An orange-colored adhesive tape (1) a cable-wrapping tape, including a colored textile substrate (4, 4a, 4b) and an adhesive layer (5, 5a, 5b) applied at least to one side of the substrate (4, 4a, 4b). The substrate (4, 4a, 4b) contains at least one red and at least one further colorant. In order to improve colored tapes of the above-mentioned type, in particular providing increased temperature stability, while maintaining advantageous usage properties, at least one of the colorants contains a disazo compound or is completely formed therefrom. A method and a substrate (4, 4a, 4b) for manufacturing the adhesive tape (1) as well as a cable harness (3) with the adhesive tape (1) are also described.

A method for manufacturing electronic apparatus includes: a step (A) of preparing a structure provided with an adhesive film and at least one electronic component affixed to an adhesive surface of the adhesive film; a step (B) of disposing the structure in an electronic component testing apparatus such that the electronic component is positioned over an electronic component installation region of a sample stand with the adhesive film interposed between the electronic component and the electronic component installation region, the electronic component testing apparatus being provided with a probe card at a position facing the sample stand and includes a probe terminal; a step (C) of evaluating the properties of the electronic component while being affixed to the adhesive film with the probe terminal being in contact with a terminal of the electronic component; and a subsequent step (D) of picking up the electronic component from the adhesive film.

The present invention relates to the use, as water vapour barrier, of a film, of a textile or of a layer of material P, said material P comprising, or even consisting of, at least one copolymer A which is a polyamide of PAXY/XAIS M.sup.n+.sub.1/n type or of PAZ/XAISM.sup.n+.sub.1/n type. It also relates to a construction element comprising a film, a textile or a layer of said material P and a construction material.

The invention relates to a pressure-sensitive adhesive strip composed of three layers, comprising an inner layer F composed of a nonextensible film carrier, a layer SK1 composed of a self-adhesive composition arranged on one of the surfaces of the film carrier layer F and based on a foamed acrylate composition, a layer SK2 composed of a self-adhesive composition arranged on the opposite surface of the film carrier layer F from layer SK1 and based on a foamed acrylate composition.

A method for manufacturing a semiconductor device according to the present invention includes at least the following three steps: (A) a step of preparing a first structure (100) including an adhesive laminate film (50) having a heat-resistant resin layer (10), a flexible resin layer (20) and an adhesive resin layer (30) in this order, and a first semiconductor component (60) adhered to the adhesive resin layer (30) and having a first terminal (65); (B) a step of performing solder reflow processing on the first structure (100) in a state where the first semiconductor component (60) is adhered to the adhesive resin layer (30); and (C) a step of, after the step (B), peeling the heat-resistant resin layer (10) from the adhesive laminate film (50).

Barrier adhesive compositions include at least one polyisobutylene-containing polymer and a curable silsesquioxane additive. The curable silsesquioxane additive may contain free radically polymerizable groups. Barrier film articles include the barrier adhesive compositions and a film. The barrier film articles can be used to encapsulate organic electronic devices.

Laminate film structures including an adhesive layer having gas and moisture barrier properties are disclosed. The disclosed laminate film structures comprise films bonded together with an adhesive composition, the adhesive composition having barrier properties, e.g., controlling oxygen and/or water vapor transmission rates. The disclosed laminate film structures comprise films made from polymers and/or metallized polymers whereby the weight, thickness, and/or number of film layers has been reduced by using a barrier adhesive in place of a standard adhesive while still achieving similar barrier properties. Methods for forming laminate structures having a desired barrier performance are also disclosed, the methods comprising determining the desired barrier performance of the laminate structure, selecting a barrier adhesive, selecting two or more film layers, including at least a first film layer and a second film layer, applying the barrier adhesive on a surface of the first film layer, and bringing a surface of the second film layer into contact with the barrier adhesive applied on the surface of the first film layer, thereby forming the laminate structure having a desired barrier performance.

A sheath for wrapping an elongated object is formed by an adhesive tape having a base strip having inner and outer faces, a first adhesive on the outer face, an adhesive-free overlay strip adhered to the first adhesive coating so as to leave a first exposed edge band on at least one of two longitudinal edges of the tape, and a second adhesive layer covering only part of an area of the inner face.

A pressure sensitive adhesive composition and a protective film employing the same are provided. The pressure sensitive adhesive composition includes 30-45 parts by weight of a tackifier and 55-70 parts by weight of a polymer. The polymer includes at least one block copolymer. The block copolymer includes a vinyl aromatic block polymerized by a vinyl aromatic monomer and a conjugated diene block polymerized by a conjugated diene monomer. The block copolymer meets one of the following conditions: (1) the content of the vinyl aromatic monomer is from 15 wt % to 25 wt % and the content of the vinyl group of the conjugated diene block is less than or equal to 45 wt % or, (2) the content of the vinyl aromatic monomer is from 10 wt % to 15 wt % and the content of the vinyl group of the conjugated diene block is less than or equal to 45 wt %, or greater than or equal to 60 wt %.

A process for adhesively bonding at least two substrates includes the application to the at least two substrates of an uncured adhesive formulation. The uncured adhesive formulation includes at least two curable resin components of epoxy novolac resin, bisphenol A-epichlorohydrin epoxy, or 4,4-Isopropylidenediphenol, oligomeric reaction products with 1-chloro-2,3-epoxypropane in a total amount of at least 60 total weight percent. An epoxy curing agent is also present in the formulation. The uncured adhesive formulation cures at an elevated onset temperature of at least 140 C. to adhesively bonding the at least two substrates. The adhesive formulation is also provided with a cure accelerator. An assembly is provided that includes a first substrate of nylon or carbon fiber filled polymer and a second substrate of nylon or carbon fiber filled polymer. A layer of the cured adhesive formulation is present in simultaneous contact with the first substrate and the second substrate.