Cleaning kits for wearable devices that are simple to use, are less likely to damage wearable devices, and are effective at cleaning wearable devices. An example can include a cleaning cloth, a softening solution, a brush, and a soft gel. The cleaning cloth can be a lint-free cloth. The softening solution can be a protein emulsifier. The softening solution can be provided in an ampule or other sealed container. The brush can be formed of an elastomer, such as silicone, to reduce the chance of damage to a wearable device. The brush can have a snowball pattern to further reduce the chance of damage. The soft gel can be a hydrogel solution. The soft gel can be biodegradable and can be provided in a pouch having a tear notch.

A cleaning composition for sanitizing and/or disinfecting hard surfaces, comprising:

a cationic biocide, surfactant and low levels of VOC solvents. The cleaning composition is adapted to clean a variety of hard surfaces without leaving behind a visible residue and creates low levels of streaking and filming on the treated surface. The cleaning composition contains less than 5% by weight of VOCs. The cleaning composition may be used alone as a liquid or spray formulation or in combination with a substrate, for example, a pre-loaded cleaning wipe.

A composition including a plurality of particles, the particles including: about 25% to about 94% by weight a water soluble carrier; about 5% to about 45% by weight a quaternary ammonium compound formed from a parent fatty acid compound having an Iodine Value from about 18 to about 60; and about 0.5% to about 10% by weight a cationic polymer; wherein each of the particles has a mass from about 1 mg to about 1 g.

An improved composition and method of use is provided which is suitable for treating live animal growth facility, meat processing facilities and food processing facilities. The composition comprises 34-99.35 wt % water; 0.1 to 3 wt % hydrophobizing agents; up to 5 wt % antistatic agents; 0.05 to 3 wt % wetting agents; and 0.5 to 55 wt % film forming agent. The composition is applied to surfaces and allowed to dry.

The present disclosure relates to cleaning compositions that are used to clean semiconductor substrates. These cleaning compositions can remove the defects/contaminants arising from previous processing on the semiconductor substrates and thereby make the substrates appropriate for further processing. The cleaning compositions described herein primarily contain at least one pH adjusting agent and at least one biosurfactant.

In a method of cleaning a substrate, a solution including a size-modification material is applied on a substrate, on which particles to be removed are disposed. Size-modified particles having larger size than the particles are generated, from the particles and the size-modification material. The size-modified particles are removed from the substrate.

A cleaning composition comprises at least one surfactant and at least one colorant. The cleaning composition can have a pH of about 3 or less. The colorant exhibits one of several specified structures at a pH of about 7. A method for cleaning a surface utilizes the cleaning composition.

A cleaning composition for sanitizing and/or disinfecting hard surfaces, comprising: a cationic biocide, surfactant and low levels of VOC solvents. The cleaning composition is adapted to clean a variety of hard surfaces without leaving behind a visible residue and creates low levels of streaking and filming on the treated surface. The cleaning composition contains less than 5% by weight of VOCs. The cleaning composition may be used alone as a liquid or spray formulation or in combination with a substrate, for example, a pre-loaded cleaning wipe.

The invention relates to a granular cleaning agent for sanitary facilities, comprising tensides, alkane carboxylic acid salts, and solvents, wherein the proportion of alkane carboxylic acid salts equals between 1 wt % and 5 wt % and the proportion of solvents (including perfume oils) equals less than 40 wt % and the agent contains at least 18% non-ionic tensides from the group of block copolymers containing oligo and polyethylene oxides and/or oligo and/or polypropylene oxides and/or oligo and/or polybutylene oxide.

A method of reducing defects of a semiconductor substrate whereby the substrate is rinsed with an aqueous composition containing a gemini additive of the general formula I after the development of a photoresist or a photolithographic mask ##STR00001## wherein X is a divalent group, R.sup.1, R.sup.2, R.sup.3 and R.sup.4 are substituted or unsubstituted monovalent groups, n is an integer from 1 to 5, or 1 to 10000 depending on R.sup.3 and R.sup.4, z is an integer, which is chosen so that the overall surfactant is electrically uncharged, and Z is a counter-ion.