Patent classifications
C22C5/06
METAL SINTERING PREPARATION AND THE USE THEREOF FOR THE CONNECTING OF COMPONENTS
A metal sintering preparation containing (A) 50 to 90% by weight of at least one metal that is present in the form of particles having a coating that contains at least one organic compound, and (B) 6 to 50% by weight organic solvent. The mathematical product of tamped density and specific surface of the metal particles of component (A) is in the range of 40,000 to 80,000 cm.sup.−1.
METHOD FOR THE DETERMINATION OF THE REPRESENTATIVE HOMOTOP OF A BINARY METALLIC NANOPARTICLE (AxB1-x)N AND METHOD FOR MANUFACTURING THE CORRESPONDING NANOPARTICLE
A method for the manufacturing a representative homotop of a binary metallic nanoparticle (A.sub.xB.sub.1-x).sub.N with a given composition A.sub.xB.sub.1-x, number of atoms N and shape, and at a given temperature, including generating a plurality of homotops, calculating an energy of the generate homotops using formula:
where E.sub.0(x, N) is constant for a given particle, ε.sub.BOND.sup.A-B(x) is related to an energy gain caused by the mixing of both metals, N.sub.BOND.sup.A-B is a number of heteroatomic
METHOD FOR THE DETERMINATION OF THE REPRESENTATIVE HOMOTOP OF A BINARY METALLIC NANOPARTICLE (AxB1-x)N AND METHOD FOR MANUFACTURING THE CORRESPONDING NANOPARTICLE
A method for the manufacturing a representative homotop of a binary metallic nanoparticle (A.sub.xB.sub.1-x).sub.N with a given composition A.sub.xB.sub.1-x, number of atoms N and shape, and at a given temperature, including generating a plurality of homotops, calculating an energy of the generate homotops using formula:
where E.sub.0(x, N) is constant for a given particle, ε.sub.BOND.sup.A-B(x) is related to an energy gain caused by the mixing of both metals, N.sub.BOND.sup.A-B is a number of heteroatomic
Brazing material, brazing material paste, ceramic circuit substrate, ceramic master circuit substrate, and power semiconductor module
To provide a brazing material for maintaining bonding strength between ceramic substrate and metal plate at a conventionally attainable level, while addition amount of In is reduced, and a brazing material paste using the same. A mixture powder provided by mixing alloy powder composed of Ag, In, and Cu, Ag powder, and active metal hydride powder, the mixture powder containing active metal hydride powder with a 10-to-25-μm equivalent circle average particle diameter by 0.5 to 5.0 mass %, the equivalent circle average particle diameters for the alloy powder, Ag powder, and active metal hydride powder having a relationship: alloy powder≧active metal hydride powder>Ag powder, and the powder mixture having a particle size distribution of d10 of 3 to 10 μm, d50 of 10 to 35 μm, and d90 of 30 to 50 μm, and in the frequency distribution, a peak of the distribution existing between d50 and d90.
Brazing material, brazing material paste, ceramic circuit substrate, ceramic master circuit substrate, and power semiconductor module
To provide a brazing material for maintaining bonding strength between ceramic substrate and metal plate at a conventionally attainable level, while addition amount of In is reduced, and a brazing material paste using the same. A mixture powder provided by mixing alloy powder composed of Ag, In, and Cu, Ag powder, and active metal hydride powder, the mixture powder containing active metal hydride powder with a 10-to-25-μm equivalent circle average particle diameter by 0.5 to 5.0 mass %, the equivalent circle average particle diameters for the alloy powder, Ag powder, and active metal hydride powder having a relationship: alloy powder≧active metal hydride powder>Ag powder, and the powder mixture having a particle size distribution of d10 of 3 to 10 μm, d50 of 10 to 35 μm, and d90 of 30 to 50 μm, and in the frequency distribution, a peak of the distribution existing between d50 and d90.
Method for producing silver nano-particles and silver nano-particles
The present invention provides a silver nano-particle production method which is safe and simple also in terms of scaled-up industrial-level production, in a so-called thermal decomposition method in which a silver-amine complex compound is thermally decomposed to form silver nano-particles. A method for producing silver nano-particles comprising: mixing an aliphatic hydrocarbon amine and a silver compound in the presence of an alcohol solvent having 3 or more carbon atoms to form a complex compound comprising the silver compound and the amine; and thermally decomposing the complex compound by heating to form silver nano-particles.
Method for producing silver nano-particles and silver nano-particles
The present invention provides a silver nano-particle production method which is safe and simple also in terms of scaled-up industrial-level production, in a so-called thermal decomposition method in which a silver-amine complex compound is thermally decomposed to form silver nano-particles. A method for producing silver nano-particles comprising: mixing an aliphatic hydrocarbon amine and a silver compound in the presence of an alcohol solvent having 3 or more carbon atoms to form a complex compound comprising the silver compound and the amine; and thermally decomposing the complex compound by heating to form silver nano-particles.
METHOD OF FORMING AN ELONGATE ELECTRICAL CONNECTION FEATURE TRAVERSING A MICROSCOPIC STEP
A method of forming an elongate electrical connection feature that traverses at least one step on or in a substrate is disclosed. A metallic nanoparticle composition is extruded from a capillary tube while the capillary tube is displaced relative to the substrate. The method includes: (1) continuously extruding the composition from the capillary tube while displacing the capillary tube by a height increment during a displacement period; (2) continuously extruding the composition from the capillary tube while the capillary tube is stationary during a stationary period; and (3) repeatedly executing (1) and (2) until the capillary tube is displaced from a position at a step bottom portion to another position at a height not lower than a step top portion.
Silver powder and method for producing same
A method for producing silver powder wherein a silver solution containing a silver complex and a reductant solution are continuously mixed to provide a reaction liquid, the method including: a step of preparing a silver nucleus solution wherein a silver solution for nucleation which contains a silver complex, a solution containing a strong reductant, and a dispersant are mixed to provide the silver nucleus solution; a step of preparing a reductant solution containing nuclei wherein the silver nucleus solution obtained and a weak reductant having a standard electrode potential higher than that of the strong reductant are mixed to obtain the reductant solution containing nuclei; and a step of growing particles wherein the reductant solution containing nuclei and a silver solution for particle growth containing a silver complex are continuously mixed to provide a reaction solution, in which the silver complex is reduced to thereby grow silver particles.
Silver powder and method for producing same
A method for producing silver powder wherein a silver solution containing a silver complex and a reductant solution are continuously mixed to provide a reaction liquid, the method including: a step of preparing a silver nucleus solution wherein a silver solution for nucleation which contains a silver complex, a solution containing a strong reductant, and a dispersant are mixed to provide the silver nucleus solution; a step of preparing a reductant solution containing nuclei wherein the silver nucleus solution obtained and a weak reductant having a standard electrode potential higher than that of the strong reductant are mixed to obtain the reductant solution containing nuclei; and a step of growing particles wherein the reductant solution containing nuclei and a silver solution for particle growth containing a silver complex are continuously mixed to provide a reaction solution, in which the silver complex is reduced to thereby grow silver particles.