A copper-nickel-tin alloy with excellent castability, hot workability and cold workability, high resistance to abrasive wear, adhesive wear and fretting wear and improved resistance to corrosion and stress relaxation stability, consisting of (in weight %): 2.0-10.0% Ni, 2.0-10.0% Sn, 0.01-1.0% Fe, 0.01-0.8% Mg, 0.01-2.5% Zn, 0.01-1.5% Si, 0.002-0.45% B, 0.004-0.3% P, selectively up to a maximum of 2.0% Co, selectively up to a maximum of 0.25% Pb, the residue being copper and unavoidable impurities. The ratio Si/B of the element-contents in wt. % of the elements silicon and boron is a minimum 0.4 and a maximum 8 such that the copper-nickel-tin alloy has Si-containing and B-containing phases, phases of the systems Ni—Si—B, Ni—B, Fe—B, Ni—P, Fe—P, Mg—P, Ni—Si, and Mg—Si, and other Fe-containing phases and Mg-containing phases.

The present disclosure provides a thermal spray alloy system that is more resistant to corrosion than conventional alloy compositions. The disclosed alloy comprises copper as the main component and also potentially nickel, tin, boron, and/or carbon as other principle elements. The alloy composition may utilize a cored wire, and an outer sheath of the cored wire may comprise unalloyed copper. The alloy has superior corrosion resistance to a wide number of corrosive materials, such as hydrogen sulfide, carbon dioxide/carbonic acid, sodium chloride/potassium chloride (salts), bio-fouling, and micro-biologicals. The alloy demonstrates superior thermal conductivity compared to nickel based alloys and stainless steels. The alloy may form an anti-corrosive coating that may be applied to any number of substrates. The disclosed alloy may be applied to a substrate in thick layers, such as between 0.100 inches and 3.0 inches, and may be used to form shapes, such as centralizers.

The present disclosure provides a thermal spray alloy system that is more resistant to corrosion than conventional alloy compositions. The disclosed alloy comprises copper as the main component and also potentially nickel, tin, boron, and/or carbon as other principle elements. The alloy composition may utilize a cored wire, and an outer sheath of the cored wire may comprise unalloyed copper. The alloy has superior corrosion resistance to a wide number of corrosive materials, such as hydrogen sulfide, carbon dioxide/carbonic acid, sodium chloride/potassium chloride (salts), bio-fouling, and micro-biologicals. The alloy demonstrates superior thermal conductivity compared to nickel based alloys and stainless steels. The alloy may form an anti-corrosive coating that may be applied to any number of substrates. The disclosed alloy may be applied to a substrate in thick layers, such as between 0.100 inches and 3.0 inches, and may be used to form shapes, such as centralizers.

A device including a near field transducer, the near field transducer including gold (Au), silver (Ag), copper (Cu), or aluminum (Al), and at least two other secondary atoms, the at least two other secondary atoms selected from: boron (B), bismuth (Bi), indium (In), sulfur (S), silicon (Si), tin (Sn), manganese (Mn), tellurium (Te), holmium (Ho), lutetium (Lu), praseodymium (Pr), scandium (Sc), uranium (U), barium (Ba), chlorine (Cl), cesium (Cs), dysprosium (Dy), europium (Eu), fluorine (F), germanium (Ge), hydrogen (H), iodine (I), rubidium (Rb), selenium (Se), terbium (Tb), nitrogen (N), oxygen (O), carbon (C), antimony (Sb), gadolinium (Gd), samarium (Sm), thallium (Tl), cadmium (Cd), neodymium (Nd), phosphorus (P), lead (Pb), hafnium (Hf), niobium (Nb), erbium (Er), zinc (Zn), magnesium (Mg), palladium (Pd), vanadium (V), zinc (Zn), chromium (Cr), iron (Fe), lithium (Li), nickel (Ni), platinum (Pt), sodium (Na), strontium (Sr), calcium (Ca), yttrium (Y), thorium (Th), beryllium (Be), thulium (Tm), erbium (Er), ytterbium (Yb), promethium (Pm), neodymium (Nd cobalt (Co), cerium (Ce), lanthanum (La), praseodymium (Pr), or combinations thereof.

The invention is a copper alloy with excellent comprehensive performance, including the following components in percentage by weight: 0.4 wt %-2.0 wt % of Ni, 0.2 wt %-2.5 wt % of Sn, 0.02 wt %-0.25 wt % of P, 0.001 wt %-0.5 wt % of Si, and the balance of Cu and unavoidable impurities. The copper alloy has a yield strength of 550 MPa or above, and an electrical conductivity of 38% IACS or above. A bending workability is as follows: the value of R/t in the GW direction is less than or equal to 1, and the value of R/t in the BW direction is less than or equal to 2; and after the copper alloy is kept at 150 C. for 1000 hours, a residual stress rate is greater than or equal to 75%, and the stress relaxation resistance is excellent.

A pure copper powder with a Si coating formed thereon, wherein a Si adhesion amount is 5 wtppm or more and 200 wtppm or less, a C adhesion amount is 15 wtppm or more, and a weight ratio C/Si is 3 or less. An object of the present invention is to provide a pure copper powder with a Si coating formed thereon and a production method thereof, as well as an additive manufactured object using such pure copper powder capable of suppressing the partial sintering of the pure copper powder caused by the preheating thereof in additive manufacturing based on the electron beam (EB) method, and suppressing the loss of the degree of vacuum caused by carbon (C) during the molding process.

The purpose of the present invention is to provide: a slide member in which the bonding strength between a Bi-containing copper alloy layer and a substrate is enhanced; and a method for manufacturing the slide member. The slide member according to the present invention has a substrate and a copper alloy layer. The copper alloy layer comprises a copper alloy containing 4.0-25.0 mass % of Bi and has a structure in which Bi phases are scattered in a copper alloy structure. The volume ratio of Bi phases in the region of the copper alloy layer extending 10 m from the bonding interface with the substrate is not more than 2.0%. The slide member is manufactured by casting a molten copper alloy onto the substrate and causing the copper alloy to unidirectionally solidify.

This copper alloy powder having an excellent laser absorptivity includes: either one or both of B and S in an amount of 0.003 mass % to 5.0 mass %, with a remainder being Cu and inevitable impurities, wherein an average particle diameter is 20 m to 80 m. This copper alloy powder having an excellent laser absorptivity is preferably a powder for metal additive manufacturing.

This copper alloy powder having an excellent laser absorptivity includes: either one or both of B and S in an amount of 0.003 mass % to 5.0 mass %, with a remainder being Cu and inevitable impurities, wherein an average particle diameter is 20 m to 80 m. This copper alloy powder having an excellent laser absorptivity is preferably a powder for metal additive manufacturing.

In one aspect, methods of making freestanding metal matrix composite articles and alloy articles are described. A method of making a freestanding composite article described herein comprises disposing over a surface of the temporary substrate a layered assembly comprising a layer of infiltration metal or alloy and a hard particle layer formed of a flexible sheet comprising organic binder and the hard particles. The layered assembly is heated to infiltrate the hard particle layer with metal or alloy providing a metal matrix composite, and the metal matrix composite is separated from the temporary substrate. Further, a method of making a freestanding alloy article described herein comprises disposing over the surface of a temporary substrate a flexible sheet comprising organic binder and powder alloy and heating the sheet to provide a sintered alloy article. The sintered alloy article is then separated from the temporary substrate.