Patent classifications
C22C30/04
Method for producing a thermoelectric object for a thermoelectric conversion device
A method for producing a thermoelectric object for a thermoelectric conversion device is provided. A starting material which has elements in the ratio of a half-Heusler alloy is melted and then cooled to form at least one ingot. The ingot is homogenized at a temperature of 1000 C. to 1400 C. for a period of time t, wherein 0.5 ht<12 h or 24 h<t<100 h. The homogenized ingot is crushed and ground into a powder. The powder is cold-pressed and sintered at a maximum pressure of 1 MPa for 0.5 to 24 h at a temperature of 1000 C. to 1500 C.
Negative electrode active material for electrical device
A negative electrode active material having high cycle durability contains an alloy represented by the following chemical formula (1):
Si.sub.xSn.sub.yM.sub.zA.sub.a(1)
wherein M is Zn, A is unavoidable impurities, x, y, z, and a represent % by mass values, and in that case, 0<x<100, 0<y<100, 0<z<100, 0a<0.5, and x+y+z+a=100, in which the half width of the diffraction peak of the (111) surface of Si in the range of 2=24 to 33 by X ray diffraction measurement of the alloy using CuK ray is 0.7 or more, and the x is more than 23 and less than 64, the y is 4 or more and less than 34, and the z is more than 0 and less than 65.
Negative electrode active material for electrical device
A negative electrode active material having high cycle durability contains an alloy represented by the following chemical formula (1):
Si.sub.xSn.sub.yM.sub.zA.sub.a(1)
wherein M is Zn, A is unavoidable impurities, x, y, z, and a represent % by mass values, and in that case, 0<x<100, 0<y<100, 0<z<100, 0a<0.5, and x+y+z+a=100, in which the half width of the diffraction peak of the (111) surface of Si in the range of 2=24 to 33 by X ray diffraction measurement of the alloy using CuK ray is 0.7 or more, and the x is more than 23 and less than 64, the y is 4 or more and less than 34, and the z is more than 0 and less than 65.
Copper-nickel-zinc alloy and use thereof
A copper-nickel-zinc having the following composition in weight percentages: 46.0 to 51.0% Cu, 8.0 to 11.0% Ni, 0.2 to 0.6% Mn, 0.05 to 0.5% Si, up to 0.8% of each of Fe and/or Co, the sum of the Fe content and double the Co content equaling at least 0.1 wt. %, residual Zn, and unavoidable impurities, wherein nickel-, iron-, and manganese-containing and/or nickel-, cobalt-, and manganese-containing mixed silicides are embedded into a microstructure consisting of - and -phases as spherical or ellipsoidal particles and uses of such a copper-nickel-zinc alloy.
Copper-nickel-zinc alloy and use thereof
A copper-nickel-zinc having the following composition in weight percentages: 46.0 to 51.0% Cu, 8.0 to 11.0% Ni, 0.2 to 0.6% Mn, 0.05 to 0.5% Si, up to 0.8% of each of Fe and/or Co, the sum of the Fe content and double the Co content equaling at least 0.1 wt. %, residual Zn, and unavoidable impurities, wherein nickel-, iron-, and manganese-containing and/or nickel-, cobalt-, and manganese-containing mixed silicides are embedded into a microstructure consisting of - and -phases as spherical or ellipsoidal particles and uses of such a copper-nickel-zinc alloy.
Nickel titanium alloys, methods of manufacture thereof and article comprising the same
Disclosed herein is a shape memory alloy comprising 45 to 50 atomic percent nickel; and 1 to 30 atomic percent of at least one metalloid selected from the group consisting of germanium, antimony, zinc, gallium, tin, and a combination of one or more of the foregoing metalloids, with the remainder being titanium. The shape memory alloy may further contain aluminum. Disclosed herein too is a method of manufacturing the shape memory alloy.
Nickel titanium alloys, methods of manufacture thereof and article comprising the same
Disclosed herein is a shape memory alloy comprising 45 to 50 atomic percent nickel; and 1 to 30 atomic percent of at least one metalloid selected from the group consisting of germanium, antimony, zinc, gallium, tin, and a combination of one or more of the foregoing metalloids, with the remainder being titanium. The shape memory alloy may further contain aluminum. Disclosed herein too is a method of manufacturing the shape memory alloy.
Acid-Resistant Alloy Catalyst
Disclosed is an acid-resistant alloy catalyst comprising nickel, one or more rare earth elements, stannum and aluminum. The acid-resistant alloy catalyst is low-cost and stable, and does not need a carrier, and can be stably used in continuous industrial production, thus achieving a low production cost.
COPPER-BASED ALLOY FOR THE PRODUCTION OF BULK METALLIC GLASSES
The present invention relates to an alloy which has the following composition:
Cu.sub.47 at %(x+y+z)(Ti.sub.aZr.sub.b).sub.cNi.sub.7 at %+xSn.sub.1 at %+ySi.sub.z
where
c=43-47 at %, a=0.65-0.85, b=0.15-0.35, where a+b=1.00;
x=0-7 at %;
y=0-3 at %, z=0-3 at %, where y+z4 at %.
COPPER-BASED ALLOY FOR THE PRODUCTION OF BULK METALLIC GLASSES
The present invention relates to an alloy which has the following composition:
Cu.sub.47 at %(x+y+z)(Ti.sub.aZr.sub.b).sub.cNi.sub.7 at %+xSn.sub.1 at %+ySi.sub.z
where
c=43-47 at %, a=0.65-0.85, b=0.15-0.35, where a+b=1.00;
x=0-7 at %;
y=0-3 at %, z=0-3 at %, where y+z4 at %.