Patent classifications
C09K5/02
BATTERY AND ELECTRIC APPARATUS
A battery, including an adhesive, where the adhesive is provided between a packaging bag and the battery cell, and the adhesive is adhered to an outer surface of the battery cell. The adhesive includes an adhesive layer, where the adhesive layer includes an adhesive material and a heat-absorbing material. When the temperature of the battery cell is 130? C., an adhesion force between the adhesive and the outer surface of the battery cell is m, and m satisfies m?3 N. At room temperature (25? C.), the adhesive can be fixed to the outer surface of the battery cell. When the temperature of the battery cell rises, the adhesive can still be adhered to the outer surface of the battery cell, reducing the temperature of the battery cell and increasing the critical temperature for thermal runaway of the battery cell.
COOLING/HEATING METHOD AND DEVICE BASED ON METAL-ORGANIC FRAMEWORKS AND INDUCED BY PRESSURE MODIFICATIONS
A cooling/heating method including the application and removal of a pressurising gas on a hybrid organic-inorganic porous material (MOF) whereby a breathing transition is produced. In this transition, a change in volume in the structure of the compound occurs when its pores open/close, together with adsorption/desorption of a gas after applying and removing a pressurising gas on the compound; and breathing which occurs at temperatures close to ambient temperature (from ?20? C. to 60? C.) and at low pressures (from 10.sup.?5 bar up to 50 bar) and with great isothermal entropy changes (>100 J K.sup.?1 kg.sup.?1). A cooling/heating device comprising the hybrid materials defined above.
COOLING/HEATING METHOD AND DEVICE BASED ON METAL-ORGANIC FRAMEWORKS AND INDUCED BY PRESSURE MODIFICATIONS
A cooling/heating method including the application and removal of a pressurising gas on a hybrid organic-inorganic porous material (MOF) whereby a breathing transition is produced. In this transition, a change in volume in the structure of the compound occurs when its pores open/close, together with adsorption/desorption of a gas after applying and removing a pressurising gas on the compound; and breathing which occurs at temperatures close to ambient temperature (from ?20? C. to 60? C.) and at low pressures (from 10.sup.?5 bar up to 50 bar) and with great isothermal entropy changes (>100 J K.sup.?1 kg.sup.?1). A cooling/heating device comprising the hybrid materials defined above.
Phase Change Materials and Methods of Regulating Temperature
The present invention provides a phase change material composition comprising an ester of a linear alcohol which has at least 4 carbon atoms and a linear carboxylic acid which has at least 4 carbon atoms, wherein the total number of carbon atoms in the ester is in the range from 13 to 31. The invention also provides products including the phase change material composition and methods of regulating temperature.
NOVEL ORGANIC SILICON COMPOUND, SURFACE TREATMENT AGENT CONTAINING SAME, RESIN COMPOSITION CONTAINING SAME, AND GEL OR CURED PRODUCT OF SAME
An organic silicon compound is disclosed which is represented by a formula : (R.sup.1.sub.3SiO).sub.3SiR.sup.2-[SiR.sup.3.sub.2O].sub.y[SiR.sup.3.sub.2].sub.w-R.sup.4-R.sup.5, wherein each of R.sup.1 and R.sup.3 is a group independently selected from the group consisting of alkyl groups, alkenyl groups, aryl groups, aralkyl groups and alkoxy groups having 1 to 20 carbon atoms, R.sup.2 is a divalent hydrocarbon group or an oxygen atom, R.sup.4 is a divalent hydrocarbon group, or a direct bond to a silicon (Si) atom, R.sup.5 is a monovalent group represented by (R.sup.6O).sub.qR.sup.7.sub.(3-q)Si or a monovalent hydrocarbon group having 1 to 20 carbon atoms, and each of R.sup.6 and R.sup.7 is a group independently selected from the group consisting of alkyl groups, alkenyl groups, aryl groups, aralkyl groups and alkoxy groups having 1 to 20 carbon atoms, and q is an integer between 1 and 3, y is an integer between 0 and 200, and w is 0 or 1.
NOVEL ORGANIC SILICON COMPOUND, SURFACE TREATMENT AGENT CONTAINING SAME, RESIN COMPOSITION CONTAINING SAME, AND GEL OR CURED PRODUCT OF SAME
An organic silicon compound is disclosed which is represented by a formula : (R.sup.1.sub.3SiO).sub.3SiR.sup.2-[SiR.sup.3.sub.2O].sub.y[SiR.sup.3.sub.2].sub.w-R.sup.4-R.sup.5, wherein each of R.sup.1 and R.sup.3 is a group independently selected from the group consisting of alkyl groups, alkenyl groups, aryl groups, aralkyl groups and alkoxy groups having 1 to 20 carbon atoms, R.sup.2 is a divalent hydrocarbon group or an oxygen atom, R.sup.4 is a divalent hydrocarbon group, or a direct bond to a silicon (Si) atom, R.sup.5 is a monovalent group represented by (R.sup.6O).sub.qR.sup.7.sub.(3-q)Si or a monovalent hydrocarbon group having 1 to 20 carbon atoms, and each of R.sup.6 and R.sup.7 is a group independently selected from the group consisting of alkyl groups, alkenyl groups, aryl groups, aralkyl groups and alkoxy groups having 1 to 20 carbon atoms, and q is an integer between 1 and 3, y is an integer between 0 and 200, and w is 0 or 1.
Encapsulates
The invention discloses a microencapsulated phase change material having a specific Thermal Efficiency Index (TEI).
TEI=(RT)*(RH)*(RMP)*(RTGA@180)*(RFW)
The problem of achieving effective and efficient microencapsulated phase change material can be solved to yield a commercially useful material having the described combination of physical and chemical characteristics based on the parameters described in the specification. Microcapsules according to the invention are highly effective at delivering enhanced thermal performance as compared to conventional microcapsules
Heat Transfer Fluid and Process for Preparing Same
A heat transfer fluid comprising about 20 to about 80% by weight terphenyls and from about 20 to about 80% by weight partially hydrogenated terphenyls, wherein preferably the terphenyls and partially hydrogenated terphenyls comprise a reclaimed product from a degraded heat transfer fluid initially comprised primarily of partially hydrogenated terphenyls.
Heat storing system
A heat storing system includes: a heat source that emits heat to a first thermal medium; and a heat storing unit. The heat storing unit includes a heat storing body container housing a heat storing body, and a thermal medium container housing a liquid phase thermal medium. The heat storing body stores or emits heat in accordance with phase change of the heat storing body. The heat storing unit is configured to conduct a cold heat emission mode in which the liquid phase thermal medium and a cooling medium exchange heat in the thermal medium container to evaporate the thermal medium such that cold heat is emitted to the cooling medium.
Heat storing system
A heat storing system includes: a heat source that emits heat to a first thermal medium; and a heat storing unit. The heat storing unit includes a heat storing body container housing a heat storing body, and a thermal medium container housing a liquid phase thermal medium. The heat storing body stores or emits heat in accordance with phase change of the heat storing body. The heat storing unit is configured to conduct a cold heat emission mode in which the liquid phase thermal medium and a cooling medium exchange heat in the thermal medium container to evaporate the thermal medium such that cold heat is emitted to the cooling medium.