Patent classifications
C22C1/02
ALUMINUM PLATE AND COLLECTOR FOR STORAGE DEVICE
An object of the present invention is to provide an aluminum plate which is excellent in terms of both step suitability and working characteristics and a collector for a storage device using the same. The aluminum plate of the present invention is an aluminum plate having a plurality of through-holes formed in a thickness direction, in which a thickness of the aluminum plate is 40 μm or less, an average opening diameter of the through-holes is 0.1 to 100 μm, an average opening ratio by the through-holes is 2% to 30%, a content of Fe is 0.03% by mass or more, and a ratio of the content of Fe to a content of Si is 1.0 or more.
HIGH-PERFORMANCE 5000-SERIES ALUMINUM ALLOYS AND METHODS FOR MAKING AND USING THEM
5000 series aluminum wrought alloys with high strength, high formability, excellent corrosion resistance, and friction-stir weldability, and methods of making those alloys.
SYSTEM AND METHOD FOR CATHODIC PROTECTION BY DISTRIBUTED SACRIFICIAL ANODES
A method to reduce the total anode mass of a cathodic protection system by reducing or eliminating the total cathode area is disclosed, the system comprising: a metallic first-layer coating which being anodic to the component or substrate to be protected, bonded to the component or substrate and electrically conductive. A sacrificial anode in the form of a metallic second-layer coating is distributed over the first-layer coating. The second layer coating has an open circuit potential that is equal to the first-layer coating or being anodic to the first-layer coating and to the substrate, the second-layer coating electrically conductive, bonded to the first-layer coating and exposed to the surrounding environment.
SYSTEM AND METHOD FOR CATHODIC PROTECTION BY DISTRIBUTED SACRIFICIAL ANODES
A method to reduce the total anode mass of a cathodic protection system by reducing or eliminating the total cathode area is disclosed, the system comprising: a metallic first-layer coating which being anodic to the component or substrate to be protected, bonded to the component or substrate and electrically conductive. A sacrificial anode in the form of a metallic second-layer coating is distributed over the first-layer coating. The second layer coating has an open circuit potential that is equal to the first-layer coating or being anodic to the first-layer coating and to the substrate, the second-layer coating electrically conductive, bonded to the first-layer coating and exposed to the surrounding environment.
PYROMETALLURGICAL PROCESS FOR RECOVERING NICKEL, MANGANESE, AND COBALT
A 2-step high temperature process for recovering Ni, Co, and Mn from various sources comprises preparing a metallurgical charge comprising materials containing Ni, Co, and Mn, and Si, Al, Ca and Mg as slag formers; smelting the charge with slag formers in first reducing conditions, thereby obtaining a Ni—Co alloy comprising a major part of at least one of Co and Ni, with Si<0.1%, and a first slag comprising the major part of the Mn; separation of the first slag from the alloy; and, smelting the first slag in second reducing conditions, more reducing than said first reducing conditions, thereby obtaining a Si—Mn alloy comprising the major part of the Mn, with Si>10%, and a second slag. A Ni—Co alloy is produced, and a Si—Mn alloy is produced. The second slag is essentially free of heavy metals and therefore suitable for reuse.
PYROMETALLURGICAL PROCESS FOR RECOVERING NICKEL, MANGANESE, AND COBALT
A 2-step high temperature process for recovering Ni, Co, and Mn from various sources comprises preparing a metallurgical charge comprising materials containing Ni, Co, and Mn, and Si, Al, Ca and Mg as slag formers; smelting the charge with slag formers in first reducing conditions, thereby obtaining a Ni—Co alloy comprising a major part of at least one of Co and Ni, with Si<0.1%, and a first slag comprising the major part of the Mn; separation of the first slag from the alloy; and, smelting the first slag in second reducing conditions, more reducing than said first reducing conditions, thereby obtaining a Si—Mn alloy comprising the major part of the Mn, with Si>10%, and a second slag. A Ni—Co alloy is produced, and a Si—Mn alloy is produced. The second slag is essentially free of heavy metals and therefore suitable for reuse.
METHOD OF PREPARING ALUMINUM-CONTAINING ALLOY POWDER AND APPLICATION THEREOF
The present disclosure relates to a method of preparing an aluminum-containing alloy powder and an application thereof. The preparation method includes: by using the characteristic that a solidification structure of an initial alloy includes a matrix phase and a dispersed particle phase, the matrix phase is removed by reaction with an acid solution, so as to separate out the dispersed particle phase and obtain an aluminum-containing alloy powder. The preparation method is simple in process and can prepare different morphologies of aluminum-containing alloy powders of nano-level, sub-micron-level, micron-level and millimeter-level, which can be applied to the fields such as photo-electronic devices, wave absorbing materials, catalysts, 3D metal printing, metal injection molding and corrosion-resistant coating.
ALUMINUM ALLOY AND PREPARATION METHOD THEREOF
An aluminum alloy and a preparation method thereof are provided. In percentage by mass, the aluminum alloy includes: 8-11% of Si, 2-3% of Cu, 0.7-1.1% of Mg, 0.7-1.5% of Mn, 0.01-0.015% of Sr, 0.01-0.015% of Cr, 0-0.4% of Fe, 0.02-0.1% of Ti, 0.01-0.02% of Ga, 0.004-0.02% of B, 0-2% of Zn, and the balance of Al and less than 0.1% of other elements.
HIGH-PLASTICITY RAPIDLY-DEGRADABLE Mg-Li-Gd-Ni ALLOY AND PREPARATION METHOD THEREOF
The present disclosure provides a high-plasticity rapidly-degradable Mg-Li-Gd-Ni alloy, including the following chemical elements by mass percentage: 1.0-10.0% of Gd, 0.2-2.0% of Ni, 5.5-10% of Li, and the rest of Mg and inevitable impurities. The impurities have a total content less than or equal to 0.3%. The present disclosure further provides a preparation method of the high-plasticity rapidly-degradable Mg-Li-Gd-Ni alloy. The high-plasticity rapidly-degradable Mg-Li-Gd-Ni alloy provided by the present disclosure constructs an α-Mg+β-Li dual-phase matrix structure by introducing β-Li with a body-centered cubic (BCC) structure with relatively more slip systems to improve plasticity of the alloy, then adds a certain amount of Gd element to weaken texture and promote non-basal plane slip, and further improves plasticity. In addition, by introducing the high-potential Ni-containing LPSO phase, a large potential difference with α-Mg and β-Li is formed to increase the degradation performance.
HIGH-PLASTICITY RAPIDLY-DEGRADABLE Mg-Li-Gd-Ni ALLOY AND PREPARATION METHOD THEREOF
The present disclosure provides a high-plasticity rapidly-degradable Mg-Li-Gd-Ni alloy, including the following chemical elements by mass percentage: 1.0-10.0% of Gd, 0.2-2.0% of Ni, 5.5-10% of Li, and the rest of Mg and inevitable impurities. The impurities have a total content less than or equal to 0.3%. The present disclosure further provides a preparation method of the high-plasticity rapidly-degradable Mg-Li-Gd-Ni alloy. The high-plasticity rapidly-degradable Mg-Li-Gd-Ni alloy provided by the present disclosure constructs an α-Mg+β-Li dual-phase matrix structure by introducing β-Li with a body-centered cubic (BCC) structure with relatively more slip systems to improve plasticity of the alloy, then adds a certain amount of Gd element to weaken texture and promote non-basal plane slip, and further improves plasticity. In addition, by introducing the high-potential Ni-containing LPSO phase, a large potential difference with α-Mg and β-Li is formed to increase the degradation performance.