Patent classifications
C09K5/02
Heat transfer fluid and process for preparing same
A heat transfer fluid comprising about 20 to about 80% by weight terphenyls and from about 20 to about 80% by weight partially hydrogenated terphenyls, wherein preferably the terphenyls and partially hydrogenated terphenyls comprise a reclaimed product from a degraded heat transfer fluid initially comprised primarily of partially hydrogenated terphenyls.
Heat transfer fluid and process for preparing same
A heat transfer fluid comprising about 20 to about 80% by weight terphenyls and from about 20 to about 80% by weight partially hydrogenated terphenyls, wherein preferably the terphenyls and partially hydrogenated terphenyls comprise a reclaimed product from a degraded heat transfer fluid initially comprised primarily of partially hydrogenated terphenyls.
Internal combustion engine
The waste heat recovery and dissipation apparatus incorporates a heat storage/dissipation material containing a new titanium oxide. When a pressure received by the heat storage/dissipation material from a coolant flowing through a flow channel is increased to a predetermined pressure PHR (about 60 MPa) or higher in a state where the crystal structure of the new titanium oxide is a -phase, the heat stored in the heat storage/dissipation material is released to the coolant. When a temperature of the heat storage/dissipation material is increased to a predetermined temperature THS (about 460 K) or higher by the heat of exhaust gas flowing a gas flow channel in a state where the crystal structure of the new titanium oxide is -phase, the heat of the exhaust gas is stored in the heat storage/dissipation material.
Internal combustion engine
The waste heat recovery and dissipation apparatus incorporates a heat storage/dissipation material containing a new titanium oxide. When a pressure received by the heat storage/dissipation material from a coolant flowing through a flow channel is increased to a predetermined pressure PHR (about 60 MPa) or higher in a state where the crystal structure of the new titanium oxide is a -phase, the heat stored in the heat storage/dissipation material is released to the coolant. When a temperature of the heat storage/dissipation material is increased to a predetermined temperature THS (about 460 K) or higher by the heat of exhaust gas flowing a gas flow channel in a state where the crystal structure of the new titanium oxide is -phase, the heat of the exhaust gas is stored in the heat storage/dissipation material.
HEAT STORAGE PARTICLE, COMPOSITION FOR THERMOSTATIC DEVICE, AND THERMOSTATIC DEVICE
A heat storage particle that includes a ceramic particle containing a vanadium oxide as a main component thereof, and a metal film covering the ceramic particle.
Thermal compensation layers with core-shell phase change particles and power electronics assemblies incorporating the same
A thermal compensation layer includes a metal inverse opal (MIO) layer that includes a plurality of core-shell phase change (PC) particles encapsulated within a metal of the MIO layer. Each of the core-shell PC particles includes a core that includes a PCM having a PC temperature in a range of from 100? C. to 250? C., and a shell that includes a shell material having a melt temperature greater than the PC temperature of the PCM. A power electronics assembly includes a substrate having a thermal compensation layer formed proximate a surface of the substrate, the thermal compensation layer comprising an MIO layer that includes a plurality of core-shell PC particles encapsulated within a metal of the MIO layer. The power electronics assembly further includes an electronic device bonded to the thermal compensation layer at a first surface of the electronic device.
Thermal compensation layers with core-shell phase change particles and power electronics assemblies incorporating the same
A thermal compensation layer includes a metal inverse opal (MIO) layer that includes a plurality of core-shell phase change (PC) particles encapsulated within a metal of the MIO layer. Each of the core-shell PC particles includes a core that includes a PCM having a PC temperature in a range of from 100? C. to 250? C., and a shell that includes a shell material having a melt temperature greater than the PC temperature of the PCM. A power electronics assembly includes a substrate having a thermal compensation layer formed proximate a surface of the substrate, the thermal compensation layer comprising an MIO layer that includes a plurality of core-shell PC particles encapsulated within a metal of the MIO layer. The power electronics assembly further includes an electronic device bonded to the thermal compensation layer at a first surface of the electronic device.
LIQUID-LIQUID PHASE TRANSITION COMPOSITIONS AND PROCESSES
The present application pertains to liquid-liquid phase transition compositions and processes. In one embodiment a liquid-liquid phase transition process comprises first forming a composition comprising a glycol polymer and water and then phase transitioning the composition at or above the composition's cloud point temperature to form at least two liquid phases. The enthalpy of liquid-liquid phase transition may be greater than 5 kJ per kg as measured by a calorimeter and each liquid phase may have unique and advantageous properties. In another embodiment the application pertains to compositions suitable for liquid-liquid phase transition compositions.
LIQUID-LIQUID PHASE TRANSITION COMPOSITIONS AND PROCESSES
The present application pertains to liquid-liquid phase transition compositions and processes. In one embodiment a liquid-liquid phase transition process comprises first forming a composition comprising a glycol polymer and water and then phase transitioning the composition at or above the composition's cloud point temperature to form at least two liquid phases. The enthalpy of liquid-liquid phase transition may be greater than 5 kJ per kg as measured by a calorimeter and each liquid phase may have unique and advantageous properties. In another embodiment the application pertains to compositions suitable for liquid-liquid phase transition compositions.
THERMAL INTERFACE MATERIALS INCLUDING POLYMERIC PHASE-CHANGE MATERIALS
In an embodiment, an article of manufacture includes a first component, a second component, and a thermal interface material. The thermal interface material is disposed between the first component and the second component and includes a polymeric phase-change material. In another embodiment, an article of manufacture includes a first component, a second component, and a thermal interface material disposed between the first component and the second component, the thermal interface material including a polymeric phase-change material, the polymeric phase-change material including a block copolymer formed from a diene, the diene formed from a vinyl-terminated fatty acid monomer having a chemical formula C.sub.2H.sub.4RC(O)OH and an ethylene glycol monomer having a chemical formula C.sub.2nH.sub.4n+2O.sub.n+1.