C11D17/08

DETERGENT COMPOSITIONS CONTAINING A SURFACTANT SYSTEM INCLUDING A NONIONIC AND AN IONIC SURFACTANT
20190376005 · 2019-12-12 · ·

A wash composition includes a surfactant system, a solvent system, and one or more beneficial compositions. The surfactant system includes a) a linear alkylbenzenesulfonate (LAS), and b) a fatty acid methyl ester ethoxylate (MEE). Optionally, the surfactant system may further include c) an alkyl ether sulfate (AES), and d) a nonionic alcohol ethoxylate (AE). The wash composition may be embodied as a unit dose composition or a heavy-duty liquid. Methods for increasing the effectiveness of fabric cleaning that include using the wash composition are also provided.

Method for indicating time for washing or indicating delivery of antibacterial agent

A method for indicating release of an antibacterial agent or for indicating an amount of time for cleansing skin with an aqueous cleansing composition comprising a surfactant and a zinc X halide complex, wherein X is an amino acid or trimethylglycine, wherein the method comprises washing skin with the cleansing composition and water for a time until the zinc X halide complex precipitates from the aqueous cleansing composition.

Method for indicating time for washing or indicating delivery of antibacterial agent

A method for indicating release of an antibacterial agent or for indicating an amount of time for cleansing skin with an aqueous cleansing composition comprising a surfactant and a zinc X halide complex, wherein X is an amino acid or trimethylglycine, wherein the method comprises washing skin with the cleansing composition and water for a time until the zinc X halide complex precipitates from the aqueous cleansing composition.

CLEANING LIQUID COMPOSITION
20190345419 · 2019-11-14 ·

Provided is a cleaning liquid composition which is useful for cleaning of a substrate or the like that has been subjected to a chemical mechanical polishing (CMP) process, etc in the production steps of an electronic device such as a semiconductor element. A cleaning liquid composition according to the present invention is used for the purpose of cleaning a substrate that has a Cu wiring, and comprises one or more basic compounds and one or more nitrogen-containing monocyclic heterocyclic aromatic compounds that contain one or more carboxyl groups or ester groups, provided that in cases where one or more amino groups are contained therein, only amino groups directly bonded to a nitrogen-containing heterocyclic rind are contained. This cleaning liquid composition has a hydrogen ion concentration (pH) of 8-12.

Liquid detergent

A liquid detergent of the present invention contains: component (a): a nonionic surfactant which contains compounds represented by the following formula (1) wherein an average value of m in formula (1) ranges from 5 to 20; and in which a ratio of the compound wherein R.sup.1 is a double bond-containing unsaturated hydrocarbon group is equal to or greater than 45% by mass with respect to a total amount of the component (a), and a ratio of the compound wherein R.sup.1 is an unsaturated hydrocarbon group having two or more double bonds is equal to or greater than 4% by mass with respect to a total amount of the compounds of formula (1) wherein R.sup.1 is an unsaturated hydrocarbon group; and component (b): an anionic surfactant.
R.sup.1CO(EO).sub.mOR.sup.2(1) wherein R.sup.1 is a saturated or unsaturated hydrocarbon group having 15 to 17 carbon atoms; EO is an oxyethylene group; m is a positive integer; and R.sup.2 is an alkyl group having 1 to 3 carbon atoms.

Liquid detergent

A liquid detergent of the present invention contains: component (a): a nonionic surfactant which contains compounds represented by the following formula (1) wherein an average value of m in formula (1) ranges from 5 to 20; and in which a ratio of the compound wherein R.sup.1 is a double bond-containing unsaturated hydrocarbon group is equal to or greater than 45% by mass with respect to a total amount of the component (a), and a ratio of the compound wherein R.sup.1 is an unsaturated hydrocarbon group having two or more double bonds is equal to or greater than 4% by mass with respect to a total amount of the compounds of formula (1) wherein R.sup.1 is an unsaturated hydrocarbon group; and component (b): an anionic surfactant.
R.sup.1CO(EO).sub.mOR.sup.2(1) wherein R.sup.1 is a saturated or unsaturated hydrocarbon group having 15 to 17 carbon atoms; EO is an oxyethylene group; m is a positive integer; and R.sup.2 is an alkyl group having 1 to 3 carbon atoms.

ARTICLE FOR SKIN CLEANSING AGENT

The present invention relates to an article for skin cleansing agent which can generate foams having a high air ratio and achieve good foam quality. An article for skin cleansing agent comprising a non-aerosol-type container filled with a skin cleansing composition, wherein the non-aerosol-type container comprises a gas-liquid mixing part, a foam micronizing part, and a discharge outlet, and has a mechanism for discharging air and the skin cleansing composition at a volume ratio (air/composition) of 15/1 or more and 38/1 or less from the discharge outlet, and the skin cleansing composition comprises: (A) 0.5% by mass or more and 18% by mass or less, in terms of acid of a specific anionic surfactant; (B) 2% by mass or more and 50% by mass or less of a specific polyol; and (C) 40% by mass or more and 90% by mass or less of water.

TREATMENT LIQUID, CLEANING METHOD OF SEMICONDUCTOR SUBSTRATE, AND MANUFACTURING METHOD OF SEMICONDUCTOR ELEMENT
20240117278 · 2024-04-11 · ·

An object of the present invention is to provide a treatment liquid having excellent removability of a hydrophobic anticorrosion agent and excellent suppression property of copper surface roughness, a cleaning method of a semiconductor substrate, and a manufacturing method of a semiconductor element. The treatment liquid of the present invention contains at least one specific compound selected from the group consisting of a quaternary ammonium compound including a quaternary ammonium cation having a total number of carbon atoms of 5 or more and a quaternary phosphonium compound including a quaternary phosphonium cation having a total number of carbon atoms of 5 or more, a sulfur-containing compound, and a solvent.

Alkaline cleaning liquid comprising urea and/or biuret, and cleaning method for reverse osmosis membrane

Provided are a cleaning agent and a cleaning liquid that prevent a reduction in the rejection rate of an RO membrane which may occur when the RO membrane is cleaned and a method for cleaning an RO membrane with the cleaning liquid. The agent for cleaning an RO membrane includes a urea derivative. The urea derivative preferably includes urea (H.sub.2NCONH.sub.2) and/or biuret (H.sub.2NCONHCONH.sub.2). The cleaning liquid is an aqueous solution produced by diluting the cleaning agent. The method for cleaning an RO membrane uses the cleaning liquid. Urea and biuret have a structure analogous to amide bonds included in aromatic polyamide RO membranes, and have a strong affinity for amide bond portions. Urea and biuret adsorb onto the amide bond portions, and prevent the amide bonds from being broken by the cleaning liquid.

Alkaline cleaning liquid comprising urea and/or biuret, and cleaning method for reverse osmosis membrane

Provided are a cleaning agent and a cleaning liquid that prevent a reduction in the rejection rate of an RO membrane which may occur when the RO membrane is cleaned and a method for cleaning an RO membrane with the cleaning liquid. The agent for cleaning an RO membrane includes a urea derivative. The urea derivative preferably includes urea (H.sub.2NCONH.sub.2) and/or biuret (H.sub.2NCONHCONH.sub.2). The cleaning liquid is an aqueous solution produced by diluting the cleaning agent. The method for cleaning an RO membrane uses the cleaning liquid. Urea and biuret have a structure analogous to amide bonds included in aromatic polyamide RO membranes, and have a strong affinity for amide bond portions. Urea and biuret adsorb onto the amide bond portions, and prevent the amide bonds from being broken by the cleaning liquid.