An aqueous hard surface cleaning composition having from about 0.1% to about 5% by weight of the composition of a surfactant system, from about 0.1% to about 5% by weight of the composition of polyalkylene glycol having a weight average molecular weight from 2,000 to 12,000 and from about 0.1% to about 5% by weight of the composition of perfume.

The present invention relates to a cleaning liquid on a silicon oxide film and/or a silicon nitride film, and the cleaning liquid contains (i) at least one compound selected from the group consisting of a compound represented by the formula (1), a compound represented by formula (2), a compound represented by formula (3), and a compound represented by the formula (4); and (ii) a reducing agent;

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in the above formulas, R.sub.1 to R.sub.12 and n are the same as the definitions described in the description.

Disclosed are cleaning compositions including at least two anionic surfactants, such as a mixture of a linear alkylbenzene sulfonate (LAS) and a sodium lauryl ether sulfate (SLES), wherein the mixture is present in the cleaning composition in a total amount combined of LAS and SLES of about 1%-2% by weight and wherein a weight ratio of LAS:SLES is about 3:1 to about 1:1 or about 6:1 to about 4:1; an ionic agent in an amount of about 0.01% to about 0.5% by weight, a nonionic surfactant in an amount of greater than about 0% to less than about 0.45% by weight, and a fragrance. Methods of preparing and using the present cleaning compositions are also disclosed.

A liquid laundry detergent formulation is provided, comprising: a liquid carrier; a cleaning surfactant; and a cleaning booster polymer, wherein the cleaning booster polymer has structural units of a monoethylenically unsaturated carboxylic acid monomer; structural units of an ethylenically unsaturated monomer of formula (I)

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and, optionally, structural units of an ethylenically unsaturated monomer of formula (II)

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A treatment liquid for cleaning a semiconductor wafer is a treatment liquid contains (A) a hypochlorite ion and (C) a solvent, in which pH at 25° C. is more than 7 and less than 12.0. A method for removing ruthenium and tungsten from a semiconductor wafer and cleaning the semiconductor wafer includes bringing the treatment liquid into contact with the semiconductor wafer containing ruthenium or tungsten is provided.

The disclosure provides cleaning compositions including at least one acid, at least one carbonate salt, at least one gum, at least one acid salt, and, optionally, at least one chelating agent. When exposed to an aqueous medium, the cleaning compositions may produce carbon dioxide. These cleaning compositions find use, for example, in cleaning textile fibers, such as carpets, drapery, upholstery, and the like. The disclosure provides methods of cleaning soiled textile fibers with a cleaning composition including gum arabic, at least one acid, and at least one carbonate salt.

An aqueous caustic composition comprising: a caustic component; a surfactant; and an amino acid; wherein said composition has an advancing contact angle (θ.sub.A) of less than 80 degrees and a receding contact angle (θ.sub.R) of less than 20 degrees and processes associated therewith.

An aqueous acidic CIP composition comprising: an acidic component; a surfactant; and an organic solvent; wherein said composition has an advancing contact angle (θ.sub.A) of less than 80 degrees and a receding contact angle (θ.sub.R) of less than 20 degrees.

A system for on-site production of chlorine dioxide and other sanitizing solutions is disclosed which includes a controller for measuring fluids into a measuring/mixing vessel. The measuring/mixing vessel is designed to measure and mix water with activator and base additives to create a ready-to-use cleaning solution. A drainage system is employed to transfer the ready-to-use cleaning solution into a reservoir for on-site use.

Peroxide treatment compositions for use in laundry capable of providing sanitization through the wash e.g., for use with a detergent, where a peroxide activator is stabilized without the presence of phosphorus-containing compounds (e.g., phosphorus-containing stabilizers), through use of a nonionic surfactant (e.g., alkoxylated alcohol) with a cloud point above 45° C. Use of a single nonionic surfactant, or a surfactant package that may include a small fraction (e.g., less than 0.5%) of sodium lauryl sulfate or another anionic surfactant has been found to be surprisingly effective at stabilizing the peroxide/activator combination, even where water content may be 85% or greater. The composition can have a pH of 5 or less (e.g., 3 to 4). The composition may be free of other anionic surfactants, cationic surfactants, zwitterionic surfactants, amphoteric surfactants, magnesium salts, borates and boric acid, hydroxides, chelating agents, various amine oxides, ethoxylated amines, and the like.