The present invention provides a titanium copper foil having improved adhesion to solder and higher resistance to discoloration due to a high temperature and high humidity environment, an acid solution or an alkaline solution, and as well as having improved etching processability. The present invention provides a titanium copper foil comprising a base metal, the base metal having a composition containing Ti of from 1.5 to 5.0% by mass, the balance being copper and inevitable impurities, and having a thickness of from 0.018 to 0.1 mm, wherein the titanium copper foil has an Sn plated layer on a surface of the base metal, and has an adhesive strength of 0.5 N or more as measured by a solder adhesive strength test according to the definition in the specification.

In one aspect, methods of making freestanding metal matrix composite articles and alloy articles are described. A method of making a freestanding composite article described herein comprises disposing over a surface of the temporary substrate a layered assembly comprising a layer of infiltration metal or alloy and a hard particle layer formed of a flexible sheet comprising organic binder and the hard particles. The layered assembly is heated to infiltrate the hard particle layer with metal or alloy providing a metal matrix composite, and the metal matrix composite is separated from the temporary substrate. Further, a method of making a freestanding alloy article described herein comprises disposing over the surface of a temporary substrate a flexible sheet comprising organic binder and powder alloy and heating the sheet to provide a sintered alloy article. The sintered alloy article is then separated from the temporary substrate.

In one aspect, methods of making freestanding metal matrix composite articles and alloy articles are described. A method of making a freestanding composite article described herein comprises disposing over a surface of the temporary substrate a layered assembly comprising a layer of infiltration metal or alloy and a hard particle layer formed of a flexible sheet comprising organic binder and the hard particles. The layered assembly is heated to infiltrate the hard particle layer with metal or alloy providing a metal matrix composite, and the metal matrix composite is separated from the temporary substrate. Further, a method of making a freestanding alloy article described herein comprises disposing over the surface of a temporary substrate a flexible sheet comprising organic binder and powder alloy and heating the sheet to provide a sintered alloy article. The sintered alloy article is then separated from the temporary substrate.

A metal powder contains not less than 0.10 mass % and not more than 1.00 mass % of at least one of chromium and silicon, and a balance of copper. The total content of the chromium and the silicon is not more than 1.00 mass %. In accordance with an additive manufacturing method for this metal powder, an additively-manufactured article made from a copper alloy is provided. The additively-manufactured article has both an adequate mechanical strength and an adequate electrical conductivity.

A metal powder contains not less than 0.10 mass % and not more than 1.00 mass % of at least one of chromium and silicon, and a balance of copper. The total content of the chromium and the silicon is not more than 1.00 mass %. In accordance with an additive manufacturing method for this metal powder, an additively-manufactured article made from a copper alloy is provided. The additively-manufactured article has both an adequate mechanical strength and an adequate electrical conductivity.

This free-cutting copper alloy includes Cu: more than 58.0% and less than 65.0%, Si: more than 0.30% and less than 1.30%, Pb: more than 0.001% and 0.20% or less, Bi: more than 0.020% and 0.10% or less, and P: more than 0.001% and less than 0.20%, with the remainder being Zn and unavoidable impurities, a total amount of Fe, Mn, Co and Cr is less than 0.45%, a total amount of Sn and Al is less than 0.45%, relationships of 56.5≤[Cu]−4.7×[Si]+0.5×[Pb]+0.5×[Bi]−0.5×[P]≤59.5, and 0.025≤[Pb]+[Bi]<0.25 are satisfied, in constituent phases of a metallographic structure, relationships of 20≤(α)<85, 15<(β)≤80, 0≤(γ)<5, 8.0≤([Bi]+[Pb]−0.002).sup.1/2×10+([P]−0.001).sup.1/2×5+((β)−7).sup.1/2×([Si]−0.1).sup.1/2×1.2+(γ).sup.1/2×0.5≤17.0, and 0.9≤([Bi]+[Pb]−0.002).sup.1/2×((β)−7).sup.1/2×([Si]−0.1).sup.1/2≤4.0 are satisfied, and a particle containing Bi is present in α phase.

Provided is a sintered bearing (1), including 3 to 12% by mass of aluminum, 0.05 to 0.5% by mass of phosphorus, and the balance including copper as a main component, and inevitable impurities, the sintered bearing (1) having a structure in which an aluminum-copper alloy is sintered with a sintering aid added to raw material powder, a pore (db, do) in a surface layer portion of the sintered bearing (1) being formed smaller than an internal pore (di).

Provided is a sintered bearing (1), including 3 to 12% by mass of aluminum, 0.05 to 0.5% by mass of phosphorus, and the balance including copper as a main component, and inevitable impurities, the sintered bearing (1) having a structure in which an aluminum-copper alloy is sintered with a sintering aid added to raw material powder, a pore (db, do) in a surface layer portion of the sintered bearing (1) being formed smaller than an internal pore (di).

This copper alloy powder having an excellent laser absorptivity includes: either one or both of B and S in an amount of 0.003 mass % to 5.0 mass %, with a remainder being Cu and inevitable impurities, wherein an average particle diameter is 20 μm to 80 μm. This copper alloy powder having an excellent laser absorptivity is preferably a powder for metal additive manufacturing.

This copper alloy powder having an excellent laser absorptivity includes: either one or both of B and S in an amount of 0.003 mass % to 5.0 mass %, with a remainder being Cu and inevitable impurities, wherein an average particle diameter is 20 μm to 80 μm. This copper alloy powder having an excellent laser absorptivity is preferably a powder for metal additive manufacturing.