Patent classifications
C22C5/06
Glazing and method of its production
The present document discloses a glazing in the form of a window glass or vehicle glass which comprises a transparent glass substrate, and a coating, which comprises at least one functional metal Ag alloy coating layer. The alloy coating layer consists essentially of Ag with an alloying agent selected from a group consisting of Mg, Al, Si, Ca, Ti, V, Cr, Mn, Fe, Ni, Cu, Zn, Ge, Zr, Nb, Mo, In, Sn, Hf, Ta or W. An alloying agent concentration is 0.15-1.35 at. %, preferably 0.20-1.00 at. % or 0.25-0.80 at. % of the Ag alloy coating layer, the rest being Ag, and the Ag alloy coating layer has a thickness of 5-20 nm, preferably 8-15 nm or more preferably 8-12 nm.
Glazing and method of its production
The present document discloses a glazing in the form of a window glass or vehicle glass which comprises a transparent glass substrate, and a coating, which comprises at least one functional metal Ag alloy coating layer. The alloy coating layer consists essentially of Ag with an alloying agent selected from a group consisting of Mg, Al, Si, Ca, Ti, V, Cr, Mn, Fe, Ni, Cu, Zn, Ge, Zr, Nb, Mo, In, Sn, Hf, Ta or W. An alloying agent concentration is 0.15-1.35 at. %, preferably 0.20-1.00 at. % or 0.25-0.80 at. % of the Ag alloy coating layer, the rest being Ag, and the Ag alloy coating layer has a thickness of 5-20 nm, preferably 8-15 nm or more preferably 8-12 nm.
BONDING WIRE FOR SEMICONDUCTOR DEVICE
The present invention provides a bonding wire capable of simultaneously satisfying ball bonding reliability and wedge bondability required of bonding wires for memories, the bonding wire including a core material containing one or more of Ga, In, and Sn for a total of 0.1 to 3.0 at % with a balance being made up of Ag and incidental impurities; and a coating layer formed over a surface of the core material, containing one or more of Pd and Pt, or Ag and one or more of Pd and Pt, with a balance being made up of incidental impurities, wherein the coating layer is 0.005 to 0.070 μm in thickness.
CONNECTOR TERMINAL PAIR
An electric contact pair includes a first electric contact, and a second electric contact to be brought into electrical contact with the first electric contact. The first electric contact includes a first plating film made of Ag or a Ag alloy on its outermost surface, and the second electric contact includes a second plating film made of Rh or a Rh alloy on its outermost surface. The first plating film maybe layered on a first conductive base material, the second plating film maybe layered on a second conductive base material, and the first conductive base material and the second conductive base material are made of copper or a copper alloy, or aluminum or an aluminum alloy. A connector terminal pair includes a first terminal including the first electric contact, and a second terminal including the second electric contact.
SILVER ALLOY CLAD STRUCTURE FOR CHARGING TERMINALS AND MANUFACTURING METHOD THEREOF
A layered structure for forming charging terminals for high power applications. In some embodiments, the layered structure may include a substrate and a contact layer disposed over at least a portion of the substrate. The substrate may have a conductivity greater than 40% International Annealed Copper Standard (IACS). The contact layer may demonstrate a coefficient of friction of less than 1.4, such as from 0.1 to 1.4, as measured in accordance with American Society of Testing and Materials (ASTM) G99-17. The contact layer may include a precious-metal-based alloy, such as a silver-samarium alloy.
HUMIDITY SENSOR BASED ON SQUARAINE POLYMER, PREPARATION METHOD AND USE THEREOF
The invention discloses a humidity sensor based on squaraine polymer and the preparation method and use thereof. Specifically, the humidity sensor disclosed by the invention comprises a coating material and an interdigital electrode, wherein the coating material is a squaraine polymer as shown in formula I, n is an integer of 40-50, the coating material is brushed on the interdigital electrode, and the thickness is 100-400 microns. The humidity sensor disclosed by the invention has the advantages that the preparation is convenient, and the operation is simple; the response time is short, and the response for humidity change is higher than that of common metallic oxides; the recovery time is short, and the device performance is stable; the humidity hysteresis of the device is high under high humidity environment.
HUMIDITY SENSOR BASED ON SQUARAINE POLYMER, PREPARATION METHOD AND USE THEREOF
The invention discloses a humidity sensor based on squaraine polymer and the preparation method and use thereof. Specifically, the humidity sensor disclosed by the invention comprises a coating material and an interdigital electrode, wherein the coating material is a squaraine polymer as shown in formula I, n is an integer of 40-50, the coating material is brushed on the interdigital electrode, and the thickness is 100-400 microns. The humidity sensor disclosed by the invention has the advantages that the preparation is convenient, and the operation is simple; the response time is short, and the response for humidity change is higher than that of common metallic oxides; the recovery time is short, and the device performance is stable; the humidity hysteresis of the device is high under high humidity environment.
AG ALLOY FILM FOR REFLECTING ELECTRODE OR WIRING ELECTRODE, REFLECTING ELECTRODE OR WIRING ELECTRODE, AND AG ALLOY SPUTTERING TARGET
An Ag alloy film used for a reflecting electrode or an interconnection electrode, the Ag alloy film exhibiting low electrical resistivity and high reflectivity and having exceptional oxidation resistance under cleaning treatments such as an O.sub.2 plasma treatment or UV irradiation, wherein the Ag alloy film contains either In in an amount of larger than 2.0 atomic % to 2.7 atomic % or smaller; or Zn in an amount of larger than 2.0 atomic % to 3.5 atomic % or smaller; or both. The Ag alloy film may further contain Bi in an amount of 0.01 to 1.0 atomic %.
AG ALLOY FILM FOR REFLECTING ELECTRODE OR WIRING ELECTRODE, REFLECTING ELECTRODE OR WIRING ELECTRODE, AND AG ALLOY SPUTTERING TARGET
An Ag alloy film used for a reflecting electrode or an interconnection electrode, the Ag alloy film exhibiting low electrical resistivity and high reflectivity and having exceptional oxidation resistance under cleaning treatments such as an O.sub.2 plasma treatment or UV irradiation, wherein the Ag alloy film contains either In in an amount of larger than 2.0 atomic % to 2.7 atomic % or smaller; or Zn in an amount of larger than 2.0 atomic % to 3.5 atomic % or smaller; or both. The Ag alloy film may further contain Bi in an amount of 0.01 to 1.0 atomic %.
Silver powder
Provided is a silver powder which has an appropriate viscosity range at the time of paste production, can be easily kneaded, and prevents the occurrence of flakes. The silver powder to be used has a specific surface area ratio SA.sub.B/SA.sub.S of 0.5 to 0.9, wherein SA.sub.B is a specific surface area measured by the BET method, and SA.sub.S is a specific surface area calculated from a mean primary-particle diameter D.sub.S measured with a scanning electron microscope. Furthermore, the silver powder preferably has a degree of aggregation of 1.5 to 5.0, the degree being obtained in such a manner that a volume median diameter D.sub.50 measured by laser diffraction scattering is divided by the foregoing Ds.