A solder paste that contains or consists of (i) 10-30% by weight of at least one type of particles that each contain a phosphorus fraction of >0 to ≦500 wt-ppm and are selected from copper particles, copper-rich copper/zinc alloy particles, and copper-rich copper/tin alloy particles, (ii) 60-80% by weight of at least one type of particles selected from tin particles, tin-rich tin/copper alloy particles, tin-rich tin/silver alloy particles, and tin-rich tin/copper/silver alloy particles, and (iii) 3-30% by weight solder flux, in which the mean particle diameter of metallic particles (i) and (ii) is ≦15 μm.

A solder paste that contains or consists of (i) 10-30% by weight of at least one type of particles that each contain a phosphorus fraction of >0 to ≦500 wt-ppm and are selected from copper particles, copper-rich copper/zinc alloy particles, and copper-rich copper/tin alloy particles, (ii) 60-80% by weight of at least one type of particles selected from tin particles, tin-rich tin/copper alloy particles, tin-rich tin/silver alloy particles, and tin-rich tin/copper/silver alloy particles, and (iii) 3-30% by weight solder flux, in which the mean particle diameter of metallic particles (i) and (ii) is ≦15 μm.

A wear resistant hydraulics system includes a first copper-based alloy having a formula (I), Cu.sub.aSn.sub.bZn.sub.cM.sub.d, where M is a combination of up to six transition metals, metalloids, and/or alkali metals, a is any number between 0.50 and 0.93, b is any number between 0.00 and 0.07, c is any number between 0.00 and 0.40, and d is any number between 0.01 and 0.40, and a second copper-based alloy including at least 50 wt. % of Cu, based on the total weight of the alloy; and at least one compound of formula (II) A.sub.xB.sub.y, where A is Cu, Sn, or Zn, B is Co, Cr, In, Mn, Mo, Ni, Rb, Sb, Te, or Ti, x is any number between 1 and 53, and y is any number between 1 and 16, the first or second alloy having a bulk modulus K.sub.VRH value of about 70 to 304 GPa.

A wear resistant hydraulics system includes a first copper-based alloy having a formula (I), Cu.sub.aSn.sub.bZn.sub.cM.sub.d, where M is a combination of up to six transition metals, metalloids, and/or alkali metals, a is any number between 0.50 and 0.93, b is any number between 0.00 and 0.07, c is any number between 0.00 and 0.40, and d is any number between 0.01 and 0.40, and a second copper-based alloy including at least 50 wt. % of Cu, based on the total weight of the alloy; and at least one compound of formula (II) A.sub.xB.sub.y, where A is Cu, Sn, or Zn, B is Co, Cr, In, Mn, Mo, Ni, Rb, Sb, Te, or Ti, x is any number between 1 and 53, and y is any number between 1 and 16, the first or second alloy having a bulk modulus K.sub.VRH value of about 70 to 304 GPa.

Provided is a copper alloy for electronic and electrical equipment including: 0.15 mass % or greater and less than 0.35 mass % of Mg; 0.0005 mass % or greater and less than 0.01 mass % of P; and a remainder which is formed of Cu and unavoidable impurities, in which a conductivity is greater than 75% IACS, and an average number of compounds containing Mg and P with a particle diameter of 0.1 μm or greater is 0.5 pieces/μm.sup.2 or less in observation using a scanning electron microscope.

Provided is a copper alloy for electronic and electrical equipment including: 0.15 mass % or greater and less than 0.35 mass % of Mg; 0.0005 mass % or greater and less than 0.01 mass % of P; and a remainder which is formed of Cu and unavoidable impurities, in which a conductivity is greater than 75% IACS, and an average number of compounds containing Mg and P with a particle diameter of 0.1 μm or greater is 0.5 pieces/μm.sup.2 or less in observation using a scanning electron microscope.

A flux core wire for a welding method, having a tubular wire sheath, a wire core of flux powder, which is surrounded by the tubular wire sheath, wherein the wire sheath and the wire core have a composition such that during the welding a melt of CuSn.sub.12Ni.sub.2 materialises.

Processes for forming an electric heater comprise providing a heater element and a power supply, applying a layer of a diffusion solder paste onto the heater element and/or the power supply and drying the applied diffusion solder paste, arranging the heater element and the power supply such that the heater element and the power supply contact each other via the dried diffusion solder paste, and diffusion soldering the arrangement to form a connection between the heater element and the power supply. The diffusion solder paste comprises or consists of 10-30 wt.-% of at least one type of particles selected from the group consisting of copper particles, copper-rich copper/zinc alloy particles, and copper-rich copper/tin alloy particles, 60-80 wt.-% of at least one type of particles selected from tin particles, tin-rich tin/copper alloy particles, tin-rich tin/silver alloy particles, and tin-rich tin/copper/silver alloy particles, and 3-30 wt.-% of a solder flux.

A sliding member includes a back-metal layer including an Fe alloy and a sliding layer including a copper alloy including 0.5 to 12 mass % of Sn and the balance of Cu and inevitable impurities. The sliding layer has a cross-sectional structure perpendicular to a sliding surface of the sliding layer. The cross-sectional structure includes first copper alloy grains that are in contact with a bonding surface of the back-metal layer and second copper alloy grains that are not in contact with the bonding surface. The first copper alloy grains has an average grain size D1 and the second copper alloy grains has an average grain size D2. D1 and D2 satisfy the following relations: D1 is 30 to 80 μm; and D1/D2=0.1 to 0.3.

A soldering material (1) for active soldering, in particular for active soldering of a metallization (3) to a carrier layer (2) comprising ceramics, wherein the soldering material comprises copper and is substantially silver-free.