A mixed binder which includes a polyacrylic acid and a polyimide. The mixed binder is configured to bind an anode and a current collector in an electrode. The mixed binder is also configured to come into contact with an electrolyte solution in the electrode.

A mixed binder which includes a polyacrylic acid and a polyimide. The mixed binder is configured to bind an anode and a current collector in an electrode. The mixed binder is also configured to come into contact with an electrolyte solution in the electrode.

A means that exhibits excellent heat resistance and mounting reliability when bonding a power semiconductor device on to a metal lead frame, which is also lead-free and places little burden on the environment. Specifically, an electrically conductive adhesive film, which includes metal particles, a thermosetting resin, and a compound having Lewis acidity or a thermal acid generator, wherein the compound having Lewis acidity or thermal acid generator is selected from: boron fluoride or a complex thereof, a protonic acid with a pKa value of 0.4 or lower, or a salt or acid obtained by combining an anion that is the same as the salt thereof with hydrogen ion or any other cation. Further, a dicing die bonding film that is obtained by bonding the electrically conductive adhesive film with a pressure-sensitive adhesive tape.

The present invention provides a laminate film for temporary bonding which is excellent in heat resistance, capable of providing a flat film even at the periphery of a substrate, and capable of making a semiconductor circuit formation substrate and a support substrate or a support film layer adhere to each other with one type of adhesive, and which can be peeled off at room temperature under mild conditions. The present invention provides a laminate film for temporary bonding, including at least three layers of (A) a protective film layer, (B) an adhesive layer, and (C) a support film layer, wherein the adhesive layer (B) contains at least a siloxane polymer represented by a specific general formula or a compound represented by a specific general formula.

The present invention provides a laminate film for temporary bonding which is excellent in heat resistance, capable of providing a flat film even at the periphery of a substrate, and capable of making a semiconductor circuit formation substrate and a support substrate or a support film layer adhere to each other with one type of adhesive, and which can be peeled off at room temperature under mild conditions. The present invention provides a laminate film for temporary bonding, including at least three layers of (A) a protective film layer, (B) an adhesive layer, and (C) a support film layer, wherein the adhesive layer (B) contains at least a siloxane polymer represented by a specific general formula or a compound represented by a specific general formula.

The present invention relates to a method for preparing a patterned polyimide coverlay on a substrate. The method includes: providing a polyimide dry film including a carrier and a non-photosensitive polyimide layer on the carrier, the non-photosensitive polyimide layer containing (i) a polyimide precursor or soluble polyimide and (ii) a solvent; forming a predetermined pattern in the polyimide dry film; laminating the patterned polyimide dry film onto a substrate in such a manner that the non-photosensitive polyimide layer faces the substrate; and forming a patterned polyimide coverlay by heating.

A polymer, resin composition containing the same, and a molded body thereof, having excellent heat resistance and dielectric properties, capable of being dissolved in an organic solvent at a high concentration, and having excellent compatibility with other thermoplastic resins and thermosetting resins, which polymer has a repeating unit derived from a polymerizable compound of formula (I) and a repeating unit derived from a polymerizable compound of formula (II)

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A method for manufacturing a vaporizer device for an inhaler, preferably for an electronic cigarette product, comprising at least one electric vaporizer, at least one electrical line for supplying the vaporizer with electric current, and a carrier for supporting the vaporizer, comprising the application of an electrically conductive adhesive between the vaporizer and the carrier to form an electrical connection of the vaporizer to the electrical line, wherein an additional heating step is carried out to form a eutectic connection between the vaporizer and the adhesive.

The present invention provides a resin composition, a polyimide preparation method and related products. The resin composition consists of the following components: polyimide which is a soluble product generated by a reaction of monomer groups containing aromatic tetracarboxylic dianhydride and diacid dihydrazide, a main chain of the polyimide containing a hydrazide structure; and a curing agent which comprises one or more of multifunctional epoxy resin, a primary amine compound with three or more functional groups, and polyisocyanate, wherein a mass ratio of the curing agent to the soluble polyimide is 0-20%. The resin composition in the present invention utilizes the hydrazide structure in the polyimide to prepare an adhesive with excellent heat resistance, adhesive performance, and solubility, overcoming the shortcomings of existing polyimide-based adhesives during processing or application.

The present invention provides a thermosetting resin composition characterized by comprising a bismaleimide compound and a triazine compound having a diaminotriazine structure.