Provided herein are multilayer articles comprising at least one underfill film layer. In certain aspects, there are also provided methods for improving the worklife stability of such articles. In certain aspects, there are also provided methods for improving the storage stability of such articles. In certain aspects, there are also provided methods for making such articles. In certain aspects, there are also provided stabilized articles produced by the methods described herein.

Provided herein are multilayer articles comprising at least one underfill film layer. In certain aspects, there are also provided methods for improving the worklife stability of such articles. In certain aspects, there are also provided methods for improving the storage stability of such articles. In certain aspects, there are also provided methods for making such articles. In certain aspects, there are also provided stabilized articles produced by the methods described herein.

Provided is a thermosetting resin composition that can satisfy both low transmission loss and radiation performance even under the same curing conditions as those for conventional substrate materials for high-frequency applications, and also provided are an adhesive sheet, a prepreg, and a laminate.

The thermosetting resin composition comprises a maleimide compound having at least two maleimide groups per molecule, a polyphenylene ether compound having at least two reactive organic groups per molecule, a curing accelerator, and an inorganic filler, wherein the inorganic filler is low-sodium aluminum oxide, and the low-sodium aluminum oxide has an Na.sup.+ ion content of 10 ppm or less.

The present invention provides a polyimide film in which a parameter A for the relationship of the viscosity (V) of a polyamic acid solution, the number average molecular weight (Mn) of polyamic acid, and the thickness (T) of a polyimide film falls within a range from 0.4 to 1.13.

The present invention relates to an adhesive composition, which comprises an epoxy resin; and a polyimide comprising a repeating unit. The repeating unit comprises a first repeating unit represented by formula (1) and a second repeating unit represented by formula (2):

##STR00001## wherein X.sup.1, Y, Z, m, and n are as defined herein, the weight ratio of polyimide to the total amount of the epoxy resin is 50% to 100%, and in the epoxy resin, the proportion of the epoxy resin having a weight average molecular weight of less than 400 Da accounts for 12 to 40% by weight of the total amount of the epoxy resin.

The adhesive formed by the adhesive composition of the present invention has a relatively high glass transition temperature.

A first substrate, bonded to a second substrate by a material, is provided. The first substrate is transparent to at least some wavelengths of electromagnetic radiation. The first substrate is irradiated with the electromagnetic radiation to which the first substrate is transparent, such that the electromagnetic radiation impinges on the material causing a decomposition thereof at a location at an interface between the first substrate and the material. The decomposition results in, at the location, an interface of the first substrate and an atmosphere of the decomposition. The atmosphere of the decomposition has an optical property resulting in ceasing the decomposition of the material.

According to embodiments, a method for manufacturing an optical module may include: applying a polyamic acid solution to an upper surface of a substrate structure to form an adhesive layer; forming an active functional group on an upper surface of the adhesive layer; applying a polyamic acid solution to a first surface of a prism to form a prism adhesive layer; forming a polyamic acid layer on at least one of a planarized upper surface of the adhesive layer and a lower surface of the prism adhesive layer; disposing the prism on the substrate structure such that the polyamic acid layer contacts the adhesive layer and the prism adhesive layer; and applying pressure to the prism and the substrate structure to bond the adhesive layer to the prism adhesive layer.

A method for temporary bonding workpiece includes steps as follows. A combining step is performed, wherein an adhesive layer is formed on a surface of at least one substrate and/or at least one workpiece. A bonding step is performed, wherein the substrate and the workpiece are bonded by the adhesive layer. A processing step is performed, wherein the workpiece is processed. A debonding step is performed, wherein the adhesive layer is irradiated with a laser so as to separate the workpiece from the substrate. The adhesive layer is formed by an adhesive, the adhesive includes a polymer and a light absorbing material, a content of the polymer in a solid content of the adhesive is in a range of 50 wt % to 98 wt %, a content of the light absorbing material in the solid content of the adhesive is in a range of 2 wt % to 50 wt %.

This invention relates to a thioxanthone derivative photoinitiator, a radiation curable composition comprising the same and the use thereof. In particular, the invention relates to thioxanthone derivative photoinitiator suitable to be in one drop filling process for manufacturing liquid crystal display device without the concern of liquid crystal contamination.

A compound and method of use thereof consisting of an A-staged thermoplastic-polyimide (TPI) adhesive, a viscous uncured liquid of polyamic-acid polymer (PAA), the TPI precursor, synthesized and dissolved in a polar aprotic organic solvent, and including, as appropriate, combinations of flat particulate inorganic ceramic and/or metallic electrically insulating, and/or electrically conducting, and/or thermally conducting fillers for interface-bonding to create a robust joint between surfaces with conventional lamination processes that utilize relatively moderate temperatures and applied pressures, such particles resulting in the reduction of the occurrence and size of gas voids within the adhesive bondline.