A soldering material (1) for active soldering, in particular for active soldering of a metallization (3) to a carrier layer (2) comprising ceramics, wherein the soldering material comprises copper and is substantially silver-free.

A terminal includes a connecting portion to be electrically connected to a mating terminal by being inserted into the mating terminal. The connecting portion has a sliding region configured to slide on the mating terminal and a contact region configured to contact the mating terminal successively from a tip side. An outermost surface in the sliding region includes a copper-tin alloy layer containing copper and tin. An outermost surface in the contact region includes a tin layer containing tin as a main component. A Vickers hardness of the copper-tin alloy layer is higher than a Vickers hardness of the tin layer.

Disclosed is a conductive ink composition and a manufacturing method thereof. The composition includes about 50 to about 99 wt % copper nanoparticles and about 1 to about 50 wt % tin. Copper nanoparticles are atomized and suspended in a tin bath, wherein the copper nanoparticles are evenly dispersed within the bath through sonification. The composition is cooled, extracted, and formed into a filament for use as a conductive ink. The ink has a resistivity of about 46.2×E−9 Ω*m to about 742.5×E−9 Ω*m. Once in filament form, the tin-copper mix will be viable for material extrusion, thus allowing for a lower cost, electrically conductive traces to be used in additive manufacturing.

Disclosed is a conductive ink composition and a manufacturing method thereof. The composition includes about 50 to about 99 wt % copper nanoparticles and about 1 to about 50 wt % tin. Copper nanoparticles are atomized and suspended in a tin bath, wherein the copper nanoparticles are evenly dispersed within the bath through sonification. The composition is cooled, extracted, and formed into a filament for use as a conductive ink. The ink has a resistivity of about 46.2×E−9 Ω*m to about 742.5×E−9 Ω*m. Once in filament form, the tin-copper mix will be viable for material extrusion, thus allowing for a lower cost, electrically conductive traces to be used in additive manufacturing.

A cold worked and spinodally-hardened copper alloy comprising from about 8 to about 20 wt % nickel, and from about 5 to about 11 wt % tin, the remaining balance being copper, and having a 0.2% offset yield strength of at least 75 ksi, is used to form a sucker rod coupling or subcoupling. Each coupling is formed from a core having two ends, each end having an internal thread. These box ends engage the pin of a sucker rod or other rod. The exterior surface of the core includes grooves running between the two ends.

A powder metallurgically produced, wear-resistant, and highly thermally conductive copper-based sintered alloy as matrix is disclosed. The sintered alloy includes a powder mixture of a copper-base powder, of a hard phase with a total share of 8 to 40% by weight, of a solid lubricant with a total share of 0.4 to 3.8% by weight, of a pressing additive with a total share of 0.3 to 1.5% by weight, and production-related impurities. The powder mixture includes at least 55% by weight of the copper-base powder.

A covered electrical wire comprises a conductor and an insulating covering layer provided outside the conductor, the conductor being a stranded wire composed of a strand of a plurality of copper alloy wires: composed of a copper alloy containing Fe in an amount of 0.2% by mass or more and 1.6% by mass or less, P in an amount of 0.05% by mass or more and 0.4% by mass or less, and Sn in an amount of 0.05% by mass or more and 0.7% by mass or less, with the balance being Cu and impurities, and having a mass ratio of Fe/P of 4.0 or more; and having a wire diameter of 0.5 mm or less.

A covered electrical wire comprises a conductor and an insulating covering layer provided outside the conductor, the conductor being a stranded wire composed of a strand of a plurality of copper alloy wires: composed of a copper alloy containing Fe in an amount of 0.2% by mass or more and 1.6% by mass or less, P in an amount of 0.05% by mass or more and 0.4% by mass or less, and Sn in an amount of 0.05% by mass or more and 0.7% by mass or less, with the balance being Cu and impurities, and having a mass ratio of Fe/P of 4.0 or more; and having a wire diameter of 0.5 mm or less.

A disclosed dilute copper metal composition has 57-85% wt Cu, ≥3.0% wt Ni, ≤0.8% wt Fe, 7-25% wt Sn and 3-15% wt Pb. A process includes partially b) oxidizing a black copper composition to obtain a first copper refining slag and a first enriched copper metal. The process further includes oxidizing h) the first enriched copper metal to obtain a second copper refining slag, whereby at least 37.0% wt of the amount of tin and lead processed through steps b) and/or h) is retrieved in the first and second copper refining slags together, partially reducing c) the first copper refining slag to form a first lead-tin based metal composition and a first spent slag, adding the second copper refining slag to the first lead-tin based metal composition thereby forming a first liquid bath, partially oxidizing d) the first liquid bath, thereby obtaining the dilute copper metal composition.

A disclosed dilute copper metal composition has 57-85% wt Cu, ≥3.0% wt Ni, ≤0.8% wt Fe, 7-25% wt Sn and 3-15% wt Pb. A process includes partially b) oxidizing a black copper composition to obtain a first copper refining slag and a first enriched copper metal. The process further includes oxidizing h) the first enriched copper metal to obtain a second copper refining slag, whereby at least 37.0% wt of the amount of tin and lead processed through steps b) and/or h) is retrieved in the first and second copper refining slags together, partially reducing c) the first copper refining slag to form a first lead-tin based metal composition and a first spent slag, adding the second copper refining slag to the first lead-tin based metal composition thereby forming a first liquid bath, partially oxidizing d) the first liquid bath, thereby obtaining the dilute copper metal composition.