The present invention provides compositions and methods of making bimetallic metal alloys of composition for example, Rh/Pd; Rh/Pt; Rh/Ag; Rh/Au; Rh/Ru; Rh/Co; Rh/Ir; Rh/Ni; Ir/Pd; Ir/Pt; Ir/Ag; Ir/Au; Pd/Ni; Pd/Pt; Pd/Ag; Pd/Au; Pt/Ni; Pt/Ag; Pt/Au; Ni/Ag; Ni/Au; or Ag/Au prepared using microwave irradiation.

The present invention provides compositions and methods of making bimetallic metal alloys of composition for example, Rh/Pd; Rh/Pt; Rh/Ag; Rh/Au; Rh/Ru; Rh/Co; Rh/Ir; Rh/Ni; Ir/Pd; Ir/Pt; Ir/Ag; Ir/Au; Pd/Ni; Pd/Pt; Pd/Ag; Pd/Au; Pt/Ni; Pt/Ag; Pt/Au; Ni/Ag; Ni/Au; or Ag/Au prepared using microwave irradiation.

A wire comprising a wire core with a surface, the wire core having a coating layer superimposed on its surface, wherein the wire core itself consists of: (a) pure silver consisting of (a1) silver in an amount in the range of from 99.99 to 100 wt.-% and (a2) further components in a total amount of from 0 to 100 wt.-ppm or (b) doped silver consisting of (b1) silver in an amount in the range of from >99.49 to 99.997 wt.-%, (b2) at least one doping element selected from the group consisting of calcium, nickel, platinum, palladium, gold, copper, rhodium and ruthenium in a total amount of from 30 to <5000 wt.-ppm and (b3) further components in a total amount of from 0 to 100 wt.-ppm, or (c) a silver alloy consisting of (c1) silver in an amount in the range of from 89.99 to 99.5 wt.-%, (c2) at least one alloying element selected from the group consisting of nickel, platinum, palladium, gold, copper, rhodium and ruthenium in a total amount in the range of from 0.5 to 10 wt.-% and (c3) further components in a total amount of from 0 to 100 wt.-ppm, or (d) a doped silver alloy consisting of (d1) silver in an amount in the range of from >89.49 to 99.497 wt.-%, (d2) at least one doping element selected from the group consisting of calcium, nickel, platinum, palladium, gold, copper, rhodium and ruthenium in a total amount of from 30 to <5000 wt.-ppm, (d3) at least one alloying element selected from the group consisting of nickel, platinum, palladium, gold, copper, rhodium and ruthenium in a total amount in the range of from 0.5 to 10 wt.-% and (d4) further components in a total amount of from 0 to 100 wt.-ppm, wherein the at least one doping element (d2) is other than the at least one alloying element (d3), wherein the individual amount of any further component is less than 30 wt.-ppm, wherein the individual amount of any doping element is at least 30 wt.-ppm, wherein all amounts in wt.-% and wt.-ppm are based on the total weight of the core, and wherein the coating layer is a double-layer comprised of a 1 to 1000 nm inner layer of gold and an adjacent 0.5 to 100 nm thick outer layer of palladium or a double-layer comprised of a 0.5 to 100 nm thick inner layer of palladium and an adjacent >200 to 1000 nm thick outer layer of gold.

The present invention is a clad material for an electric contact, including a base material composed of a Cu-based, precipitation-type age-hardening material, and a contact material composed of an Ag alloy bonded to the base material. On a bonded interface between the contact material and the base material, a width of a diffusion region including Ag and Cu is 2.0 μm or shorter. The clad material is produced by bonding each other the contact material and the base material having undergone solutionizing and age-hardening beforehand, suppressing the diffusion region from expanding after bonding. The present invention is capable of providing an electric contact, which achieves higher conductivity, without sacrificing property of the Cu-based, precipitation-type age-hardening material.

The present invention is a clad material for an electric contact, including a base material composed of a Cu-based, precipitation-type age-hardening material, and a contact material composed of an Ag alloy bonded to the base material. On a bonded interface between the contact material and the base material, a width of a diffusion region including Ag and Cu is 2.0 μm or shorter. The clad material is produced by bonding each other the contact material and the base material having undergone solutionizing and age-hardening beforehand, suppressing the diffusion region from expanding after bonding. The present invention is capable of providing an electric contact, which achieves higher conductivity, without sacrificing property of the Cu-based, precipitation-type age-hardening material.

The present disclosure provides an electrode having a first indium zinc oxide film, a metal film, and a second indium zinc oxide film which are laminated in sequence, in which the metal film is made of an Ag alloy. The first indium zinc oxide film has a thickness ranging from 5 nm to 40 nm; the metal film has a thickness ranging from 80 nm to 160 nm; and the second indium zinc oxide film has a thickness ranging from 5 nm to 40 nm. The electrode is applicable to organic light emitting diode (OLED) display technology or flexible OLED display technology.

An object of the present invention is to provide an electrically conductive paste and a sintered body thereof having a low electric resistance value and excellent electrical conductivity when made into a sintered body.

An electrically conductive paste comprising: a flake-like silver powder having a median diameter D50 of 15 μm or less; a silver powder having a median diameter D50 of 25 μm or more; and a solvent, wherein the content of the flake-like silver powder is 15 to 70 parts by mass and the content of the silver powder having a median diameter D50 of 25 μm or more is 30 to 85 parts by mass based on 100 parts by mass in total of the flake-like silver powder and the silver powder having a median diameter D50 of 25 μm or more.

A metallic material that includes a base material; and a surface layer formed on a surface of the base material and exposed on an outermost surface, wherein the surface layer contains Ag, and In less than the Ag in atomic ratio, and a connection terminal being made of the metallic material, wherein the surface layer is formed on a surface of the base material, at least in a contact portion electrically contacting an opposite electrically conductive member.

A metallic material that includes a base material; and a surface layer formed on a surface of the base material and exposed on an outermost surface, wherein the surface layer contains Ag, and In less than the Ag in atomic ratio, and a connection terminal being made of the metallic material, wherein the surface layer is formed on a surface of the base material, at least in a contact portion electrically contacting an opposite electrically conductive member.

An additive manufacturing process includes applying a layer of a building material on a building support or an already applied and selectively solidified layer and selectively solidifying the applied layer by electromagnetic radiation or particle radiation. All positions in the layer that correspond to a cross-section of the object are scanned by electromagnetic radiation or particle radiation such that at these positions the powder is melted at least at its surface. At least one cross-section includes an inner region and a surface region. The step of applying a layer and the step of selectively solidifying the layer are repeated until all cross-sections of the object are solidified. At least a portion of the surface region is scanned at least twice before scanning of the inner region starts.