An object of the present invention is to provide a cleaning liquid for semiconductor substrates with a change in the pH of the cleaning liquid caused by dilution being suppressed. A cleaning liquid of the invention is a cleaning liquid for semiconductor substrates that contains a chelating agent, and an acidity constant (pKa) of the chelating agent and a pH of the cleaning liquid satisfy a condition defined by Formula (A):

pKa−1<pH<pKa+1  (A)

The need for a liquid detergent composition suitable for washing dishes, fitting both in-sink as well as direct application habits, which provides reduced smearing when used in direct application dishwashing methods is met by formulating the liquid detergent composition to comprise a surfactant system, which comprises an alkyl sulfate anionic surfactant comprising C13 alkyl sulfate anionic surfactant, the C13 alkyl sulfate anionic surfactant comprising a specific fraction of 2-branched C13 alkyl sulfate anionic surfactant, with a specific distribution of the 2-branching.

A water-soluble container made up of two halves that seal together, each containing a plurality of chambers that may receive a cleaning substance, commonly a liquid or powder. This container is formed from four, water-soluble, flexible membranes with each half made up of two of the four membranes; a shaped membrane, and a non-shaped membrane, wherein the shaped membrane seals to the non-shaped membrane to form the plurality of physically distinct chambers. Each half is sealed independently to the other half and are subsequently sealed together at their non-shaped membranes to form the water-soluble container resulting in the outer surface of the container to be shaped on both opposing sides.

The need for a liquid detergent composition suitable for washing dishes, fitting both in-sink as well as direct application habits, which provides reduced smearing when used in direct application dishwashing methods, while having good suds mileage especially under in-sink application habit, and good viscosity, is met by formulating the liquid detergent composition to comprise a surfactant system, which comprises an alkyl sulfate anionic surfactant comprising C13 alkyl sulfate anionic surfactant, the C13 alkyl sulfate anionic surfactant comprising a specific fraction of 2-branched C13 alkyl sulfate anionic surfactant, with a specific distribution of the 2-branching.

A composition including hydrogen peroxide is provided, which can be used for semiconductor device manufacturing and which exhibits an excellent storage stability and has a reduced effect of defects on a semiconductor substrate. Further, a method is provided for producing the composition including hydrogen peroxide, and a composition reservoir for storing the composition. The composition includes hydrogen peroxide, an acid, and an Fe component, in which the content of the Fe component is 10.sup.−5 to 10.sup.2 in terms of mass ratio with respect to the content of the acid.

The need for a liquid detergent composition for washing dishes which provides effective removal of both crystalline and polymerised grease, while requiring less time and effort to clean and rinse the dishes, is met when the composition is formulated with a surfactant system comprising an anionic surfactant, a co-surfactant, and a non-alkoxylated esteramine.

The need for a cleaning product comprising a spray dispenser and a cleaning composition suitable for washing dishes which provides effective removal of both crystalline and polymerised grease, even at low surfactant and solvent levels, while also requiring less time and effort to clean and especially to rinse the dishes, regardless of hardness of the water used, is met by formulating the cleaning composition with a surfactant system comprising a non-alkoxylated esteramine.

A formulation having at least one of a product stabilization solvent, a sequestrant or chelating agent, and an alkalinity agent capable of use in a cleaning operation at a reduced temperature. Optionally, the formulation may additionally comprise any one or more of a degreaser emulsifier solvent, a surfactant, a hydrotrope, a stabilizer, a biocide, and a buffer. An additive formulation of the invention, as defined herein, comprises these stated types of compounds and is combined with an alkalinity agent at the time of the formulations use in a reduced temperature dairy equipment cleaning operation. A full formulation of the invention, as defined herein, additionally comprises an alkalinity agent in addition to the other named compounds. In many cases, the full formulations are used in a reduced temperature dairy equipment cleaning operation without being combined with an additional alkalinity agent. The reduced temperature of the dairy equipment cleaning operation using the formulation of the invention may be less than about 50° C. or, alternatively, less than about 40° C.

Compositions that include at least one low molecular weight to oxygen containing solvent and one or more compounds of formula (I) wherein R is a C.sub.1-C.sub.6 alkyl; X is a C.sub.1-C.sub.10 alkyl and n is an integer from 0 to 5. Methods of removing polymeric material containing heteroatoms from a surface by contacting the surface with such compositions and wiping the composition at least some portion of the polymeric material from the surface. ##STR00001##

An aqueous rinse aid solution for use in a dishwashing machine wherein the solution is substantially free of poloxamer type surfactants and wherein the solution produces water sheeting and spot-free dishware drying, the solution consists of food additives permitted for direct addition to food for human consumption and water.