This thermally conductive silicone composition contains: (A) 100 parts by mass of a diorganopolysiloxane in which both terminals of a molecular chain are blocked with hydroxy groups; (B) 150-600 parts by mass of an organopolysiloxane with a particular structure having at least one hydrolyzable silyl group in one molecule; (C) 0.1-100 parts by mass of a crosslinking agent component; (D) 1,500-6,500 parts by mass of zinc oxide particles which have an average particle diameter of 0.1 μm to 2 μm, and in which the content ratio of a coarse powder having a particle diameter of 10 μm or more in a laser diffraction-type particle size distribution is 1 vol % or less with respect to the total amount of component (D); and (E) 0.01-30 parts by mass of an adhesion promoter, wherein the content of component (D) is 45-70 vol % with respect to the total composition.

This thermally conductive silicone composition has a higher thermal conductivity than the prior art, can be compressed to a thickness of 10 μm or less, and also has high durability.

This thermally conductive silicone composition contains: (A) 100 parts by mass of a diorganopolysiloxane in which both terminals of a molecular chain are blocked with hydroxy groups; (B) 150-600 parts by mass of an organopolysiloxane with a particular structure having at least one hydrolyzable silyl group in one molecule; (C) 0.1-100 parts by mass of a crosslinking agent component; (D) 1,500-6,500 parts by mass of zinc oxide particles which have an average particle diameter of 0.1 μm to 2 μm, and in which the content ratio of a coarse powder having a particle diameter of 10 μm or more in a laser diffraction-type particle size distribution is 1 vol % or less with respect to the total amount of component (D); and (E) 0.01-30 parts by mass of an adhesion promoter, wherein the content of component (D) is 45-70 vol % with respect to the total composition.

This thermally conductive silicone composition has a higher thermal conductivity than the prior art, can be compressed to a thickness of 10 μm or less, and also has high durability.

Nanoporous composite separators are disclosed for use in batteries and capacitors comprising a nanoporous inorganic material and an organic polymer material. The inorganic material may comprise Al.sub.2O.sub.3, AlO(OH) or boehmite, AlN, BN, SiN, ZnO, ZrO.sub.2, SiO.sub.2, or combinations thereof. The nanoporous composite separator may have a porosity of between 35-50%. The average pore size of the nanoporous composite separator may be between 10-90 nm. The separator may be formed by coating a substrate with a dispersion including the inorganic material, organic material, and a solvent. Once dried, the coating may be removed from the substrate, thus forming the nanoporous composite separator. A nanoporous composite separator may provide increased thermal conductivity and dimensional stability at temperatures above 200° C. compared to polyolefin separators.

Nanoporous composite separators are disclosed for use in batteries and capacitors comprising a nanoporous inorganic material and an organic polymer material. The inorganic material may comprise Al.sub.2O.sub.3, AlO(OH) or boehmite, AlN, BN, SiN, ZnO, ZrO.sub.2, SiO.sub.2, or combinations thereof. The nanoporous composite separator may have a porosity of between 35-50%. The average pore size of the nanoporous composite separator may be between 10-90 nm. The separator may be formed by coating a substrate with a dispersion including the inorganic material, organic material, and a solvent. Once dried, the coating may be removed from the substrate, thus forming the nanoporous composite separator. A nanoporous composite separator may provide increased thermal conductivity and dimensional stability at temperatures above 200° C. compared to polyolefin separators.

Provided are a slurry of graphene oxides with different degrees of oxidation, a composite film of graphene oxides, and a graphene heat-conducting film. The slurry of the graphene oxides comprises the graphene oxides and a solvent, and the graphene oxides include a strong graphene oxide and a weak graphene oxide, wherein the slurry comprises two graphene oxides with different degrees of oxidation, which can increase a carbon content in the graphene oxide per unit mass, so that the finally obtained graphene heat-conducting film has more carbon.

The disclosure describes a heat delivery medium and composition for biomedical applications with controlled conversion of energy from an exogenous source to heat.

A rare earth regenerator material particle and a regenerator material particle group having a high long-term reliability, and a superconducting magnet, an examination apparatus, a cryopump and the like using the same are provided. A rare earth regenerator material particle contains a rare earth element as a constituent component, and in the particle, a peak indicating a carbon component is detected in a surface region by an X-ray photoelectron spectroscopy analysis.

A rare earth regenerator material particle and a regenerator material particle group having a high long-term reliability, and a superconducting magnet, an examination apparatus, a cryopump and the like using the same are provided. A rare earth regenerator material particle contains a rare earth element as a constituent component, and in the particle, a peak indicating a carbon component is detected in a surface region by an X-ray photoelectron spectroscopy analysis.

A thermal interface material that is useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material comprises at least one silicone oil, at least one catalyst, at least one thermally conductive filler having a larger surface area, a solvent, at least one inhibitor, and at least one crosslinker. The at least one thermally conductive filler reduces the oil leakage of the TIM, and the solvent increases the flow rate of the TIM without negating the reduction of oil leakage realized by the thermally conductive fillers.

A thermal interface material that is useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material comprises at least one silicone oil, at least one catalyst, at least one thermally conductive filler having a larger surface area, a solvent, at least one inhibitor, and at least one crosslinker. The at least one thermally conductive filler reduces the oil leakage of the TIM, and the solvent increases the flow rate of the TIM without negating the reduction of oil leakage realized by the thermally conductive fillers.