A process includes sintering hydrogenated titanium or titanium hydride (TiH.sub.2) and/or Ti metal in a dynamically controlled hydrogen atmosphere with hydrogen partial pressure greater than 0.01 atmosphere and at elevated temperature, to form a sintered titanium material; equilibrate the sintered material at an equilibration temperature below the sintering temperature and above the phase transformations including eutectoid decomposition temperature for an equilibration time sufficient for the hydrogen within the sample to reach equilibrium and homogenize the sintered titanium material; holding the sintered titanium material at a hold temperature below the temperature of sintering and a hold time sufficient for phase transformations including eutectoid decomposition of the sintered titanium material; and heating the sintered titanium material under vacuum, inert atmosphere, or a combination of both at a hold temperature which is less than that of the sintering temperature, to form titanium metal, or a titanium metal alloy with fine or ultrafine grain sizes; where the dynamically controlled hydrogen atmosphere varies as a function of time and temperature throughout the thermal cycle and includes hydrogen during the sintering and phase transformations including eutectoid decomposition steps.

A method can include pressing material to form a billet where the material includes aluminum and one or more metals selected from a group consisting of alkali metals, alkaline earth metals, group 12 transition metals, and basic metals having an atomic number equal to or greater than 31; extruding the billet to form extrudate; and forming a degradable component from the extrudate.

A metal powder contains not less than 0.10 mass % and not more than 1.00 mass % of at least one of chromium and silicon, and a balance of copper. The total content of the chromium and the silicon is not more than 1.00 mass %. In accordance with an additive manufacturing method for this metal powder, an additively-manufactured article made from a copper alloy is provided. The additively-manufactured article has both an adequate mechanical strength and an adequate electrical conductivity.

Disclosed is a method for preparing vanadium or vanadium alloy powder from a vanadium-containing raw material through a shortened process, including: calcinating a mixture of a vanadium-containing raw material and an alkali compound for oxidation to form a water-soluble vanadate; purifying the vanadate followed by vanadium precipitation to produce an intermediate CaV.sub.2O.sub.6 with high purity; dissolving CaV.sub.2O.sub.6 in a molten-salt medium together with other raw materials to form a uniform reaction system; and introducing a reducing agent to the system followed by separation, washing and drying to produce vanadium or vanadium alloy powder having a particle size of 50-800 nm and a purity of 99.0 wt % or more. The method can continuously process vanadium-containing raw materials to prepare vanadium or vanadium alloy powder.

Provided is a tungsten sintered compact sputtering target containing iron as an impurity in an amount of 0.8 wtppm or less, and remainder being tungsten and other unavoidable impurities, wherein a range of iron concentration in a target structure is within a range of ±0.1 wtppm of an average concentration. Additionally provided is a tungsten sintered compact sputtering target, wherein a relative density of the target is 99% or higher, an average crystal grain size is 50 μm or less, and a crystal grain size range is 5 to 200 μm. The present invention aims to inhibit abnormal grain growth in the tungsten target by reducing the amount of iron in the tungsten sintered compact sputtering target.

A porous aluminum body having high porosity and a manufacturing method therefor are provided, wherein the porous aluminum body can be manufactured by continuous manufacturing steps. In the present invention, this porous aluminum body includes a plurality of aluminum fibers connected to each other. The aluminum fibers each have a plurality of columnar protrusions formed at intervals on an outer peripheral surface of the aluminum fibers, the columnar protrusions protruding outward from the outer peripheral surface. Adjacent aluminum fibers are integrated with the aluminum fibers and the columnar protrusions.

A method for preparing a tantalum power of capacitor grade, comprising: solid tantalum nitride is added when potassium fluotantalate is reduced by sodium. The method increases the nitrogen content in the tantalum powder, and at the same time improves the electrical performance of the tantalum powder. The specific capacitance is increased, and the leakage current and loss is improved. The qualification rate of the anode and the capacitor product is also improved. The method is characterized in that the nitrogen in the tantalum nitride diffuses between the particles of the tantalum powder, with substantially no loss, and thus the nitrogen content is accurate and controllable.

Methods of forming dispersoid hardened metallic materials are provided. In an exemplary embodiment, a method of producing dispersoid hardened metallic materials includes forming a starting composition with a base metal component and a dispersoid forming component. The starting composition includes the base metal component in an amount from about 50 to about 99.999 weight percent and the dispersoid forming component in an amount from about 0.001 to about 1 weight percent, based on the total weight of the starting composition. A starting powder is formed from the starting composition, and the starting powder is fluidized with a fluidizing gas for a period of time sufficient to oxidize the dispersoid forming component to form the dispersoid hardened metallic material. The dispersoid forming component is oxidized while the starting powder is a solid.

A metallization for a thin-film component includes at least one layer composed of an Mo-based alloy containing Al and Ti and usual impurities. A process for producing a metallization includes providing at least one sputtering target, depositing at least one layer of an Mo-based alloy containing Al and Ti and usual impurities, and structuring the metallization by using at least one photolithographic process and at least one subsequent etching step. A sputtering target is composed of an Mo-based alloy containing Al and Ti and usual impurities. A process for producing a sputtering target composed of an Mo-based alloy includes providing a powder mixture containing Mo and also Al and Ti and cold gas spraying (CGS) of the powder mixture onto a suitable support material.

The present invention provides an alloy fine particle including palladium and ruthenium, the alloy fine particle including at least one first phase in which the palladium is more abundant than the ruthenium and at least one second phase in which the ruthenium is more abundant than the palladium, the at least one first phase and the at least one second phase being separated by a phase boundary, the palladium and the ruthenium being distributed in the phase boundary in such a manner that the molar ratio of the palladium and the ruthenium continually changes, a plurality of crystalline structures being present together in the phase boundary.