Methods for controlling properties of structural elements of implantable medical devices, where the structural elements contain shape memory alloys (SMAs) include promoting or inhibiting in vivo formation of R-phase crystal structure or converging or separating the R-phase from the austenite phase.

A method of modifying surfaces of diamond particles comprises forming spinodal alloy coatings over discrete diamond particles, thermally treating the spinodal alloy coatings to form modified coatings each independently exhibiting a reactive metal phase and a substantially non-reactive metal phase, and etching surfaces of the discrete diamond particles with at least one reactive metal of the reactive metal phase of the modified coatings. Diamond particles and earth-boring tools are also described.

A method of modifying surfaces of diamond particles comprises forming spinodal alloy coatings over discrete diamond particles, thermally treating the spinodal alloy coatings to form modified coatings each independently exhibiting a reactive metal phase and a substantially non-reactive metal phase, and etching surfaces of the discrete diamond particles with at least one reactive metal of the reactive metal phase of the modified coatings. Diamond particles and earth-boring tools are also described.

The present invention provides a copper-nickel alloy electroplating bath which is characterized by containing (a) a copper salt and a nickel salt, (b) a metal complexing agent, (c) a plurality of conductivity-imparting salts that are different from each other, (d) a compound that is selected from the group consisting of disulfide compounds, sulfur-containing amino acids and salts of these compounds, (e) a compound that is selected from the group consisting of sulfonic acid compounds, sulfimide compounds, sulfamic acid compounds, sulfone amides and salts of these compounds, and (f) a reaction product of a glycidyl ether and a polyhydric alcohol. This copper-nickel alloy electroplating bath is also characterized by having a pH of 3-8.

The present invention provides a copper-nickel alloy electroplating bath which is characterized by containing (a) a copper salt and a nickel salt, (b) a metal complexing agent, (c) a plurality of conductivity-imparting salts that are different from each other, (d) a compound that is selected from the group consisting of disulfide compounds, sulfur-containing amino acids and salts of these compounds, (e) a compound that is selected from the group consisting of sulfonic acid compounds, sulfimide compounds, sulfamic acid compounds, sulfone amides and salts of these compounds, and (f) a reaction product of a glycidyl ether and a polyhydric alcohol. This copper-nickel alloy electroplating bath is also characterized by having a pH of 3-8.

A piece of flexible porous metal foil is a sheet made of porous metal material using solid solution alloy, face-centered cubic metal simple substance or body-centered cubic metal simple substance as matrix phase. The thickness of the sheet is 5 to 200 micrometers, the average aperture thereof is 0.05 to 100 micrometers, the porosity thereof is 15-70%, and the sheet is made by sintering a homogeneous film. The preparation method for the flexible porous metal foil comprises: (1) preparing thick turbid liquid with raw material powder forming the metal porous material by using dispersing agent and binding agent; (2) injecting the turbid liquid into a mold cavity of a film manufacturing fixture, and drying the turbid liquid to form a piece of homogeneous film; (3) putting the film into a sintering manufacturing fixture matching with the film in shape, then sintering the film, and taking the film out after sintering and obtaining the flexible porous metal foil. The flexible porous metal foil made by the above method can be used in many fields, and have ideal performance in flexible and chemical stability.

A piece of flexible porous metal foil is a sheet made of porous metal material using solid solution alloy, face-centered cubic metal simple substance or body-centered cubic metal simple substance as matrix phase. The thickness of the sheet is 5 to 200 micrometers, the average aperture thereof is 0.05 to 100 micrometers, the porosity thereof is 15-70%, and the sheet is made by sintering a homogeneous film. The preparation method for the flexible porous metal foil comprises: (1) preparing thick turbid liquid with raw material powder forming the metal porous material by using dispersing agent and binding agent; (2) injecting the turbid liquid into a mold cavity of a film manufacturing fixture, and drying the turbid liquid to form a piece of homogeneous film; (3) putting the film into a sintering manufacturing fixture matching with the film in shape, then sintering the film, and taking the film out after sintering and obtaining the flexible porous metal foil. The flexible porous metal foil made by the above method can be used in many fields, and have ideal performance in flexible and chemical stability.

A conductive particle including a conductive powder, a conductive polymer composition, and an anisotropic conductive sheet, each of which has a particularly smaller volume resistivity and better conductivity than those of the related art, and is desirably inexpensive. A conductive particle includes a first plating layer (pure Ni plating layer or Ni plating layer containing 4.0 mass % or less of P) covering the surface of a spherical Ni core containing 5 mass % to 15 mass % or less of P. The conductive particle may further include a Au plating layer having a thickness of from 5 nm to 200 nm and covering the surface of the first plating layer.

A conductive particle including a conductive powder, a conductive polymer composition, and an anisotropic conductive sheet, each of which has a particularly smaller volume resistivity and better conductivity than those of the related art, and is desirably inexpensive. A conductive particle includes a first plating layer (pure Ni plating layer or Ni plating layer containing 4.0 mass % or less of P) covering the surface of a spherical Ni core containing 5 mass % to 15 mass % or less of P. The conductive particle may further include a Au plating layer having a thickness of from 5 nm to 200 nm and covering the surface of the first plating layer.

The cylinder rod of a hydraulic cylinder includes a body portion having a bar shape, and a head portion arranged at a longitudinal end of the body portion. The body portion has a coating formed on its outer peripheral surface. The coating includes, in terms of area ratio in cross section, not less than 56.1% and not more than 84.4% of a chromium carbide phase, with the remainder consisting of a nickel-based alloy phase and an oxide phase. The area ratio of the chromium carbide phase may be 61.7% or more.