C11D7/02

Methods of forming protective coatings for detersive agents

A method of creating a protective coating on an alkali metal hydroxide-containing solid is provided. The method includes providing carbon dioxide to an alkali metal hydroxide-containing solid and allowing the alkali metal hydroxide and carbon dioxide to react thereby forming a carbonate or bicarbonate-containing layer on the exterior of the solid wherein the carbonate or bicarbonate-containing layer is non-hygroscopic and water soluble, and wherein greater than 80% of the hydroxide in the hydroxide-containing solid does not react with the carbon dioxide, and further wherein the alkali metal hydroxide-containing solid is substantially free of lithium hydroxide. A method of testing for the presence of carbonate-containing coating on an alkali metal hydroxide containing solid is also provided. The method includes exposing the coated solid to 95 weight percent ethanol, collecting the ethanol effluent and testing the effluent for alkali metal hydroxide. A suitably coated solid does not have dissolved alkali metal hydroxide in the ethanol effluent or is substantially free of alkali metal hydroxide.

Methods of forming protective coatings for detersive agents

A method of creating a protective coating on an alkali metal hydroxide-containing solid is provided. The method includes providing carbon dioxide to an alkali metal hydroxide-containing solid and allowing the alkali metal hydroxide and carbon dioxide to react thereby forming a carbonate or bicarbonate-containing layer on the exterior of the solid wherein the carbonate or bicarbonate-containing layer is non-hygroscopic and water soluble, and wherein greater than 80% of the hydroxide in the hydroxide-containing solid does not react with the carbon dioxide, and further wherein the alkali metal hydroxide-containing solid is substantially free of lithium hydroxide. A method of testing for the presence of carbonate-containing coating on an alkali metal hydroxide containing solid is also provided. The method includes exposing the coated solid to 95 weight percent ethanol, collecting the ethanol effluent and testing the effluent for alkali metal hydroxide. A suitably coated solid does not have dissolved alkali metal hydroxide in the ethanol effluent or is substantially free of alkali metal hydroxide.

Dry and portable spot removal product and method comprising an aluminum dioctahedral phyllosilicate
10457896 · 2019-10-29 · ·

A stain removal product formulation and method utilizing a dry, portable product. The dry, portable removal product preferably contains specially treated ingredients, including a composition of microporous silica and alumina tetrahedra and combined with aluminum dioctahedral phyllosilicales family of minerals, ingredients may vary depending on the type of stain to treat, for example, for stains having an oil. grease or fat base. Due to the nature of stains and their varied content the product formulation may also include a combination of other dry ingredients such as clays, minerals, baking soda, com stareh, flour or other dry ingredients. Optional ingredients which may be added including dry coloring and/or dry fragrance components. The dry product formulation is provided in a powder, granule or flake form in moisture resistant packages and kits.

Method and system for cleaning copper-exposed substrate

The water outlet of a subsystem that includes an ultraviolet oxidation device and the water inlet of each substrate treatment device are connected to each other via a main pipe. A hydrogen peroxide removal device is installed between the ultraviolet oxidation device of the subsystem and a non-regenerative ion-exchange device. In addition, a carbon dioxide supply device is installed at the middle of a pipe that branches from the water outlet of the subsystem to reach the substrate treatment device. According to an aspect, the hydrogen peroxide removal device is filled with a platinum-group metal catalyst. Thus, ultrapure water passed through the ultraviolet oxidation device is used as a base to produce carbonated water in which the concentration of hydrogen peroxide dissolved therein is limited to 2 g/L or less and to which carbon dioxide is added to adjust resistivity to be within the range of 0.03 to 5.0 M.Math.cm.

Method and system for cleaning copper-exposed substrate

The water outlet of a subsystem that includes an ultraviolet oxidation device and the water inlet of each substrate treatment device are connected to each other via a main pipe. A hydrogen peroxide removal device is installed between the ultraviolet oxidation device of the subsystem and a non-regenerative ion-exchange device. In addition, a carbon dioxide supply device is installed at the middle of a pipe that branches from the water outlet of the subsystem to reach the substrate treatment device. According to an aspect, the hydrogen peroxide removal device is filled with a platinum-group metal catalyst. Thus, ultrapure water passed through the ultraviolet oxidation device is used as a base to produce carbonated water in which the concentration of hydrogen peroxide dissolved therein is limited to 2 g/L or less and to which carbon dioxide is added to adjust resistivity to be within the range of 0.03 to 5.0 M.Math.cm.

HYPOCHLOROUS ACID-BASED HAND SANITIZER
20190275077 · 2019-09-12 ·

A sanitizing formulation is disclosed for use as a hand sanitizer. The formulation may include hypochlorous acid, a silicone polymer or blend thereof, sodium phosphate, hydrochloric acid, and sodium magnesium silicate. Methods of using and making the sanitizing formulation are also disclosed.

HYPOCHLOROUS ACID-BASED HAND SANITIZER
20190275077 · 2019-09-12 ·

A sanitizing formulation is disclosed for use as a hand sanitizer. The formulation may include hypochlorous acid, a silicone polymer or blend thereof, sodium phosphate, hydrochloric acid, and sodium magnesium silicate. Methods of using and making the sanitizing formulation are also disclosed.

Alkaline earth metal-containing cleaning solution for cleaning semiconductor element, and method for cleaning semiconductor element using same

According to the present invention, it is possible to provide a cleaning solution which removes a dry etching residue and photoresist on a surface of a semiconductor element having a low dielectric constant film (a low-k film) and at least one material selected from between a material that contains 10 atom % or more of titanium and a material that contains 10 atom % or more of tungsten, wherein the cleaning solution contains: 0.002-50 mass % of at least one type of oxidizing agent selected from among a peroxide, perchloric acid, and a perchlorate salt; 0.000001-5 mass % of an alkaline earth metal compound; and water.

Alkaline earth metal-containing cleaning solution for cleaning semiconductor element, and method for cleaning semiconductor element using same

According to the present invention, it is possible to provide a cleaning solution which removes a dry etching residue and photoresist on a surface of a semiconductor element having a low dielectric constant film (a low-k film) and at least one material selected from between a material that contains 10 atom % or more of titanium and a material that contains 10 atom % or more of tungsten, wherein the cleaning solution contains: 0.002-50 mass % of at least one type of oxidizing agent selected from among a peroxide, perchloric acid, and a perchlorate salt; 0.000001-5 mass % of an alkaline earth metal compound; and water.

HYDROGEN SUPPLY MATERIAL AND PRODUCTION THEREFOR, AND HYDROGEN SUPPLY METHOD

A layered solid formulation (100a) as one hydrogen supply material (200) according to the present invention includes silicon fine particles having a capability of generating hydrogen and aggregates of the silicon fine particles, and a physiologically acceptable medium (90b) that gets contact with the silicon fine particles or the aggregates thereof. The hydrogen supply material (200) is a hydrogen supply material for bringing the hydrogen into contact with the skin and/or the mucous membrane through the medium (90b).