A reactive toilet treatment packaged formulation and method for treatment of waste material resulting in a more stable, entombed treated waste product. The reactive toilet treatment comprises a foamable surfactant that is granular and sodium percarbonate. A multi-part formulation can be delivered in a multi-compartment vessel that cooperates with a self-contained non-contact agitating toilet. The reactive treatment formulation prevents odors, bacterial growth, and stabilizes waste to reduce spillage during disposal.

A dishwashing detergent may include a hydrogen peroxide source, a bleach catalyst, and a protease. The protease may include an amino acid sequence having at least 70% sequence identity to the amino acid sequence given in SEQ ID NO: 1 over its entire length and at least one amino acid substitution at at least one of the positions corresponding to positions 12, 43, 122, 127, 154, 156, 160, 211, 212, and 222, relating in each case to the numbering according to SEQ ID NO: 1.

Bleach catalyst detergent compositions are provided. The compositions are suitable for use with additional detergent and/or bleaching compositions while providing bleach catalysts within a detergent composition. The detergent compositions are free of anionic surfactant, are highly aqueous and have a pH of less than 6. Methods of use for cleaning are disclosed.

A polymer comprising a first fraction and a second fraction, wherein the first fraction comprises from 90 to 100 wt % polymerized C.sub.3-C.sub.6 carboxylic acid monomer units; and the second fraction comprises from 30 to 80 wt % polymerized C.sub.3-C.sub.6 carboxylic acid monomer units and from 20 to 70 wt % polymerized sulfonic acid monomer units; wherein the first fraction is from 10 to 40 wt % of the polymer and the second fraction is from 60 to 90 wt % of the polymer; the polymer has M.sub.w from 3,000 to 30,000; and monomers are randomly distributed within each fraction.

To provide a cleaning agent that can remove impurities such as metal polishing dust adhering to a semiconductor substrate without corroding metal and can prevent re-adhesion of the impurities. The semiconductor substrate cleaning agent of the present invention contains at least the following component (A) and component (B): Component (A): a water-soluble oligomer having a weight average molecular weight of not less than 100 and less than 10000; and Component (B): water. It is preferable that the water-soluble oligomer is at least one compound selected from compounds represented by the following formulas (a-1) to (a-3).
R.sup.a1O—(C.sub.3H.sub.6O.sub.2).sub.n—H  (a-1)
R.sup.a2O—(R.sup.a3O).sub.n′—H  (a-2)
(R.sup.a4).sub.3-s—N—[(R.sup.a5O).sub.n″—H].sub.s  (a-3)

The present disclosure is directed to a composition and method for treating stains and odors using an oxidizing agent and Bacillus spores. The composition preferably comprises a two part formula, a first part comprising the oxidizing agent and water and optionally an ionic surfactant and fragrance, and a second part comprising a liquid Bacillus spores composition or a dry Bacillus spores powder composition. The preferred Bacillus can include B. licheniformis, B. subtilis, B. pumilus, and B. megaterium spores. The preferred oxidizer is hydrogen peroxide. The parts of the treatment composition are mixed together in-situ at the site of treatment to maintain the viability of the Bacillus spores. The preferred composition and method allow for the combined treatment of stains and odors with an oxidizer and Bacillus spores.

Conventional ozone water is still insufficient in the removal rate and cleaning ability of resist required in today's semiconductor manufacturing field, and it does not fully meet the expectation of further improvement in the effects of sterilization, deodorization, and cleaning in the fields such as cleaning of foodstuffs, cleaning of process equipment and tools, and cleaning of fingers, as well as in the fields such as deodorization, sterilization, and preservation of freshness of foodstuffs. The above problem can be solved by defining the values of a plurality of specific production parameters in the production of ozone water into specific ranges.

The present technology generally relates to liquid compositions for cleaning post-CMP semiconductor surfaces, and methods of cleaning a semiconductor surface having ceria (CeO.sub.2) particles thereon.

An automatic dishwashing composition is provided, comprising: a dispersant polymer blend, comprising an acrylic acid homopolymer; and a copolymer of acrylic acid and a sulfonated monomer; wherein the dispersant polymer blend has a blend ratio of the acrylic acid homopolymer to the copolymer of 3:1 to 1:3; a surfactant; a builder; and optionally, an additive.

A dissolvable solid article which can include multiple layers of flexible, dissolvable, porous sheets, in which a coating composition including solid particles is present on at least one internal surface of at least one sheet in said solid articles and a process for making such solid articles.