The present invention concerns a layer structure comprising: a substrate having a glass or ceramic surface, a layer A at least partially covering the glass or ceramic surface of the substrate, wherein layer A comprises a glass in which at least two mutually different elements are contained as oxides, and a layer B at least partially covering the layer A. Layer B comprises: a resistance alloy having a temperature coefficient of electrical resistance less than 150 ppm/K, and optionally a glass containing at least two mutually different elements as oxides. Layer B contains not more than 20 weight percent of glass based on the total weight of layer B.

A conductive material for connection parts includes a matrix, a Cu—Sn alloy covering layer having a Cu content of 20 to 70 at % and an average thickness of from 0.2 to 3.0 μm, and a Sn covering layer having an average thickness of from 0.05 to 5.0 μm. The matrix is a copper alloy strip containing specified amounts of Cr and Zr or specified amounts of Fe and P, or a Cu—Zn alloy strip containing a specified amount of Zn. The Cu—Sn alloy covering layer and the Sn covering layer are formed in this order on a surface of the matrix.

Provided is a Cu-based sintered bearing comprising: 15-36 mass % of Ni; 3-13 mass % of Sn; 0.05-0.55 mass % of P; and 0.02-4 mass % of C in total, the balance consisting of Cu and inevitable impurities, wherein the content of C forming an alloy with a matrix within Cu—Ni-based main phase grains is 0.02-0.10 mass %.

Provided is a Cu-based sintered bearing comprising: 15-36 mass % of Ni; 3-13 mass % of Sn; 0.05-0.55 mass % of P; and 0.02-4 mass % of C in total, the balance consisting of Cu and inevitable impurities, wherein the content of C forming an alloy with a matrix within Cu—Ni-based main phase grains is 0.02-0.10 mass %.

A sintered sliding material with excellent corrosion resistance, heat resistance, and wear resistance is provided. The sintered sliding material has a composition made of: 36-86 mass % of Ni; 1-11 mass % of Sn; 0.05-1.0 mass % of P; 1-9 mass % of C; and the Cu balance including inevitable impurities. The sintered sliding material is made of a sintered material of a plurality of grains of alloy of Ni—Cu alloy or Cu—Ni alloy, the Ni—Cu alloy and the Cu—Ni alloy containing Sn, P, C, and Si; has a structure in which pores are dispersedly formed in grain boundaries of the plurality of the grains of alloy; and as inevitable impurities in a matrix constituted from the grains of alloy, a C content is 0.6 mass % or less and a Si content is 0.15 mass % or less.

A copper alloy sheet material includes 0.5 to 2.5 mass % of Ni, 0.5 to 2.5 mass % of Co, 0.30 to 1.2 mass % of Si and 0.0 to 0.5 mass % of Cr and the balance Cu and unavoidable impurities, wherein an X-ray diffraction intensity ratio is 1.0≦I{200}/I.sub.0{200}≦5.0 when I{200} is a result of the X-ray diffraction intensity of {200} crystal plane of sheet surface and I.sub.0{200} is a result of the X-ray diffraction intensity of {200} crystal plane of a standard powder of pure copper, and wherein 0.2% yield strength in a rolling parallel direction (RD) is 800 MPa or more and 950 MPa or less, an electrical conductivity of 43.5% IACS or more and 53.0% IACS or less, 180 degree bending workability in a rolling parallel direction (GW) and a rolling perpendicular direction (BW) is R/t=0, and a difference between the rolling parallel direction (RD) and a rolling perpendicular direction (TD) of the 0.2% yield strength is 40 MPa or less.

A copper alloy sheet material includes 0.5 to 2.5 mass % of Ni, 0.5 to 2.5 mass % of Co, 0.30 to 1.2 mass % of Si and 0.0 to 0.5 mass % of Cr and the balance Cu and unavoidable impurities, wherein an X-ray diffraction intensity ratio is 1.0≦I{200}/I.sub.0{200}≦5.0 when I{200} is a result of the X-ray diffraction intensity of {200} crystal plane of sheet surface and I.sub.0{200} is a result of the X-ray diffraction intensity of {200} crystal plane of a standard powder of pure copper, and wherein 0.2% yield strength in a rolling parallel direction (RD) is 800 MPa or more and 950 MPa or less, an electrical conductivity of 43.5% IACS or more and 53.0% IACS or less, 180 degree bending workability in a rolling parallel direction (GW) and a rolling perpendicular direction (BW) is R/t=0, and a difference between the rolling parallel direction (RD) and a rolling perpendicular direction (TD) of the 0.2% yield strength is 40 MPa or less.

A copper alloy sheet material which contains 0.5 to 2.5% by mass of Ni, 0.5 to 2.5% by mass of Co, 0.30 to 1. 2% by mass of Si and 0.0 to 0.5% by mass of Cr, the balance being Cu and unavoidable impurities. The material fulfills the relationships 1.0≦I {200}/I.sub.0 {200}≦5.0 and 5.0 μm≦GS≦60.0 μm, and these have the relationship (Equation 1): 5.0≦{(I {200}/I.sub.0 {200})/GS}×100≦21.0, in which the I {200} represents an X-ray diffraction intensity of a {200} crystal plane, the I.sub.0 {200} represents an X-ray diffraction intensity of a {200} crystal plane of standard pure copper powder, and the GS (μm) represents an average crystal grain size. An electrical conductivity is 43.5% to 55.0% IACS and 0.2% yield strength is 720 to 900 MPa.

A copper alloy sheet material which contains 0.5 to 2.5% by mass of Ni, 0.5 to 2.5% by mass of Co, 0.30 to 1. 2% by mass of Si and 0.0 to 0.5% by mass of Cr, the balance being Cu and unavoidable impurities. The material fulfills the relationships 1.0≦I {200}/I.sub.0 {200}≦5.0 and 5.0 μm≦GS≦60.0 μm, and these have the relationship (Equation 1): 5.0≦{(I {200}/I.sub.0 {200})/GS}×100≦21.0, in which the I {200} represents an X-ray diffraction intensity of a {200} crystal plane, the I.sub.0 {200} represents an X-ray diffraction intensity of a {200} crystal plane of standard pure copper powder, and the GS (μm) represents an average crystal grain size. An electrical conductivity is 43.5% to 55.0% IACS and 0.2% yield strength is 720 to 900 MPa.

The present invention provides a titanium copper foil having improved adhesion to solder and higher resistance to discoloration due to a high temperature and high humidity environment, an acid solution or an alkaline solution, and as well as having improved etching processability. The present invention provides a titanium copper foil comprising a base metal, the base metal having a composition containing Ti of from 1.5 to 5.0% by mass, the balance being copper and inevitable impurities, and having a thickness of from 0.018 to 0.1 mm, wherein the titanium copper foil has an Sn plated layer on a surface of the base metal, and has an adhesive strength of 0.5 N or more as measured by a solder adhesive strength test according to the definition in the specification.