The processing system (1) is provided with an etching tank (2) and a circulation pipe (7) that exits from the bottom portion of the etching tank (2) and returns to the etching tank (2). The circulation pipe (7) is provided with a liquid feed pump (8), a heat exchanger (9), a sulfuric acid concentration meter (10), and an oxidant concentration meter (11). The sulfuric acid concentration meter (10) and the oxidant concentration meter (11) can transmit measurement results to a calculation/control device (12). The etching tank (2) can be replenished with hydrogen peroxide water, sulfuric acid, and pure water through a hydrogen peroxide water supply line (13), a sulfuric acid supply line (14), and a pure water supply line (15). The calculation/control device (12) can adjust the supply amounts of hydrogen peroxide water, sulfuric acid, and pure water to respective desired amounts. Such a processing system enables etching of a resin molded article while maintaining both the sulfuric acid concentration and the oxidant concentration of a sulfuric acid solution that is free from hexavalent chromic acid or permanganic acid and contains an oxidizing substance obtained by mixing sulfuric acid and hydrogen peroxide water.

Liquid fabric softener compositions comprising (a) water-insoluble cationic softeners, (b) water-soluble cationic antibacterial agents and (c) cationic rheology modifying polymers are described that are stable homogenous mixtures. A method for determining stability of the softener formulations or determining the amount of component (a), (b) or (c) involves calculating a stability index of the formulation according to the following equation: Stability formula index=[(wt % of the (a) component+3*(wt % of the (c) component)]/[wt % of the (b) component], wherein a desirable stability index value is 2.5 or greater than 2.5.

A cleaning liquid for cleaning a substrate having a first metal atom-containing layer that contains ruthenium and a second metal atom-containing layer that contains a metal atom other than ruthenium, both of the layers contacting each other, and at least one of the first metal atom-containing layer and the second metal atom-containing layer is exposed on a surface. The cleaning liquid includes at least one of a compound represented by General Formula (a1), a hydrate of the compound, and a salt of the compound, and at least one amine other than the hydrazine compound and a quaternary hydroxide. In General Formula (a1), R.sup.1 and R.sup.2 represent an organic group including no carbonyl group or a hydrogen atom

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A surfactant product is in the form of a solid. The surfactant product includes (i) sodium carbonate; (ii) cream of tartar; (iii) glycerine; (iv) sodium lauryl sulphate in an amount of from 3 to 15 wt % based on the weight of the total composition, and (v) sodium laureth sulphate in an amount of from 10 to 25 wt % based on the weight of the total composition.

The present disclosure relates to a suspending polymer composition comprising a blend of: (i) about 40 to about 80 wt. % of hydroxypropylmethylcellulose (HPMC); (ii) about 10 to about 30 wt. % of xanthan gum; and (iii) about 10 to about 30 wt. % of cetyl-hydroxy ethyl cellulose (cetyl-HEC) for use in personal care or home care compositions. The suspending polymer composition preferably is free of acrylates, methacrylates and derivatives thereof.

A cleaner useful in removing undesirable polymeric material deposits adhered within small bore holes of electronic components is provided, as well as apparatus and methods for carrying out cleaning of such components.

The present disclosure relates to stable aqueous compositions of alkyl sulfates, which are suitable for numerous commercial applications due to their favorable cleaning and foaming properties. More particularly, the disclosure relates to stable aqueous compositions of alkyl sulfates in combination with select hydrophobic agents, such as essential oils.

An aqueous rinse aid solution for use in a dishwashing machine wherein the solution is substantially free of poloxamer type surfactants and wherein the solution produces water sheeting and spot-free dishware drying, the solution consists of food additives permitted for direct addition to food for human consumption and water.

An alkaline detergent is described which includes the use of a copolymer in combination with an alkali metal hydroxide. The detergent maintains cleaning functions and also prevents hard water scaling, for example at application temperatures of between 145-180 degrees Fahrenheit and with a pH of 9.5 to about 13.

Provided are formulations that offer a high cleaning effect on inorganic particles, organic residues, chemical residues, reaction products on the surface due to interaction of the wafer surface with the Chemical Mechanical Planarization (CMP) slurry and elevated levels of undesirable metals on the surface left on the semiconductor devices after the CMP. The post-CMP cleaning formulations comprise one or more organic acid, one or more polymer and a fluoride compound with pH<7 and optionally a surfactant with two sulfonic acid groups.