A catalyst according to the present invention exhibits a catalytic action to a methanol decomposition reaction or a hydrocarbon steam-reforming reaction in a short time. The present invention provides a catalyst for producing hydrogen gas, using an Ni.sub.3Si-based intermetallic compound.

A catalyst according to the present invention exhibits a catalytic action to a methanol decomposition reaction or a hydrocarbon steam-reforming reaction in a short time. The present invention provides a catalyst for producing hydrogen gas, using an Ni.sub.3Si-based intermetallic compound.

A high-entropy alloy according to the present embodiment is a high-entropy alloy having an iron-rich phase and a copper-rich phase, and comprises a common complete solid solution metal that is completely solid-solved in iron and copper respectively. For example, the common complete solid solution metal may comprise nickel.

A high-entropy alloy according to the present embodiment is a high-entropy alloy having an iron-rich phase and a copper-rich phase, and comprises a common complete solid solution metal that is completely solid-solved in iron and copper respectively. For example, the common complete solid solution metal may comprise nickel.

In various embodiments, a metal alloy resistant to aqueous corrosion consists essentially of or consists of niobium with additions of tungsten, molybdenum, and one or both of ruthenium and palladium.

In various embodiments, a metal alloy resistant to aqueous corrosion consists essentially of or consists of niobium with additions of tungsten, molybdenum, and one or both of ruthenium and palladium.

A heat treatment method for a titanium-aluminum (TiAl) intermetallic includes the following steps: providing a TiAl intermetallic casting material; performing a first-stage heat treatment on the TiAl intermetallic casting material, where the TiAl intermetallic casting material is heated until a metallographic structure thereof is transformed into the a+γ phase, and is then cooled to room temperature to form a transitional casting material; and performing a second-stage heat treatment on the transitional casting material, where the transitional casting material is heated until a metallographic structure thereof is transformed into the α single phase, and is then cooled to room temperature to form a TiAl intermetallic.

A ferritic alloy comprising in weight %: C: 0.01-0.1; N: 0.001-0.1; O: ≦0.2; B: ≦0.01; Cr: 9.0-13.0; Al: 2.5-8.0; Si: ≦0.5; Mn: ≦0.4; Y: ≦2.2; Sc+Ce+La: ≦0.2; Mo+W: ≦4.0; Ti: ≦1.7; Zr: ≦3.3; Nb: ≦3.3; V: ≦1.8; Hf+Ta+Th: ≦6.5; the balance being Fe and unavoidable impurities, wherein, the amounts of Ti+Zr+Nb+V+Hf+Ta+Th and C, N and O are balanced such that:

[00001]$\frac{\begin{array}{c}\mathrm{at}.Math..Math.\%.Math..Math.\mathrm{Ti}+\mathrm{at}.Math..Math.\%.Math..Math.\mathrm{Zr}+\mathrm{at}.Math..Math.\%.Math..Math.\mathrm{Nb}+\mathrm{at}.Math..Math.\%.Math..Math.V+\\ \mathrm{at}.Math..Math.\%.Math..Math.\mathrm{Hf}+\mathrm{at}.Math..Math.\%.Math..Math.\mathrm{Ta}+\mathrm{at}.Math..Math.\%.Math..Math.\mathrm{Th}-x*\mathrm{at}.Math..Math.\%.Math..Math.O-\mathrm{at}.Math..Math.\%.Math..Math.N\end{array}}{}$

Provided is a copper alloy sputtering target, wherein, based on charged particle activation analysis, the copper alloy sputtering target has an oxygen content of 0.6 wtppm or less, or an oxygen content of 2 wtppm or less and a carbon content of 0.6 wtppm or less. Additionally provided is a method for manufacturing a copper alloy sputtering target, wherein a copper raw material is melted in a vacuum or an inert gas atmosphere, a reducing gas is thereafter introduced into the melting atmosphere, an alloy element is subsequently added to a molten metal for alloying, and an obtained ingot is processed into a target shape. The present invention aims to provide a copper alloy sputtering target that generates few particles during sputtering, and a method for manufacturing such a sputtering target.

Provided is a copper alloy sputtering target, wherein, based on charged particle activation analysis, the copper alloy sputtering target has an oxygen content of 0.6 wtppm or less, or an oxygen content of 2 wtppm or less and a carbon content of 0.6 wtppm or less. Additionally provided is a method for manufacturing a copper alloy sputtering target, wherein a copper raw material is melted in a vacuum or an inert gas atmosphere, a reducing gas is thereafter introduced into the melting atmosphere, an alloy element is subsequently added to a molten metal for alloying, and an obtained ingot is processed into a target shape. The present invention aims to provide a copper alloy sputtering target that generates few particles during sputtering, and a method for manufacturing such a sputtering target.