhesive layer applied on the upper side of the support material; and a lower adhesive layer applied on the lower side of the support material. The rug tab can be designed such that (i) an upper adhesive layer sheer force is at least 25% greater than a lower adhesive layer sheer force, (ii) an upper adhesive layer peel force is at least twice a lower adhesive layer peel force, or (iii) both options (i) and (ii), where the force values are measured one hour after application of a respective upper or lower adhesive layer to a target surface. A method of stabilizing a rug and a kit for stabilizing a rug using the rug tabs are also provided.

A heat-sealable multilayer film comprising: a) 1% to 50% by weight of heat-sealable polymer layer (A), b) 1% to 99% by weight of polymer layer (C), and c) 0% to 95% by weight of polymer layer (B), with polymer layer (A) comprising: A1) 20% to 90% by weight of impact-resistant polystyrene and A2) 5% to 50% by weight of vinylaromatic-diene block copolymer; and polymer layer (B) comprising impact-resistant polystyrene, vinylaromatic-diene block copolymer, and/or mixtures of styrene homopolymers or vinylaromatic-diene graft copolymers with vinylaromatic-diene block copolymers; and polymer layer (C) having a melting temperature of ≥170° C.; and polymer layer (A) comprising) i) 66% to 99% by volume of a vinylaromatic hard phase and ii) 1% to 34% by volume of a diene soft phase surrounded by the hard phase and taking the form of spheres/cylinders.

The present disclosure is directed to provide a multilayer film for use in an air bag, which provides sufficient adhesiveness and blocking tendency in a well-balanced manner. The multilayer film for use in an air bag according to the present disclosure includes an adhesive layer and an outer layer. The adhesive layer includes a resin having a glass transition temperature from 0° C. to 80° C. and a melting point from 100° C. to 160° C. The outer layer includes a resin having a melting point higher than the melting point of the resin included in the adhesive layer by 20° C. or higher. Further, an air bag according to the present disclosure includes a synthetic fiber fabric and the aforementioned multilayer film for use in an air bag, in which the adhesive layer in multilayer film is laminated with the synthetic fiber fabric.

The present invention relates to an inflation film and a method for manufacturing the inflation film, wherein the inflation film includes a base film, including: a polyamide-based resin; a copolymer containing polyamide-based segments and poly-ether-based segments; and an olefin-based polymer compound, and has a small variation in physical properties between a machine direction (MD) and a transverse direction (TD) of the film.

The present invention relates to a packaging material for a power storage device, the packaging material including at least a slip agent layer, a substrate layer, an adhesive layer, a metal foil layer, a sealant adhesive layer, and a sealant layer, in this order, wherein the slip agent layer contains a fatty acid amide and a fatty acid bisamide, or a fatty acid amide and silicone oil.

A method for manufacturing a semiconductor device according to the present invention includes at least the following three steps: (A) a step of preparing a first structure (100) including an adhesive laminate film (50) having a heat-resistant resin layer (10), a flexible resin layer (20) and an adhesive resin layer (30) in this order, and a first semiconductor component (60) adhered to the adhesive resin layer (30) and having a first terminal (65); (B) a step of performing solder reflow processing on the first structure (100) in a state where the first semiconductor component (60) is adhered to the adhesive resin layer (30); and (C) a step of, after the step (B), peeling the heat-resistant resin layer (10) from the adhesive laminate film (50).