Patent classifications
C22C1/04
Method for generating a component by a power-bed-based additive manufacturing method and powder for use in such a method
The disclosure relates to a powder and a method for generating a component by a powder-bed-based additive manufacturing method, such as laser melting. The powder includes particles having a core and a shell. The particles have an alloy composition of the component. The concentration of higher-melting alloy elements is greater in the shell and the concentration of lower-melting alloy elements is greater in the core, wherein the surface of the particles is higher in comparison with particles with a constant alloy composition. This advantageously prevents the particles from caking together in the powder bed during the production of the component, and so the powder bed may also be subjected to high preheating temperatures of up to 1000° C.
METHOD OF MANUFACTURING ALUMINUM ALLOY ARTICLES
A method for making an article is disclosed. The method involves inputting a digital model of an article into an additive manufacturing apparatus comprising an energy source. The additive manufacturing apparatus applies energy from the energy source to successively applied incremental quantities of a powder to fuse the powder to form the article corresponding to the digital model. The powder includes an aluminum alloy having 2.00-10.00 wt. % cerium, 0.50-2.50 wt. % titanium, 0-3.00 wt. % nickel, 0-0.75 wt. % nitrogen, 0-0.05 wt. % other alloying elements, and the balance of aluminum, based on the total weight of the aluminum alloy.
ALUMINUM ALLOY ARTICLES
An aluminum alloy comprising greater than 2.00 and less than 4.00 wt. % cerium, 0.25-3.00 wt. % silicon, 0.25-0.75 wt. % magnesium, 0-0.75 wt. % iron, 0-0.05 wt. % other alloying elements, and the balance of aluminum, based on the total weight of the aluminum alloy aluminum alloy.
PROCESS FOR PRODUCING ELECTRODE MATERIAL, AND ELECTRODE MATERIAL
A process for producing an electrode material by infiltrating a highly conductive metal such as Cu into a porous object containing heat-resistant elements. Before an infiltration step in which the highly conductive metal is infiltrated, a HIP treatment is given to a powder containing the heat-resistant elements (or to a molded object obtained by molding a powder containing the heat-resistant elements). The composition is controlled so that the HIP treatment yields a porous object which has a degree of filling of 70% or higher, more preferably 75% or higher. The highly conductive metal is infiltrated into the porous object having the controlled composition.
Cu-Ga SPUTTERING TARGET AND PRODUCTION METHOD FOR Cu-Ga SPUTTERING TARGET
A Cu—Ga sputtering target made of a composition containing: as metal components excluding fluorine, 5 atomic % or more and 60 atomic % or less of Ga and 0.01 atomic % or more and 5 atomic % or less of K; and the Cu balance containing inevitable impurities is provided. In the Cu—Ga sputtering target, the Cu—Ga sputtering target has a region containing Cu, Ga, K, and F, in an atomic mapping image by a wavelength separation X-ray detector.
Cu-Ga SPUTTERING TARGET AND PRODUCTION METHOD FOR Cu-Ga SPUTTERING TARGET
A Cu—Ga sputtering target made of a composition containing: as metal components excluding fluorine, 5 atomic % or more and 60 atomic % or less of Ga and 0.01 atomic % or more and 5 atomic % or less of K; and the Cu balance containing inevitable impurities is provided. In the Cu—Ga sputtering target, the Cu—Ga sputtering target has a region containing Cu, Ga, K, and F, in an atomic mapping image by a wavelength separation X-ray detector.
FeNi ordered alloy, FeNi ordered alloy magnet, and method for manufacturing FeNi ordered alloy
An FeNi ordered alloy has an L1.sub.0 ordered structure, a mean order degree of 0.4 or more throughout a material, and a coercivity of 87.5 kA/m or more. For example, a nitriding treatment of an FeNi random alloy is performed and then a nitriding treatment is performed to obtain an L1.sub.0-FeNi ordered alloy. A volume mean particle size of a FeNi random alloy is, for example, 45 nm or more, and a treatment temperature of the nitriding treatment is, for example, greater than or equal to 300 degrees Celsius and is less than or equal to 500 degrees Celsius, and a treatment period is, for example, 10 hours or longer.
Method of Producing Sintered Magnet
A method of producing a sintered magnet is disclosed herein. In some embodiments, a method of producing a sintered magnet comprises, sintering a R—Fe—B based magnetic powder to produce a sintered magnet; wherein the R is Nd, Pr, Dy, Ce or Tb, and infiltrating a eutectic alloy into the sintered magnet, wherein the eutectic alloy contains Pr, Al, Cu and Ga, and wherein infiltration the eutectic alloy includes applying the eutectic alloy to the sintered magnet and heat-treating the sintered magnet to which the eutectic alloy is applied.
Method of Producing Sintered Magnet
A method of producing a sintered magnet is disclosed herein. In some embodiments, a method of producing a sintered magnet comprises, sintering a R—Fe—B based magnetic powder to produce a sintered magnet; wherein the R is Nd, Pr, Dy, Ce or Tb, and infiltrating a eutectic alloy into the sintered magnet, wherein the eutectic alloy contains Pr, Al, Cu and Ga, and wherein infiltration the eutectic alloy includes applying the eutectic alloy to the sintered magnet and heat-treating the sintered magnet to which the eutectic alloy is applied.
Crystalline alloy having glass-forming ability, preparation method thereof, alloy target for sputtering, and preparation method thereof
Provided are a crystalline alloy having significantly better thermal stability than an amorphous alloy as well as glass-forming ability, and a method of manufacturing the crystalline alloy. The present invention also provides an alloy sputtering target that is manufactured by using the crystalline alloy, and a method of manufacturing the alloy target. According to an aspect of the present invention, provided is a crystalline alloy having glass-forming ability which is formed of three or more elements having glass-forming ability, wherein the average grain size of the alloy is in a range of 0.1 μm to 5 μm and the alloy includes 5 at % to 20 at % of aluminum (Al), 15 at % to 40 at % of any one or more selected from copper (Cu) and nickel (Ni), and the remainder being zirconium (Zr).