Cleaning compositions and processes for cleaning post-plasma etch residue from a microelectronic device having said residue thereon. The composition achieves highly efficacious cleaning of the residue material, including titanium-containing, copper-containing, tungsten-containing, and/or cobalt-containing post-etch residue from the microelectronic device while simultaneously not damaging the interlevel dielectric, metal interconnect material, and/or capping layers also present thereon.

Cleavable surfactants of formula (I)

##STR00001##

having a total hydrophilic-lipophilic balance (HLB) of between 3 and 18 and wherein A is a group capable of releasing a flavor or fragrance aldehyde of formula (R.sup.1)CHO or a flavor or fragrance ketone of formula (R.sup.1)(R.sup.2)CO and is of formula

##STR00002##

wherein the wavy line indicates the location of the bond between L and A; R.sup.1 and R.sup.2 represent a hydrogen atom or a saturated or unsaturated C.sub.1-C.sub.18 hydrocarbon group, provided that at least one of the R.sup.1 or R.sup.2 groups has 6 consecutive carbon atoms and that both R.sup.1 and R.sup.2 taken together comprise a maximum of 18 carbon atoms; and L is a linear, branched or cyclic, saturated or unsaturated C.sub.3 to C.sub.40 hydrocarbon group. These surfactants solubilize and/or stabilize flavor and fragrance aldehydes and ketones in an aqueous environment and at the same time to control their release by hydrolysis.

The rinsing composition for a silicon wafer of the present invention is a rinsing composition for a silicon wafer containing a water-soluble polymer and water. The water-soluble polymer exhibits a difference (ZZ.sub.0) between a zeta-potential Z of a water-soluble polymer-containing silica aqueous dispersion (aqueous dispersion S) and a zeta-potential Z.sub.0 of a silica aqueous dispersion (aqueous dispersion S.sub.0) of 25 mV or less. The aqueous dispersion S consists of the water-soluble polymer, silica particles, water, and as needed, hydrochloric acid or ammonia, and has a concentration of the water-soluble polymer of 0.1 mass %, a concentration of the silica particles of 0.1 mass %, and a pH of 7.0 at 25 C. The aqueous dispersion S.sub.0 consists of silica particles, water, and as needed, hydrochloric acid or ammonia, and has a concentration of the silica particles of 0.1 mass %, and a pH of 7.0 at 25 C.

A cleaning composition, which is self-adhering upon application to a hard surface, is provided. The cleaning composition includes an adhesion promoter, water and a sufficient amount of a basic agent, such that a mixture of the composition with deionized water has a pH of at least about 10. The adhesion promoter typically includes one or more organic compounds, each containing at least one hydrophilic group. The cleaning compositions may also include at least one surfactant selected from the group of: anionic, nonionic, cationic, amphoteric, and/or zwitterionic surfactants; where one or more of the surfactants may serve all or in part as the adhesion promoter.

A method for applying a treatment agent to a substrate, wherein the treatment agent is bound to a solid polymeric particle at a first pH, and wherein the substrate is contacted with the solid polymeric treatment particles under conditions such that the treatment agent is released from the solid polymeric treatment particles.

Dry mixtures and liquid formulations are provided that comprise metal oxide and/or metal hydroxide nanocrystalline particles. The dry mixtures are advantageously formulated with select surfactants to be readily solubilized and stable in liquid carriers. Additional select components are provided in preferred combinations that are capable of achieving improved biocidal and chemical agent efficacy. Notably, the inventive formulations provided herein allow for easier delivery of the formulations and increased shelf stability.

A cleaning composition for sanitizing and/or disinfecting hard surfaces, comprising: a cationic biocide, surfactant and low levels of VOC solvents. The cleaning composition is adapted to clean a variety of hard surfaces without leaving behind a visible residue and creates low levels of streaking and filming on the treated surface. The cleaning composition contains less than 5% by weight of VOCs. The cleaning composition may be used alone as a liquid or spray formulation or in combination with a substrate, for example, a pre-loaded cleaning wipe.

A cleaning composition for sanitizing and/or disinfecting hard surfaces, comprising: a cationic biocide, surfactant and low levels of VOC solvents. The cleaning composition is adapted to clean a variety of hard surfaces without leaving behind a visible residue and creates low levels of streaking and filming on the treated surface. The cleaning composition contains less than 5% by weight of VOCs. The cleaning composition may be used alone as a liquid or spray formulation or in combination with a substrate, for example, a pre-loaded cleaning wipe.

A cleaning composition for sanitizing and/or disinfecting hard surfaces, comprising: a cationic biocide, surfactant and low levels of VOC solvents. The cleaning composition is adapted to clean a variety of hard surfaces without leaving behind a visible residue and creates low levels of streaking and filming on the treated surface. The cleaning composition contains less than 5% by weight of VOCs. The cleaning composition may be used alone as a liquid or spray formulation or in combination with a substrate, for example, a pre-loaded cleaning wipe.

A cleaning composition for sanitizing and/or disinfecting hard surfaces, comprising: a cationic biocide, surfactant and low levels of VOC solvents. The cleaning composition is adapted to clean a variety of hard surfaces without leaving behind a visible residue and creates low levels of streaking and filming on the treated surface. The cleaning composition contains less than 5% by weight of VOCs. The cleaning composition may be used alone as a liquid or spray formulation or in combination with a substrate, for example, a pre-loaded cleaning wipe.