C11D7/22

Methods for making encapsulate-containing product compositions

Methods relating to making product compositions that include encapsulates and borate compounds, where the encapsulates include polyvinyl alcohol polymer. Compositions made from such methods.

Methods for making encapsulate-containing product compositions

Methods relating to making product compositions that include encapsulates, borate compounds, and a cationic polysaccharide, where the encapsulates include polyvinyl alcohol polymer. Compositions made from such methods. Encapsulate slurries.

Methods for making encapsulate-containing product compositions

Methods relating to making product compositions that include encapsulates, borate compounds, and a cationic polysaccharide, where the encapsulates include polyvinyl alcohol polymer. Compositions made from such methods. Encapsulate slurries.

COSMETIC BRUSH CLEANER
20190218481 · 2019-07-18 ·

[Problem] To provide a cosmetic brush cleaner excellent in quick dryability and capable of removing stains such as deposited cosmetics with ease in the following manner: impregnating tissue paper, towel, or the like with the cleaner to wipe off the cosmetics, sebum, and the like deposited on a cosmetic brush; or directly spraying the cleaner on a cosmetic brush, and wiping the brush with dry tissue paper or the like.

[Solution] A cosmetic brush cleaner including: (A) a lower alcohol in an amount of 30 to 99 mass %; (B) a volatile oil in an amount of 1 to 70 mass %; and (C) water in an amount of 7 mass % or less (including 0 mass %).

COMPOSITION FOR SURFACE TREATMENT
20190203027 · 2019-07-04 ·

To provide a composition for surface treatment capable of treating a surface of a polished object to be polished having both of a silicon-silicon bond and a nitrogen-silicon bond by sufficiently removing defects on the surface of the polished object to be polished. The composition for surface treatment contains a nonionic water-soluble polymer (A) having a main chain including only a carbon atom or a main chain consisting of a carbon atom and a nitrogen atom, and an anionic water-soluble polymer (B) having a main chain including only a carbon atom and a side chain having a sulfonic acid group or a group having a salt thereof or a carboxyl group or a group having a salt thereof, and being bonded to the main chain including only a carbon atom, and the composition is used for surface treatment of a polished object to be polished containing a silicon-silicon bond and a nitrogen-silicon bond and a pH of the composition is less than 9.0.

TREATMENT LIQUID AND METHOD FOR TREATING LAMINATE
20190194580 · 2019-06-27 · ·

A treatment liquid is a treatment liquid for a semiconductor device, which contains a fluorine-containing compound and a water-soluble aromatic compound not having a heterocyclic group but having a benzene ring, and has a pH of 5 or less.

TREATMENT LIQUID AND METHOD FOR TREATING LAMINATE
20190177670 · 2019-06-13 · ·

A treatment liquid is a treatment liquid for a semiconductor device, and contains a fluorine-containing compound and a metal ion.

DETERGENTS AND CLEANING AGENTS HAVING IMPROVED PERFORMANCE

A method for use of substituted dihydroxyterephthalic acid amides in detergents and cleaning agents, for improving detergent or cleaning performance with respect to bleachable stains.

COMPOSITION AND METHOD FOR TREATING OBJECT TO BE TREATED
20240279574 · 2024-08-22 · ·

An object of the present invention is to provide a composition having excellent ruthenium removability with respect to tungsten in a case of being applied to an object to be treated containing tungsten and ruthenium. The composition according to an embodiment of the present invention includes: periodic acid or a salt thereof, a quaternary ammonium salt; a resin containing a nitrogen atom; and a solvent.

Polishing composition

The purpose of the present invention is to provide a means to sufficiently remove impurities remaining on the surface of a polishing object after CMP. The polishing composition of the present invention is a polishing composition which is used after polishing has been performed by using a polishing composition (A) including abrasive grains or an organic compound (A), and is characterized by including an organic compound (B) which includes at least one atom selected from the group consisting of a fluorine atom, an oxygen atom, a nitrogen atom, and a chlorine atom and has a molecular weight of 100 or more, a pH adjusting agent, and 0 to 1% by mass of abrasive grains.