Patent classifications
C09K3/10
SEMICONDUCTOR PRODUCTION DEVICE SEALING MATERIAL
A seal material for a semiconductor manufacturing device is made of a rubber composition containing fluororubber and phenol resin powder. The content of the phenol resin powder is 1 part by mass or more and 50 parts by mass or less with respect to 100 parts by mass of the fluororubber. The average particle size of the phenol resin powder is 1 μm or more and 20 μm or less.
SEMICONDUCTOR PRODUCTION DEVICE SEALING MATERIAL
A seal material for a semiconductor manufacturing device is made of a rubber composition containing fluororubber and phenol resin powder. The content of the phenol resin powder is 1 part by mass or more and 50 parts by mass or less with respect to 100 parts by mass of the fluororubber. The average particle size of the phenol resin powder is 1 μm or more and 20 μm or less.
ORGANOPOLYSILOXANE COMPOUND AND PRODUCTION METHOD THEREOF, AND COMPOSITION CONTAINING SAID COMPOUND
Provided is an organopolysiloxane compound acting as a chain extender for use in a room-temperature-vulcanizing (RTV) composition of a dealcoholization type that can be rapidly turned into a rubber and then exhibit a rubber elasticity. The organopolysiloxane compound is represented by the following general formula (1), and also provided is a composition containing this compound and a linear diorganopolysiloxane with both molecular chain ends being blocked by a silanol group or a hydrolyzable silyl group,
##STR00001##
wherein each of R.sup.1, R.sup.2, R.sup.3 and R.sup.4 independently represents a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, or a substituted or unsubstituted aryl group having 6 to 10 carbon atoms; and n is a number of 0 to 10.
SEALANT COMPOSITION
Provided is a sealant composition that makes it possible to suppress a flow of a sealant associated with travel while maintaining good sealing properties. As a sealant composition constituting a sealant layer (10) disposed on the inner surface of a pneumatic tire, the following are used: a sealant composition demonstrating a tensile stress at 20% elongation at 23° C. of 0.03 MPa or less and a tensile stress at 20% elongation at 80° C. of 0.002 MPa; or a sealant composition demonstrating a viscosity V.sub.0 at 0° C. of from 2 kPa.Math.s to 15 kPa s, a viscosity V.sub.40 at 40° C. of from 1 kPa s to 14 kPa s, and a viscosity V.sub.80 at 80° C. of from 0.5 kPa.Math.s to 12 kPa.Math.s.
RESIN COMPOSITION FOR SEALANT, MULTILAYERED BODY, PACKAGING MATERIAL AND PACKAGING CONTAINER
A resin composition for a sealant, comprising an ethylene/polar monomer copolymer (A), an adhesion-imparting resin (B) and a 4-methyl-1-pentene/α-olefin copolymer (C), a content of the 4-methyl-1-pentene/α-olefin copolymer (C) being from 1% by mass to 20% by mass with respect to a total mass of the resin composition for a sealant.
RESIN COMPOSITION FOR SEALANT, MULTILAYERED BODY, PACKAGING MATERIAL AND PACKAGING CONTAINER
A resin composition for a sealant, comprising an ethylene/polar monomer copolymer (A), an adhesion-imparting resin (B) and a 4-methyl-1-pentene/α-olefin copolymer (C), a content of the 4-methyl-1-pentene/α-olefin copolymer (C) being from 1% by mass to 20% by mass with respect to a total mass of the resin composition for a sealant.
SEALANT MATERIAL
A sealant material for sealing joints between male and female mating parts comprising: (a) an elongate flexible thread suitable for wrapping around at least one of the parts, and (b) a joint sealing composition comprising an anaerobically curable composition in solid form,
the flexible thread being coated with the anaerobically curable composition. This provides a reactive composition on the thread for sealing joints.
AMINIMIDE COMPOUND, AMINIMIDE COMPOSITION, CURING AGENT, EPOXY RESIN COMPOSITION, METHOD FOR PRODUCING AMINIMIDE COMPOUND, ENCAPSULANT, AND ADHESIVE
Provided is an aminimide compound that is excellent in penetration and has excellent curability and storage stability. An aminimide compound represented by the following formula (1), (2) or (3):
##STR00001##
wherein each R.sub.1 independently represents a hydrogen atom, or a monovalent or n-valent organic group having 1 to 15 carbon atoms and optionally having a hydroxy group, a carbonyl group, an ester bond, or an ether bond; R.sub.2 and R.sub.3 each independently represent an unsubstituted or substituted alkyl group having 1 to 12 carbon atoms, aryl group, aralkyl group, or heterocyclic ring having 7 or less carbon atoms in which R.sub.2 and R.sub.3 are linked to each other; each R.sub.4 independently represents a hydrogen atom, or a monovalent or n-valent organic group having 1 to 30 carbon atoms and optionally containing an oxygen atom; and n represents an integer of 1 to 3.
Silane modified polymers with improved properties
The disclosure relates to moisture curable compositions based on a combination of silane-modified polymer and silane functional additive, their manufacture and use. The silane functional additive is preferably prepared from a water miscible polyol having a functionality of about 2 to about 4 and/or a polyol having a tertiary nitrogen atom in the backbone and a functionality equal or greater than about 2.
Silane modified polymers with improved properties
The disclosure relates to moisture curable compositions based on a combination of silane-modified polymer and silane functional additive, their manufacture and use. The silane functional additive is preferably prepared from a water miscible polyol having a functionality of about 2 to about 4 and/or a polyol having a tertiary nitrogen atom in the backbone and a functionality equal or greater than about 2.