Disclosed is a pad structure for transferring a flat panel that includes a circular adhesive force adjustment pattern having a predetermined diameter in the center of the pad body, and a ring-shaped microciliated member having a circumferential surface surrounding the first adhesive force adjustment pattern and including a plurality of cilia spaced apart from one another, and thus provides advantages of improving the adhesive force per unit area due to the functions of the pad, without a separate vacuum device, of being easily and simply attached to and detached from the blade at a desired position thereon, and of maximizing productivity by easily and smoothly performing quality control, preventive maintenance, and inventory management of the pad for transferring a flat panel based on serial number standardization (product information standardization).

There is provided a weather proof pressure sensitive adhesive tape composition having 15 years or more dwell time in ambient conditions, comprising ambient humidity in the range of RH 30% to 100% RH including aggressive under water conditions, ambient pressures in the range of 0.75 bar to 1.5 bar at normal temperature, ambient temperature in the range of (−) 30° C. to 75° C. at normal pressure, ambient acidity and alkalinity in the range of pH 4.5 to pH 10.5 in water, ambient salinity of water in under water conditions of up to 1.2 mole equivalent of sodium chloride and ambient surface fluid resistance of up to 2.7×10−3 cubic meter per second per meter contact edge of the tape.

A silicone pressure sensitive adhesive is prepared by curing a radical reaction curable composition. The silicone pressure sensitive adhesive adheres to various silicone elastomers and is useful in preparation of components of flexible display devices.

A self-adhesive vapor-permeable membrane for use on a building, comprising a support that is permeable to air and water vapor, and a pressure-sensitive adhesive layer that is permeable to air and water vapor, and is secured to the underside of the support, wherein the membrane is noteworthy in that it comprises gas bubbles trapped between the support and the adhesive layer.

The present disclosure provides a dust-purifying adhesive layer, a dust-purifying film, and a dust-purifying film sleeve. The dust-purifying adhesive layer comprises a substrate layer, an optically clear adhesive (OCA)layer, and a dust-purifying layer, the dust-purifying layer and the OCA layer respectively disposed on two sides of the substrate layer, wherein the dust-purifying layer is adapted for dust-purifying and air bubbles elimination. Compared with the prior art, the dust-purifying adhesive layer comprises a dust-purifying layer having functions of dust-purifying function and anti-foaming and when the dust-purifying film is arranged on the screen of the electronic device, the dust-purifying layer is in direct contact with the screen, and during the film-pasting process, air bubbles can be quickly eliminated, so that no air bubbles are generated during the film-pasting process.

A ceramifiable composition comprises a crosslinked silicone matrix retaining stabilizing components. The stabilizing components comprise subcomponents: a) at least one of an aluminosilicate clay, aluminum oxide, or a hydrate thereof; b) at least one of phosphorus pentoxide, a polyphosphate, an inorganic phosphate salt, boron oxide, boric acid or a salt thereof; and c) at least one of an alkaline earth oxide, alkaline earth carbonate, or a hydrate thereof, and wherein heating the ceramifiable composition to a temperature between 600 and 1600 degrees Celsius, inclusive, results in a ceramified composition. An article including a layer of the ceramifiable composition and a method of making the same are also disclosed.

Anti-icing stacks for protecting an aerodynamic surface are described. In some embodiments, an anti-icing stack includes an anti-icing layer, an elastomeric erosion protection layer, and an additional layer. The erosion protection layer is disposed between the anti-icing layer and the additional layer. The additional layer has a thickness greater than the thickness of the erosion protection layer and a tensile modulus of no more than the tensile modulus of the erosion protection layer. The additional layer may be a foam adhesive layer.

Anti-icing stacks for protecting an aerodynamic surface are described. In some embodiments, an anti-icing stack includes an anti-icing layer, an elastomeric erosion protection layer, and an additional layer. The erosion protection layer is disposed between the anti-icing layer and the additional layer. The additional layer has a thickness greater than the thickness of the erosion protection layer and a tensile modulus of no more than the tensile modulus of the erosion protection layer. The additional layer may be a foam adhesive layer.

A heat conductive sheet of the present invention is a heat conductive sheet containing a curing reaction catalyst, wherein a heat conductive uncured composition 2 not containing a curing reaction catalyst is joined to at least one principal surface of the heat conductive sheet 1 containing a curing reaction catalyst. The heat conductive sheet 1 containing a curing reaction catalyst contains the curing reaction catalyst in an amount necessary to cure the heat conductive uncured composition. A mounting method of the present invention includes: joining a heat conductive uncured composition 2 not containing a curing reaction catalyst to at least one principal surface of the heat conductive sheet 1 containing a curing reaction catalyst, and curing the heat conductive uncured composition by diffusion of the curing reaction catalyst contained in the heat conductive sheet 1. Thereby, the heat conductive uncured composition can be joined to the heat conductive sheet immediately before mounting to an electronic component or the like, easily follow the unevenness of a heat generating part and/or heat dissipating part, and cure after mounting.

A heat conductive sheet of the present invention is a heat conductive sheet containing a curing reaction catalyst, wherein a heat conductive uncured composition 2 not containing a curing reaction catalyst is joined to at least one principal surface of the heat conductive sheet 1 containing a curing reaction catalyst. The heat conductive sheet 1 containing a curing reaction catalyst contains the curing reaction catalyst in an amount necessary to cure the heat conductive uncured composition. A mounting method of the present invention includes: joining a heat conductive uncured composition 2 not containing a curing reaction catalyst to at least one principal surface of the heat conductive sheet 1 containing a curing reaction catalyst, and curing the heat conductive uncured composition by diffusion of the curing reaction catalyst contained in the heat conductive sheet 1. Thereby, the heat conductive uncured composition can be joined to the heat conductive sheet immediately before mounting to an electronic component or the like, easily follow the unevenness of a heat generating part and/or heat dissipating part, and cure after mounting.