The present invention relates to an article comprising a ceramic substrate (310) comprising a source of zirconium oxide; a metallic substrate (320); and a braze joint disposed between the ceramic substrate and the metallic substrate. The braze joint comprises (i) a gold rich phase (330) interfacing against a surface of the ceramic substrate. The gold rich phase comprises a refractory metal selected from the group consisting of molybdenum, tungsten, niobium, tantalum and combinations thereof; and (ii) a second metallic phase (340) comprising a metal selected form the group consisting of nickel, iron, vanadium, cobalt, chromium, osmium, tantalum or combinations thereof.

A coating-substrate combination includes: a Ni-based superalloy substrate comprising, by weight percent: 2.0-5.1 Cr; 0.9-3.3 Mo; 3.9-9.8 W; 2.2-6.8 Ta; 5.4-6.5 Al; 1.8-12.8 Co; 2.8-5.8 Re; 2.8-7.2 Ru; and a coating comprising, exclusive of Pt group elements, by weight percent: Ni as a largest content; 5.8-9.3 Al; 4.4-25 Cr; 3.0-13.5 Co; up to 6.0 Ta, if any; up to 6.2 W, if any; up to 2.4 Mo, if any; 0.3-0.6 Hf; 0.1-0.4 Si; up to 0.6 Y, if any; up to 0.4 Zr, if any; up to 1.0 Re, if any.

A coating-substrate combination includes: a Ni-based superalloy substrate comprising, by weight percent: 2.0-5.1 Cr; 0.9-3.3 Mo; 3.9-9.8 W; 2.2-6.8 Ta; 5.4-6.5 Al; 1.8-12.8 Co; 2.8-5.8 Re; 2.8-7.2 Ru; and a coating comprising, exclusive of Pt group elements, by weight percent: Ni as a largest content; 5.8-9.3 Al; 4.4-25 Cr; 3.0-13.5 Co; up to 6.0 Ta, if any; up to 6.2 W, if any; up to 2.4 Mo, if any; 0.3-0.6 Hf; 0.1-0.4 Si; up to 0.6 Y, if any; up to 0.4 Zr, if any; up to 1.0 Re, if any.

A system for increasing joint strength and reducing embrittlement in a resistance spot weld of metal workpieces is disclosed. The system comprises a stackup of first and second metal workpieces, and an interface member disposed between the first and second metal workpieces. The interface member comprises a peripheral wall defining a hollow inner portion. The peripheral wall has a first open end extending to a second open end. The first open end is in contact with the first metal workpiece defining a first weld portion thereon. The second open end is in contact with the second metal workpiece defining a second weld portion thereon. The system further comprises a first electrode configured to contact the first metal workpiece to heat the peripheral wall at the first weld portion and join the first metal workpiece with the first open end of the peripheral wall. The system further comprises a second electrode configured to contact the second metal workpiece to heat the peripheral wall at the second weld portion and join the second metal workpiece with the second open end of the peripheral wall to define a weld joint. The system further comprises a power source configured to power the first and second electrodes and a controller configured to control the power to the first and second electrodes to heat the peripheral wall.

A system for increasing joint strength and reducing embrittlement in a resistance spot weld of metal workpieces is disclosed. The system comprises a stackup of first and second metal workpieces, and an interface member disposed between the first and second metal workpieces. The interface member comprises a peripheral wall defining a hollow inner portion. The peripheral wall has a first open end extending to a second open end. The first open end is in contact with the first metal workpiece defining a first weld portion thereon. The second open end is in contact with the second metal workpiece defining a second weld portion thereon. The system further comprises a first electrode configured to contact the first metal workpiece to heat the peripheral wall at the first weld portion and join the first metal workpiece with the first open end of the peripheral wall. The system further comprises a second electrode configured to contact the second metal workpiece to heat the peripheral wall at the second weld portion and join the second metal workpiece with the second open end of the peripheral wall to define a weld joint. The system further comprises a power source configured to power the first and second electrodes and a controller configured to control the power to the first and second electrodes to heat the peripheral wall.

A dental tool or instrument having a shank located adjacent a first end thereof and a working area located adjacent an opposite second end. At least one elongate cut is formed along the working area and a memorized shape, having at least one protrusion, is formed in the working area. The dental tool or instrument is manufactured from a nitinol wire which initially has a transition temperature that is below room temperature, while the dental tool or instrument, following manufacture, has a final transition temperature of about 90.5±4 degrees Fahrenheit (i.e., 32.5±3 degrees Celsius). When the dental tool or instrument is at a temperature below its final transition temperature, the dental tool instrument is moldable to facilitate insertion into a root canal, but as soon as the dental tool or instrument is at or above the final transition temperature, the dental tool instrument automatically adopts the memorized shape.

A dental tool or instrument having a shank located adjacent a first end thereof and a working area located adjacent an opposite second end. At least one elongate cut is formed along the working area and a memorized shape, having at least one protrusion, is formed in the working area. The dental tool or instrument is manufactured from a nitinol wire which initially has a transition temperature that is below room temperature, while the dental tool or instrument, following manufacture, has a final transition temperature of about 90.5±4 degrees Fahrenheit (i.e., 32.5±3 degrees Celsius). When the dental tool or instrument is at a temperature below its final transition temperature, the dental tool instrument is moldable to facilitate insertion into a root canal, but as soon as the dental tool or instrument is at or above the final transition temperature, the dental tool instrument automatically adopts the memorized shape.

A method for manufacturing a thermoelectric conversion module of the present invention is a method for manufacturing a thermoelectric conversion module including a thermoelectric semiconductor part in which a plurality of p-type semiconductors and a plurality of n-type semiconductors are alternately arranged, and a high temperature side electrode bound to a binding surface of the p-type semiconductor and the n-type semiconductor on a high temperature heat source side and a low temperature side electrode bound to a binding surface of the p-type semiconductor and the n-type semiconductor on a low temperature heat source side, which electrically connect the p-type semiconductor and the n-type semiconductor adjacent to each other in series, and includes a binding step of binding at least one of the high temperature side electrode and the low temperature side electrode, and the p-type semiconductor and the n-type semiconductor together, by sintering a binding layer containing metal particles, which is provided between the electrode and the semiconductor.

A method for manufacturing a thermoelectric conversion module of the present invention is a method for manufacturing a thermoelectric conversion module including a thermoelectric semiconductor part in which a plurality of p-type semiconductors and a plurality of n-type semiconductors are alternately arranged, and a high temperature side electrode bound to a binding surface of the p-type semiconductor and the n-type semiconductor on a high temperature heat source side and a low temperature side electrode bound to a binding surface of the p-type semiconductor and the n-type semiconductor on a low temperature heat source side, which electrically connect the p-type semiconductor and the n-type semiconductor adjacent to each other in series, and includes a binding step of binding at least one of the high temperature side electrode and the low temperature side electrode, and the p-type semiconductor and the n-type semiconductor together, by sintering a binding layer containing metal particles, which is provided between the electrode and the semiconductor.

A porous body includes a framework having a three-dimensional network structure, the framework having a body including crystal grains including nickel and cobalt as constituent elements, the cobalt having a proportion in mass of 0.2 or more and 0.8 or less with respect to a total mass of the nickel and the cobalt, the crystal grains having a shorter grain diameter of 2 μm or more, as determined in a first observed image obtained by observing the body of the framework in cross section at a magnification of 200 times.