A silsesquixane polymer, a composition including such silsesquixane polymer, and an article including such polymer or composition, wherein the composition includes a silsesquioxane polymer and a free siloxane; wherein the silsesquioxane polymer includes a three-dimensional network of Formula (I): wherein: each R.sup.1 and R.sup.2 is independently a (C1-C4)alkyl; each L.sup.1 is independently a single bond, an alkylene, or an alkylene bonded to a group selected from oxy, thio, carbonyl, NH, and combinations thereof; each R.sup.3 is independently a linear (C14-C100)alkyl; with the proviso that L.sup.1 is selected such that each Si atom is directly bonded to an alkylene or an alkyl; m is an integer of at least 2; n is an integer of at least 1; m+n is an integer of at least 10; each oxygen atom at an asterisk (*) is bonded to another Si atom within the three-dimensional network; and the silsesquioxane polymer is a solid at 25 C.

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The present invention aims to provide a low refractive index layer-containing pressure-sensitive adhesive/adhesive sheet which is thin and has a low refractive index. In order to achieve the above object, the present invention provides a low refractive index layer-containing pressure-sensitive adhesive/adhesive sheet, the sheet including: a first pressure-sensitive adhesive/adhesive layer; a low refractive index layer; and a second pressure-sensitive adhesive/adhesive layer, the first pressure-sensitive adhesive/adhesive layer, the low refractive index layer, and the second pressure-sensitive adhesive/adhesive layer being laminated in this order, wherein the low refractive index layer has a refractive index of 1.25 or less.

Silicone-based elastomeric materials, articles containing the silicone-based elastomeric materials, reaction mixtures used to form the silicone-based elastomeric materials, and methods of making the silicone-based elastomeric materials are described. The silicone-based elastomeric materials are prepared by polymerizing silicone compounds having at least two ethylenically unsaturated groups in the presence of actinic radiation and a controlled radical initiator. The controlled radical initiators are bis-dithiocarbamate or bis-dithiocarbonate compounds having a single carbon between the two dithiocarbamate or dithiocarbonate groups. The silicone-based elastomeric materials typically have improved mechanical properties compared to silicone-based elastomeric materials formed by free radical polymerization reactions in the presence of conventional photoinitiators.

Provided are adhesive articles and related methods that use a foam layer including an acrylic polymer or silicone polymer and having a pair of opposing major surfaces. An adhesive surface is disposed on each of the opposing major surfaces and a plurality of channels extend across at least one adhesive surface. The adhesive surface defining the channels contains a pressure-sensitive adhesive having a rheology enabling the plurality of channels to essentially disappear over time when the adhesive article is compressed. Advantageously, the provided articles and methods enable high immediate bond and handling strength, a high degree of wet out, weatherability, and superior aesthetics when used with transparent or translucent substrates.

A highly dielectric elastic structure contains a highly dielectric elastic body containing a polymer matrix and a dielectric material dispersed in the polymer matrix; and a stretchable adhesive electrode disposed on the highly dielectric elastic body, wherein the stretchable adhesive electrode contains a polymer adhesive containing a curable polymer and a curing agent; and a conductive filler containing a metal and a carbonaceous material dispersed in the polymer adhesive. The highly dielectric elastic structure of the present disclosure provides the effects of increasing dielectric constant through composition of a polymer dielectric and a dielectric material, improving dielectric properties by forming a stretchable conductive adhesive on the composite material as an electrode and exhibiting stable dielectric properties by improving mechanical stability.

Provided is an adhesive member including: a base material having an uneven shape on at least one surface; and a surface layer covering at least a portion of the surface having the uneven shape on the base material.

A conductive polymer composite for adhesion to a flexible substrate contains a polymer adhesive containing a curable polymer and a curing agent; and a conductive filler containing a metal and a carbonaceous material dispersed in the polymer adhesive. The conductive polymer composite is suitable for application to not only the human body but also other objects having irregular surface. In addition, due to enhanced adhesive strength of the conductive polymer composite to the flexible substrate, the reduction in conductivity or conductivity breakdown caused by external stress can be prevented and flexibility and stretchability can be improved.

A heat conductive sheet of the present invention is a heat conductive sheet containing a curing reaction catalyst, wherein a heat conductive uncured composition 2 not containing a curing reaction catalyst is joined to at least one principal surface of the heat conductive sheet 1 containing a curing reaction catalyst. The heat conductive sheet 1 containing a curing reaction catalyst contains the curing reaction catalyst in an amount necessary to cure the heat conductive uncured composition. A mounting method of the present invention includes: joining a heat conductive uncured composition 2 not containing a curing reaction catalyst to at least one principal surface of the heat conductive sheet 1 containing a curing reaction catalyst, and curing the heat conductive uncured composition by diffusion of the curing reaction catalyst contained in the heat conductive sheet 1. Thereby, the heat conductive uncured composition can be joined to the heat conductive sheet immediately before mounting to an electronic component or the like, easily follow the unevenness of a heat generating part and/or heat dissipating part, and cure after mounting.

A heat conductive sheet of the present invention is a heat conductive sheet containing a curing reaction catalyst, wherein a heat conductive uncured composition 2 not containing a curing reaction catalyst is joined to at least one principal surface of the heat conductive sheet 1 containing a curing reaction catalyst. The heat conductive sheet 1 containing a curing reaction catalyst contains the curing reaction catalyst in an amount necessary to cure the heat conductive uncured composition. A mounting method of the present invention includes: joining a heat conductive uncured composition 2 not containing a curing reaction catalyst to at least one principal surface of the heat conductive sheet 1 containing a curing reaction catalyst, and curing the heat conductive uncured composition by diffusion of the curing reaction catalyst contained in the heat conductive sheet 1. Thereby, the heat conductive uncured composition can be joined to the heat conductive sheet immediately before mounting to an electronic component or the like, easily follow the unevenness of a heat generating part and/or heat dissipating part, and cure after mounting.

Curable epoxy/thiol resin compositions, methods of curing, methods of bonding substrates, and tapes including the cured polymeric material, wherein the curable epoxy/thiol resin composition includes: an epoxy resin component comprising an epoxy resin having at least two epoxide groups per molecule; a thiol component comprising a polythiol compound having at least two primary thiol groups; a silane-functionalized adhesion promoter; a nitrogen-containing catalyst for curing the epoxy resin; and optionally a cure inhibitor.