To provide a sliding member including an overlay capable of realizing good fatigue resistance while preventing interlayer peeling. A sliding member including an overlay formed of an alloy plating film of Bi and Sb, and the overlay is bonded to a lining formed of a copper alloy via an intermediate layer containing Ag as a main component.

To provide a sliding member including an overlay capable of realizing good fatigue resistance while preventing interlayer peeling. A sliding member including an overlay formed of an alloy plating film of Bi and Sb, and the overlay is bonded to a lining formed of a copper alloy via an intermediate layer containing Ag as a main component.

A sealing composition which can be handled in a semi-cured state and can obtain a sintered body having excellent joining strength and sealing performance is provided. A sealing composition including a solder powder, coated silver particles including silver core particles and a coating agent arranged on a surface of the silver core particles, and a solvent is provided. Further, a sintering temperature (T2) of the coated silver particles and a boiling point (T3) of the solvent satisfy T2≤T3.

The present disclosure relates generally to wires and more particularly to textured powder wires containing nanoscale metallic silver powder. The invention presents an improvement of the process of making compressed cores of textured-powder high-temperature superconductor previously using the micaceous high-temperature superconductor Bi-2212. Embodiments of the claimed methods are useful with the micaceous high-temperature superconductors, notably Bi2Sr2CaCu2O8+x (Bi-2212) and Bi2Sr2Ca2Cu3O10+x (Bi-2223) and rare earth barium copper oxide (REBCO).

A metal sintering preparation containing (A) 50 to 90% by weight of at least one metal that is present in the form of particles having a coating that contains at least one organic compound, and (B) 6 to 50% by weight organic solvent. The mathematical product of tamped density and specific surface of the metal particles of component (A) is in the range of 40,000 to 80,000 cm.sup.−1.

A metal sintering preparation containing (A) 50 to 90% by weight of at least one metal that is present in the form of particles having a coating that contains at least one organic compound, and (B) 6 to 50% by weight organic solvent. The mathematical product of tamped density and specific surface of the metal particles of component (A) is in the range of 40,000 to 80,000 cm.sup.−1.

The present invention relates to a sputtering target, comprising a silver alloy comprising a first element, selected from indium, tin, antimony and bismuth, in an amount of 0.01 to 2 wt. %, based on the total weight of the silver alloy, and 0.01 to 2 wt. % titanium, based on the total weight of the silver alloy, and having an average grain size of no more than 55 μm.

The present invention relates to a sputtering target, comprising a silver alloy comprising a first element, selected from indium, tin, antimony and bismuth, in an amount of 0.01 to 2 wt. %, based on the total weight of the silver alloy, and 0.01 to 2 wt. % titanium, based on the total weight of the silver alloy, and having an average grain size of no more than 55 μm.

A device including a near field transducer, the near field transducer including gold (Au) and at least one other secondary atom, the at least one other secondary atom selected from: boron (B), bismuth (Bi), indium (In), sulfur (S), silicon (Si), tin (Sn), hafnium (Hf), niobium (Nb), manganese (Mn), antimony (Sb), tellurium (Te), carbon (C), nitrogen (N), and oxygen (O), and combinations thereof; erbium (Er), holmium (Ho), lutetium (Lu), praseodymium (Pr), scandium (Sc), uranium (U), zinc (Zn), and combinations thereof; and barium (Ba), chlorine (Cl), cesium (Cs), dysprosium (Dy), europium (Eu), fluorine (F), gadolinium (Gd), germanium (Ge), hydrogen (H), iodine (I), osmium (Os), phosphorus (P), rubidium (Rb), rhenium (Re), selenium (Se), samarium (Sm), terbium (Tb), thallium (Th), and combinations thereof.

A device including a near field transducer, the near field transducer including gold (Au) and at least one other secondary atom, the at least one other secondary atom selected from: boron (B), bismuth (Bi), indium (In), sulfur (S), silicon (Si), tin (Sn), hafnium (Hf), niobium (Nb), manganese (Mn), antimony (Sb), tellurium (Te), carbon (C), nitrogen (N), and oxygen (O), and combinations thereof; erbium (Er), holmium (Ho), lutetium (Lu), praseodymium (Pr), scandium (Sc), uranium (U), zinc (Zn), and combinations thereof; and barium (Ba), chlorine (Cl), cesium (Cs), dysprosium (Dy), europium (Eu), fluorine (F), gadolinium (Gd), germanium (Ge), hydrogen (H), iodine (I), osmium (Os), phosphorus (P), rubidium (Rb), rhenium (Re), selenium (Se), samarium (Sm), terbium (Tb), thallium (Th), and combinations thereof.