Patent classifications
C11D3/39
COMPOSITION FOR CLEANING SEMICONDUCTOR SUBSTRATE, AND CLEANING METHOD
A cleaning composition for semiconductor substrates. The cleaning composition comprises hydrogen peroxide, a hydrogen peroxide stabilizing agent, an alkaline compound, and water. The hydrogen peroxide stabilizing agent is oxalic acid, diethylenetriaminepentaacetic acid, hydroxyethyliminodiacetic acid, potassium oxalate, 5-phenyl-1H-tetrazole, triethylenetetraminehexaacetic acid, trans-1,2-cyclohexanediaminetetraacetic acid, 8-quinolinol, L(+)-isoleucine, DL-valine, L(-)-proline, hydroxyethylethylenediaminetriacetic acid, N,N-di(2-hydroxyethyl)glycine, glycine, L-tryptophan, 2,6-pyridinedicarboxylic acid, benzothiazole, or DL-alanine. The alkaline compound is a quaternary ammonium hydroxide or potassium hydroxide.
REDEPOSITION INHIBITING POLYMERS AND DETERGENT COMPOSITIONS CONTAINING SAME
The present technology relates to polymeric additives and their incorporation into cleaning compositions useful in household detergents and other related uses including, dishwash (institutional and consumer), hard surface cleaners and textile care. The disclosed cleaning compositions include a detersive agent and a soil redeposition inhibiting agent. In one aspect, the soil redeposition inhibiting agent is selected from a functionalized polyurethane polymer.
FABRIC AND HOME CARE COMPOSITION INCLUDING A PROTEASE
Fabric and home care compositions including a surfactant and a protease. The protease includes a subtilisin variant comprising three, four, or five amino acid substitutions selected from the group consisting of S039E, S099R, S126A, D127E, and F128G and further comprises one or more additional substitutions selected from the group consisting of N74D, T114L, M122L, N198A, N198G, M211E, M211Q, N212Q, and N242D, and wherein the variant has at least about 80% identity to the amino acid sequence of SEQ ID NO: 1
Method of producing heated ozone water, heated ozone water, and semiconductor wafer-cleaning liquid
Provided are: a method of producing heated ozone water, the method capable of producing heated ozone water having an extremely high ozone concentration by suppressing a reduction in the ozone concentration in high-concentration heated ozone water; heated ozone water; and a semiconductor wafer-cleaning liquid using the heated ozone water. A method of producing heated ozone water obtained by dissolving ozone in pure water, the method being characterized by including: adjusting a pH of the pure water to 3 or less by adding acid to the pure water; to obtain an acid water, dissolving an ozone gas in the acid water; and heating the pure water, the acid water or the ozone water, to 60° C. or more.
Compositions and methods for use in surface decontamination
The disclosure provides compositions and methods for making a colorized solution of an aqueous disinfectant that is both stable in bulk solution and will fade to clear within a predetermined period of time after being applied to a surface, for example as a spray or film. The compositions and methods described here allow an end user to visualize both the extent of coverage and the duration of contact of the disinfectant with the surface, thereby providing more efficient disinfection of the surface.
LAUNDRY TREATMENT CARTRIDGE
A laundry treatment cartridge that includes a first sub-container and a second sub-container. The first sub-container contains and first laundry treatment composition. The second sub-container contains a second laundry treatment composition that differs from the first laundry treatment composition. The first sub-container and second sub-container are unitarily fixed with the cartridge.
Composition, Its Use And A Process For Removing Post-Etch Residues
Disclosed herein is a composition for removing post-etch residues in the presence of a layer comprising silicon and a dielectric layer including a silicon oxide, the composition including: (a) 0.005 to 0.3 % by weight HF; (b) 0.01 to 1 % by weight of an ammonium fluoride of formula NR.sup.E.sub.4F, where R.sup.E is H or a C.sub.1 to C.sub.4 alkyl group; (c) 5 to 30 % by weight of an organic solvent selected from the group consisting of a sulfoxide and a sulfone; (d) 70 % by weight or more water, and (e) optionally 0.01 to 1 % by weight of an ammonium compound selected from the group consisting of ammonia and a C.sub.4 to C.sub.20 quaternized aliphatic ammonium.
Sulfoperoxycarboxylic acids, their preparation and methods of use as bleaching and antimicrobial agents
The present invention relates to novel sulfoperoxycarboxylic acid compounds, and methods for making and using them. The sulfoperoxycarboxylic compounds of the invention are storage stable, water soluble and have low to no odor. Further, the compounds of the present invention can be formed from non-petroleum based renewable materials. The compounds of the present invention can be used as antimicrobials, and bleaching agents. The compounds of the present invention are also suitable for use as coupling agents.
Compositions and methods for use in surface decontamination
The disclosure provides compositions and methods for making a colorized solution of an aqueous disinfectant that is both stable in bulk solution and will fade to clear within a predetermined period of time after being applied to a surface, for example as a spray or film. The compositions and methods described here allow an end user to visualize both the extent of coverage and the duration of contact of the disinfectant with the surface, thereby providing more efficient disinfection of the surface.
Industrial Cleaning Systems, Including Solutions for Removing Various Types of Deposits, and Cognitive Cleaning
A method is performed at a computer system to clean heat exchanger systems. The system estimates the fouling level of a heat exchanger system based on measured performance parameters of the heat exchanger system. The performance parameters include the rate of heat exchange. The system generates a system performance cost model based on the estimated fouling level of the heat exchanger system. The system also determines an initial cleaning recipe based on operational parameters of the heat exchanger system. The operational parameters include chemical composition and operating temperatures of fluids passing through the heat exchanger system. The system generates a cleaning cost model based on the initial cleaning recipe and calculates a cleaning schedule to minimize overall operational cost using both the system performance cost model and the cleaning cost model. The system then executes the initial cleaning recipe at the heat exchanger system according to the calculated cleaning schedule.