Brominated vinylaromatic-diene block copolymers (Br-SBC) comprising a vinylaromatic polymer block S and a brominated diene polymer block BB, wherein before bromination the weight-average molar mass M.sub.w of the block S is greater than or equal to M.sub.w of the block BB, use thereof as flame retardants, and also polymer compositions comprising these for unfoamed and foamed thermoplastic polymers, for example EPS and XPS.

A fire-retardant polyurethane foam mattress and a method of manufacture thereof are provided. The mattress comprises a polyurethane foam prepared from a composition comprising at least a polyol, an organic polyisocyanate and a fire retardant and is provided with an outer layer encapsulating the polyurethane foam, the outer layer comprising a waterproof membrane of silicone rubber. A fire-resistant barrier layer is disposed substantially between the waterproof membrane and the polyurethane foam.

A fire-retardant polyurethane foam mattress and a method of manufacture thereof are provided. The mattress comprises a polyurethane foam prepared from a composition comprising at least a polyol, an organic polyisocyanate and a fire retardant and is provided with an outer layer encapsulating the polyurethane foam, the outer layer comprising a waterproof membrane of silicone rubber. A fire-resistant barrier layer is disposed substantially between the waterproof membrane and the polyurethane foam.

A triazine ring-containing phenol resin obtained by reacting melamine, para-alkylphenol, and formalin is used to provide an epoxy resin composition capable of providing a cured product with excellent flame retardancy, excellent dielectric characteristics such as a low dielectric tangent and a low dielectric constant, and excellent thermal conductivity, a cured product thereof, and a prepreg, a circuit board, a build-up film, a build-up board, a semiconductor sealing material, a semiconductor device, a fiber reinforced composite material, and a formed article using the epoxy resin composition.

A triazine ring-containing phenol resin obtained by reacting melamine, para-alkylphenol, and formalin is used to provide an epoxy resin composition capable of providing a cured product with excellent flame retardancy, excellent dielectric characteristics such as a low dielectric tangent and a low dielectric constant, and excellent thermal conductivity, a cured product thereof, and a prepreg, a circuit board, a build-up film, a build-up board, a semiconductor sealing material, a semiconductor device, a fiber reinforced composite material, and a formed article using the epoxy resin composition.

A non-aqueous liquid concentrate includes starch, an acrylic acid homopolymer salt, vegetable oil, and clay. The non-aqueous liquid concentrate forms an aqueous dispersion when added to water and is capable of clinging to a surface.

A non-aqueous liquid concentrate includes starch, an acrylic acid homopolymer salt, vegetable oil, and clay. The non-aqueous liquid concentrate forms an aqueous dispersion when added to water and is capable of clinging to a surface.

A hybrid silicone composite for high temperature insulation applications is disclosed. The hybrid silicone composite is formed of a mixture of liquid high consistency silicone rubber and solid high consistency silicone rubber and a thermally decomposable inorganic filler which are compounded together. The compounded material is then injection molded, over molded, compression molded, cast, laminated, extruded, calendered, adhered or dispensed. When the silicone composite is exposed to a high temperature, it forms an inorganic composite and maintains its insulating properties and dimensional stability.

A hybrid silicone composite for high temperature insulation applications is disclosed. The hybrid silicone composite is formed of a mixture of liquid high consistency silicone rubber and solid high consistency silicone rubber and a thermally decomposable inorganic filler which are compounded together. The compounded material is then injection molded, over molded, compression molded, cast, laminated, extruded, calendered, adhered or dispensed. When the silicone composite is exposed to a high temperature, it forms an inorganic composite and maintains its insulating properties and dimensional stability.

An object is to provide a photo-curable composition having high dry etching resistance and high thermal stability. A photo-curable composition includes at least a polymerizable compound (A) and a photopolymerization initiator (B), and further includes at least one of a flame retarder (E) and a flame-retardant polymerizable compound (F).