Ag-free or low-Ag binder alloys are provided that can be used as binders for abrasive materials such as core drill bits. The alloys comprise, or consist of, Cu, Sn and Ni, with Cu preferably the plurality or majority component. Methods of manufacturing abrasive materials comprising the binder alloys, such as infiltration processes, are also disclosed.

Ag-free or low-Ag binder alloys are provided that can be used as binders for abrasive materials such as core drill bits. The alloys comprise, or consist of, Cu, Sn and Ni, with Cu preferably the plurality or majority component. Methods of manufacturing abrasive materials comprising the binder alloys, such as infiltration processes, are also disclosed.

Disclose is a copper alloy for a laser cladding valve seat. the copper alloy may include an amount of about 15.0 to 25.0 wt % of Ni, an amount of about 1.0 to 4.0 wt % of Si, an amount of about 0.5 to 1.0 wt % of B, an amount of about 1.0 to 2.0 wt % of Cr, an amount of about 5.0 to 15.0 wt % of Co, an amount of about 2.0 to 20.0 wt % of Mo, an amount of about 0.1 to 0.5 wt % of Ti and the balance Cu, all the wt % based on the total weight of the copper alloy. Particularly, the copper alloy may not include Fe, and may include Ti silicacide. Further disclosed is a laser cladding valve seat including the copper alloy, which does not generate cracks and is excellent in wear resistance.

Disclose is a copper alloy for a laser cladding valve seat. the copper alloy may include an amount of about 15.0 to 25.0 wt % of Ni, an amount of about 1.0 to 4.0 wt % of Si, an amount of about 0.5 to 1.0 wt % of B, an amount of about 1.0 to 2.0 wt % of Cr, an amount of about 5.0 to 15.0 wt % of Co, an amount of about 2.0 to 20.0 wt % of Mo, an amount of about 0.1 to 0.5 wt % of Ti and the balance Cu, all the wt % based on the total weight of the copper alloy. Particularly, the copper alloy may not include Fe, and may include Ti silicacide. Further disclosed is a laser cladding valve seat including the copper alloy, which does not generate cracks and is excellent in wear resistance.

A valve seat formed within an aluminum engine component includes a valve seat surface machined within the aluminum engine component, a layer of copper alloy material laser clad onto the valve seat surface of the aluminum engine component, the layer of copper alloy material having a thickness of less than 2.0 millimeters, and a layer of copper alloy/tool steel carbide material laser clad onto the layer of copper alloy material, the layer of copper alloy/tool steel carbide material having an average thickness of less than 0.5 millimeters, wherein the layer of copper alloy/tool steel carbide material has an outer surface that is machined to a final valve seat profile.

A valve seat formed within an aluminum engine component includes a valve seat surface machined within the aluminum engine component, a layer of copper alloy material laser clad onto the valve seat surface of the aluminum engine component, the layer of copper alloy material having a thickness of less than 2.0 millimeters, and a layer of copper alloy/tool steel carbide material laser clad onto the layer of copper alloy material, the layer of copper alloy/tool steel carbide material having an average thickness of less than 0.5 millimeters, wherein the layer of copper alloy/tool steel carbide material has an outer surface that is machined to a final valve seat profile.

A Cu—Ni—Si based copper alloy containing Ni and Si: in a center portion in a plate thickness direction, containing 0.4% by mass or more and 5.0% by mass or less of Ni, 0.05% by mass or more and 1.5% by mass or less of Si, and the balance Cu and inevitable impurities; where an Ni concentration on a plate surface is 70% or less of a center Ni concentration in the thickness center portion; a surface layer portion having a depth from the plate surface to be 90% of the center Ni concentration; in the surface layer portion, the Ni concentration increases from the plate surface toward the thickness center portion at 5.0% by mass/.Math.m or more and 100% by mass/.Math.m or less of a concentration gradient; to improve the electric connection reliability under high-temperature environment.

A Cu—Ni—Si based copper alloy containing Ni and Si: in a center portion in a plate thickness direction, containing 0.4% by mass or more and 5.0% by mass or less of Ni, 0.05% by mass or more and 1.5% by mass or less of Si, and the balance Cu and inevitable impurities; where an Ni concentration on a plate surface is 70% or less of a center Ni concentration in the thickness center portion; a surface layer portion having a depth from the plate surface to be 90% of the center Ni concentration; in the surface layer portion, the Ni concentration increases from the plate surface toward the thickness center portion at 5.0% by mass/.Math.m or more and 100% by mass/.Math.m or less of a concentration gradient; to improve the electric connection reliability under high-temperature environment.

There is provided a bonding wire for semiconductor devices that exhibits a favorable bondability even when being applied to wedge bonding at the room temperature, and also achieves an excellent bond reliability. The bonding wire includes a core material of Cu or Cu alloy (hereinafter referred to as a “Cu core material”), and a coating containing a noble metal formed on a surface of the Cu core material. A concentration of Cu at a surface of the wire is 30 to 80 at%.

A spinodal copper-nickel-tin alloy with a combination of improved impact strength, yield strength, and ductility is disclosed. The alloy is formed by process treatment steps including solution annealing, cold working and spinodal hardening. These include such processes as a first heat treatment/homogenization step followed by hot working, solution annealing, cold working, and a second heat treatment/spinodally hardening step. The spinodal alloys so produced are useful for applications demanding enhanced strength and ductility such as for pipes and tubes used in the oil and gas industry.