The present disclosure provides a thermal spray alloy system that is more resistant to corrosion than conventional alloy compositions. The disclosed alloy comprises copper as the main component and also potentially nickel, tin, boron, and/or carbon as other principle elements. The alloy composition may utilize a cored wire, and an outer sheath of the cored wire may comprise unalloyed copper. The alloy has superior corrosion resistance to a wide number of corrosive materials, such as hydrogen sulfide, carbon dioxide/carbonic acid, sodium chloride/potassium chloride (salts), bio-fouling, and micro-biologicals. The alloy demonstrates superior thermal conductivity compared to nickel based alloys and stainless steels. The alloy may form an anti-corrosive coating that may be applied to any number of substrates. The disclosed alloy may be applied to a substrate in thick layers, such as between 0.100 inches and 3.0 inches, and may be used to form shapes, such as centralizers.

A rectangular rolled copper foil includes copper or a copper alloy having a 0.2% yield strength of greater than or equal to 250 MPa. In a cross section perpendicular to a rolling direction, an area ratio of crystal grains oriented at a deviation angle of less than or equal to 12.5 from a Cube orientation is greater than or equal to 8%.

A rectangular rolled copper foil includes copper or a copper alloy having a 0.2% yield strength of greater than or equal to 250 MPa. In a cross section perpendicular to a rolling direction, an area ratio of crystal grains oriented at a deviation angle of less than or equal to 12.5 from a Cube orientation is greater than or equal to 8%.

A metal powder contains not less than 0.10 mass % and not more than 1.00 mass % of at least one of chromium and silicon, and a balance of copper. The total content of the chromium and the silicon is not more than 1.00 mass %. In accordance with an additive manufacturing method for this metal powder, an additively-manufactured article made from a copper alloy is provided. The additively-manufactured article has both an adequate mechanical strength and an adequate electrical conductivity.

A metal powder contains not less than 0.10 mass % and not more than 1.00 mass % of at least one of chromium and silicon, and a balance of copper. The total content of the chromium and the silicon is not more than 1.00 mass %. In accordance with an additive manufacturing method for this metal powder, an additively-manufactured article made from a copper alloy is provided. The additively-manufactured article has both an adequate mechanical strength and an adequate electrical conductivity.

A conductive material for connection parts includes a matrix, a CuSn alloy coating layer having a Cu content of 20 to 70 at % and an average thickness of 0.2 to 3.0 m and an Sn coating layer having an average thickness of 0.05 to 5.0 m. The CuSn alloy covering layer and the Sn covering layer are formed in this order on a surface of the matrix.

A conductive material for connection parts includes a matrix, a CuSn alloy coating layer having a Cu content of 20 to 70 at % and an average thickness of 0.2 to 3.0 m and an Sn coating layer having an average thickness of 0.05 to 5.0 m. The CuSn alloy covering layer and the Sn covering layer are formed in this order on a surface of the matrix.

A conductive material for connection parts includes a matrix, a CuSn alloy covering layer having a Cu content of 20 to 70 at % and an average thickness of from 0.2 to 3.0 m, and a Sn covering layer having an average thickness of from 0.05 to 5.0 m. The matrix is a copper alloy strip containing specified amounts of Fe and P. The CuSn alloy covering layer and the Sn covering layer are formed in this order on a surface of the matrix.

A conductive material for connection parts includes a matrix, a CuSn alloy covering layer having a Cu content of 20 to 70 at % and an average thickness of from 0.2 to 3.0 m, and a Sn covering layer having an average thickness of from 0.05 to 5.0 m. The matrix is a copper alloy strip containing specified amounts of Fe and P. The CuSn alloy covering layer and the Sn covering layer are formed in this order on a surface of the matrix.

Methods for forming ceramic cores are disclosed. A ceramic core formed using the method of the present application includes a silica depletion zone encapsulating an inner zone. The inner zone includes mullite and the silica depletion zone includes alumina. The method includes heat-treating a ceramic body in a non-oxidizing atmospheric condition for an effective temperature and time combination at a pressure less than 10.sup.2 atmosphere to form the silica depletion zone at a surface of the ceramic core.