A method for producing a case-hardened martensitic stainless steel article includes: providing an article comprised, at least in part, of a martensitic stainless steel, carburizing the article within a temperature range of 1625° F.-1680° F. (885° C.-916° C.), and then carbo-nitriding the article within a temperature range of 1575° F.-1625° F. (857° C.-885° C.). An article, such as a bearing ring, comprising such a case-hardened martensitic stainless steel is also disclosed.

A method for producing a case-hardened martensitic stainless steel article includes: providing an article comprised, at least in part, of a martensitic stainless steel, carburizing the article within a temperature range of 1625° F.-1680° F. (885° C.-916° C.), and then carbo-nitriding the article within a temperature range of 1575° F.-1625° F. (857° C.-885° C.). An article, such as a bearing ring, comprising such a case-hardened martensitic stainless steel is also disclosed.

An exterior panel is formed of superplastic materials, including an exterior skin of titanium to accommodate high thermal stresses imposed on hypersonic transport vehicles during hypersonic flight. The exterior skin is fixed to an underlying reinforcing skeletal structure consisting of a superplastic formable reinforcement (SFR) layer, for example a titanium, zirconium, and molybdenum (TZM) alloy, which supports the exterior skin whenever the latter may be heated to temperatures exceeding 1200 degrees Fahrenheit. The exterior panel includes a separate interior skin configured for attachment to a frame member such as a rib, stringer, or spar of the hypersonic transport vehicle. A multicellular core is sandwiched between the exterior and interior skins to impart tensile and compressive strength to the exterior panel. In one disclosed method, the core is superplastic formed and diffusion bonded to the exterior and interior skins.

An exterior panel is formed of superplastic materials, including an exterior skin of titanium to accommodate high thermal stresses imposed on hypersonic transport vehicles during hypersonic flight. The exterior skin is fixed to an underlying reinforcing skeletal structure consisting of a superplastic formable reinforcement (SFR) layer, for example a titanium, zirconium, and molybdenum (TZM) alloy, which supports the exterior skin whenever the latter may be heated to temperatures exceeding 1200 degrees Fahrenheit. The exterior panel includes a separate interior skin configured for attachment to a frame member such as a rib, stringer, or spar of the hypersonic transport vehicle. A multicellular core is sandwiched between the exterior and interior skins to impart tensile and compressive strength to the exterior panel. In one disclosed method, the core is superplastic formed and diffusion bonded to the exterior and interior skins.

The present invention relates to a ball game racket with strings that comprise at least one string comprising a superelastic material.

The present invention provides a conductive bonded assembly utilizing particles of Ni or an Ni alloy as conductive particles so as to enable firing under non-pressing conditions and further realize an excellent bonding strength, electron migration characteristic, and ion migration characteristic. The conductive bonded assembly of the present invention is a conductive bonded assembly of an electronic component which has a first bondable member (for example, electrode material), a second bondable member (for example, a semiconductor device on an Si or SiC substrate), and a conductive bonding layer bonding these bondable members together, where the bonding layer is an Ni sintered body formed by a sintered body of Ni particles which has a porosity of 30% or less, and, further, can be obtained by heating and sintering the Ni particles at the time of firing where the Ni sintered bonding layer is formed.

The present invention provides a conductive bonded assembly utilizing particles of Ni or an Ni alloy as conductive particles so as to enable firing under non-pressing conditions and further realize an excellent bonding strength, electron migration characteristic, and ion migration characteristic. The conductive bonded assembly of the present invention is a conductive bonded assembly of an electronic component which has a first bondable member (for example, electrode material), a second bondable member (for example, a semiconductor device on an Si or SiC substrate), and a conductive bonding layer bonding these bondable members together, where the bonding layer is an Ni sintered body formed by a sintered body of Ni particles which has a porosity of 30% or less, and, further, can be obtained by heating and sintering the Ni particles at the time of firing where the Ni sintered bonding layer is formed.

The present disclosure relates to new materials comprising Al, Co, Ni and Ti. The new materials may realize a single phase field of a face-centered cubic (fcc) solid solution structure immediately below the solidus temperature of the material. The new materials may include at least one precipitate phase and have a solvus temperature of at least 1100° C. The new materials may include 2.1-8.4 wt. % Al, 4.7-60.6 wt. % Co, 29.6-89.3 wt. % Ni, and 3.9-9.4 wt. % Ti. In one embodiment, the precipitate is selected from the group consisting of the L1.sub.2 phase, the B2 phase, the Ni.sub.3Ti phase, and combinations thereof. The new alloys may realize improved high temperature properties.

The present disclosure relates to new materials comprising Al, Co, Ni and Ti. The new materials may realize a single phase field of a face-centered cubic (fcc) solid solution structure immediately below the solidus temperature of the material. The new materials may include at least one precipitate phase and have a solvus temperature of at least 1100° C. The new materials may include 2.1-8.4 wt. % Al, 4.7-60.6 wt. % Co, 29.6-89.3 wt. % Ni, and 3.9-9.4 wt. % Ti. In one embodiment, the precipitate is selected from the group consisting of the L1.sub.2 phase, the B2 phase, the Ni.sub.3Ti phase, and combinations thereof. The new alloys may realize improved high temperature properties.

The present disclosure relates to new materials comprising Al, Co, and Ni. The new materials may realize a single phase field of a face-centered cubic (fcc) solid solution structure immediately below the solidus temperature of the material. The new materials may include at least one precipitate phase and have a solvus temperature of at least 1000° C. The new materials may include 6.7-11.4 wt. % Al, 5.0-48.0 wt. % Co, and 43.9-88.3 wt. % Ni. In one embodiment, the precipitate is selected from the group consisting of the L1.sub.2 phase, the B2 phase, and combinations thereof. The new alloys may realize improved high temperature properties.