A method for producing a rotary disk/blisk for a high-pressure compressor or a high-speed turbine and to a corresponding geared turbofan engine. The method involves providing a Ni base alloy comprising, in % by weight, 15.5-16.5 Cr, 14.0-15.5 Co, 4.75-5.25 Ti, 2.75-3.25 Mo. 2.25-2.75 Al, 1.00-1.50 W, as well as optionally 0.0250-0.0500 Zr, 0.0100-0.0200 B, 0.0100-0.0200 C, remainder Ni. The base alloy is shaped by forging to obtain a preform of the disk/blisk, the final contour thereof being produced by electrical discharge machining or electrochemical machining.

Nanocrystalline alloy penetrators and related methods are generally provided. In some embodiments, a munition comprises a nanocrystalline alloy penetrator. In certain embodiments, the nanocrystalline alloy has particular properties (e.g., grain size, grain isotropy, mechanical properties) such that the penetrator acts as a rigid body kinetic penetrator.

Nanocrystalline alloy penetrators and related methods are generally provided. In some embodiments, a munition comprises a nanocrystalline alloy penetrator. In certain embodiments, the nanocrystalline alloy has particular properties (e.g., grain size, grain isotropy, mechanical properties) such that the penetrator acts as a rigid body kinetic penetrator.

This invention relates to a preparation method of rare earth oxide dispersion strengthened fee grain tungsten materials, the mass percent of the rare earth oxide is of 0.1-2%, and the rest ingredient is W. Weigh soluble rare earth salt and tungstate, dissolve into water to made into 50-100 g/L of rare earth salt solution and 150-300 g/L of tungstate solution, respectively. Firstly, add trace alkali in rare earth salt solution to control pH in 7-8, then add organic dispersant and stir to form evenly suspended R(OH).sub.3 particle colloid (R refers to rare earth element). Secondly pour the tungstate solution into the R(OH).sub.3colloid, add trace acid to control pH in 6-7, then add organic dispersant and stir to form tungstic acid micro particles, which wrap around the colloidal particles, forming coprecipitation coating particle colloid. Thirdly, the coprecipitation coating particle colloidal is spray-dried, forming tungsten and rare earth oxide compound precursor powder. Alter that, ultrafine or nanoscale tungsten powder with particle size of 50˜500 nm is obtained through a process of calcination subsequent with hydrogen thermal reduction. Finally, the tungsten powder is subjected to ordinary compression molding and then conventional high temperature sintering. The trace rare earth oxide dispersion strengthened high performance fine grain tungsten materials prepared by this invention, its density is close to full density (98.5% or higher), its grain size is uniform and very fine (average in 5˜10 microns), and the rare earth oxides particles evenly distribute in tungsten intracrystalline or grain, boundary with particle size of 100˜500 nm.

Mixed powder that contains first hard particles, second hard particles, graphite particles, and iron particles is used to manufacture a sintered alloy. The first hard particle is a Fe—Mo—Cr—Mn based alloy particle, the second hard particle is a Fe—Mo—Si based alloy particle. The mixed powder contains 5 to 50 mass % of the first hard particles, 1 to 8 mass % of the second hard particles, and 0.5 to 1.0 mass % of the graphite particles when total mass of the first hard particles, the second hard particles, the graphite particles, and the iron particles is set as 100 mass %.

Mixed powder that contains first hard particles, second hard particles, graphite particles, and iron particles is used to manufacture a sintered alloy. The first hard particle is a Fe—Mo—Cr—Mn based alloy particle, the second hard particle is a Fe—Mo—Si based alloy particle. The mixed powder contains 5 to 50 mass % of the first hard particles, 1 to 8 mass % of the second hard particles, and 0.5 to 1.0 mass % of the graphite particles when total mass of the first hard particles, the second hard particles, the graphite particles, and the iron particles is set as 100 mass %.

A medical device and a method and process for at least partially forming a medical device, which medical device has improved physical properties. The one or more improved physical properties of the novel metal alloy can be achieved in the medical device without having to increase the bulk, volume and/or weight of the medical device.

A medical device and a method and process for at least partially forming a medical device, which medical device has improved physical properties. The one or more improved physical properties of the novel metal alloy can be achieved in the medical device without having to increase the bulk, volume and/or weight of the medical device.

Provided is a master alloy for a sputtering target, wherein, when elements constituting the master alloy are following X1, X2, Y1, Y2, Y2, and Y3; specifically, where X1 is one or two types of Ta or W; X2 is at least one type of Ru, Mo, Nb or Hf; Y1 is one or two types of Cr or Mn; Y2 is one or two types of Co or Ni; and Y3 is one or two types of Ti or V, the master alloy comprises any one combination of X1-Y1, X1-Y2, X1-Y3, X2-Y1, and X2-Y2 of the foregoing constituent elements. The present invention consequently yields superior effects of being able to obtain a sintered sputtering target with few defects and having a high-density and uniform alloy composition, and, by using this target, to realize the deposition of an alloy barrier film with uniform quality and few particles at a high speed.

Provided is a master alloy for a sputtering target, wherein, when elements constituting the master alloy are following X1, X2, Y1, Y2, Y2, and Y3; specifically, where X1 is one or two types of Ta or W; X2 is at least one type of Ru, Mo, Nb or Hf; Y1 is one or two types of Cr or Mn; Y2 is one or two types of Co or Ni; and Y3 is one or two types of Ti or V, the master alloy comprises any one combination of X1-Y1, X1-Y2, X1-Y3, X2-Y1, and X2-Y2 of the foregoing constituent elements. The present invention consequently yields superior effects of being able to obtain a sintered sputtering target with few defects and having a high-density and uniform alloy composition, and, by using this target, to realize the deposition of an alloy barrier film with uniform quality and few particles at a high speed.