A process for the production of a crude solder composition includes the provision of a first solder refining slag that includes tin and/or lead. The process further includes the steps of partially reducing the first solder refining slag, thereby forming a crude solder metal composition and a second solder refining slag, followed by separating the second solder refining slag from the crude solder metal composition, and partially reducing the second solder refining slag, thereby forming a second lead-tin based metal composition and a second spent slag followed by separating the second spent slag from the second lead-tin based metal composition

A copper containing fresh feed is added to step (ii), preferably before reducing the second solder refining slag.

A process for the production of a crude solder composition includes the provision of a first solder refining slag that includes tin and/or lead. The process further includes the steps of partially reducing the first solder refining slag, thereby forming a crude solder metal composition and a second solder refining slag, followed by separating the second solder refining slag from the crude solder metal composition, and partially reducing the second solder refining slag, thereby forming a second lead-tin based metal composition and a second spent slag followed by separating the second spent slag from the second lead-tin based metal composition A copper containing fresh feed is added to step (ii), preferably before reducing the second solder refining slag.

A process for the production of a crude solder composition includes the provision of a first solder refining slag that includes tin and/or lead. The process further includes the steps of partially reducing the first solder refining slag, thereby forming a crude solder metal composition and a second solder refining slag, followed by separating the second solder refining slag from the crude solder metal composition, and partially reducing the second solder refining slag, thereby forming a second lead-tin based metal composition and a second spent slag followed by separating the second spent slag from the second lead-tin based metal composition A copper containing fresh feed is added to step (ii), preferably before reducing the second solder refining slag.

A dilute copper metal composition includes 57-85% wt Cu, ≥3.0% wt Ni, ≤0.8% wt Fe, 7-25% wt Sn and 3-15% wt Pb. A process includes the steps of partially oxidizing a black copper composition to obtain a first copper refining slag and a first enriched copper metal, partially oxidizing the first enriched copper metal to obtain a second copper refining slag, whereby at least 37.0% wt of the amount of tin and lead processed is retrieved in the first and second copper refining slags together; and partially reducing the first copper refining slag to form a first lead-tin based metal composition and a first spent slag. The process further includes the steps of adding the second copper refining slag to the first lead-tin based metal composition, thereby forming a first liquid bath; and partially oxidizing the first liquid bath, thereby obtaining the dilute copper metal composition.

A dilute copper metal composition includes 57-85% wt Cu, ≥3.0% wt Ni, ≤0.8% wt Fe, 7-25% wt Sn and 3-15% wt Pb. A process includes the steps of partially oxidizing a black copper composition to obtain a first copper refining slag and a first enriched copper metal, partially oxidizing the first enriched copper metal to obtain a second copper refining slag, whereby at least 37.0% wt of the amount of tin and lead processed is retrieved in the first and second copper refining slags together; and partially reducing the first copper refining slag to form a first lead-tin based metal composition and a first spent slag. The process further includes the steps of adding the second copper refining slag to the first lead-tin based metal composition, thereby forming a first liquid bath; and partially oxidizing the first liquid bath, thereby obtaining the dilute copper metal composition.

The present invention relates to a method for producing metal-comprising geometrically complex pieces and/or parts. The method is specially indicated for highly performant components. It is disclosed a method for the production of complex geometry, and even large, highly performant metal-comprising components in a cost effective way. The method is also indicated for the construction of components with internal features and voids. The method is also beneficial for light construction. The method allows the reproduction of bio-mimetic structures and other advanced structures for topological performance optimization.

The present disclosure relates to a method for preparing a category of alloy powder and an application thereof. By selecting a suitable alloy system and melting initial alloy melt through low-purity raw materials, high-purity alloy powder, and matrix phase wrapping high-purity alloy powder are precipitated during the solidification process of the initial alloy melt, and the solid solution alloying of the high-purity alloy powder is achieved at the same time. Alloy powder can be obtained by removing the matrix phase wrapping the high-purity alloy powder; high-purity alloy powder can also be obtained by removing the matrix phase wrapping the high-purity alloy powder at an appropriate time. The method is simple and can prepare a variety of alloy powder materials with different morphology at nano-scale, sub-micron level, micron level, and even millimeter level.

The present disclosure relates to a method for preparing a category of alloy powder and an application thereof. By selecting a suitable alloy system and melting initial alloy melt through low-purity raw materials, high-purity alloy powder, and matrix phase wrapping high-purity alloy powder are precipitated during the solidification process of the initial alloy melt, and the solid solution alloying of the high-purity alloy powder is achieved at the same time. Alloy powder can be obtained by removing the matrix phase wrapping the high-purity alloy powder; high-purity alloy powder can also be obtained by removing the matrix phase wrapping the high-purity alloy powder at an appropriate time. The method is simple and can prepare a variety of alloy powder materials with different morphology at nano-scale, sub-micron level, micron level, and even millimeter level.

A device including a near field transducer, the near field transducer including gold (Au) and at least one other secondary atom, the at least one other secondary atom selected from: boron (B), bismuth (Bi), indium (In), sulfur (S), silicon (Si), tin (Sn), hafnium (Hf), niobium (Nb), manganese (Mn), antimony (Sb), tellurium (Te), carbon (C), nitrogen (N), and oxygen (O), and combinations thereof; erbium (Er), holmium (Ho), lutetium (Lu), praseodymium (Pr), scandium (Sc), uranium (U), zinc (Zn), and combinations thereof; and barium (Ba), chlorine (Cl), cesium (Cs), dysprosium (Dy), europium (Eu), fluorine (F), gadolinium (Gd), germanium (Ge), hydrogen (H), iodine (I), osmium (Os), phosphorus (P), rubidium (Rb), rhenium (Re), selenium (Se), samarium (Sm), terbium (Tb), thallium (Th), and combinations thereof.

A device including a near field transducer, the near field transducer including gold (Au) and at least one other secondary atom, the at least one other secondary atom selected from: boron (B), bismuth (Bi), indium (In), sulfur (S), silicon (Si), tin (Sn), hafnium (Hf), niobium (Nb), manganese (Mn), antimony (Sb), tellurium (Te), carbon (C), nitrogen (N), and oxygen (O), and combinations thereof; erbium (Er), holmium (Ho), lutetium (Lu), praseodymium (Pr), scandium (Sc), uranium (U), zinc (Zn), and combinations thereof; and barium (Ba), chlorine (Cl), cesium (Cs), dysprosium (Dy), europium (Eu), fluorine (F), gadolinium (Gd), germanium (Ge), hydrogen (H), iodine (I), osmium (Os), phosphorus (P), rubidium (Rb), rhenium (Re), selenium (Se), samarium (Sm), terbium (Tb), thallium (Th), and combinations thereof.