An electrical connector includes a first layer formed of a copper based material and a second layer formed of an iron-nickel alloy. The second layer has a thickness of 8% to 30% of the thickness of the electrical connector. The electrical connector also includes a third layer which is formed of a solder alloy that consists essentially of 17% to 28% indium by weight, 12% to 20% zinc by weight, 1% to 6% silver by weight, 1% to 3% copper by weight, and a remaining weight of the solder alloy that is tin.

An electrical connector includes a first layer formed of a copper based material and a second layer formed of an iron-nickel alloy. The second layer has a thickness of 8% to 30% of the thickness of the electrical connector. The electrical connector also includes a third layer which is formed of a solder alloy that consists essentially of 17% to 28% indium by weight, 12% to 20% zinc by weight, 1% to 6% silver by weight, 1% to 3% copper by weight, and a remaining weight of the solder alloy that is tin.

The present invention discloses a liquid metal thermal interface material having an anti-melt characteristic and a preparation method thereof. The liquid metal thermal interface material is characterized by comprising, in percentage by weight, 20-40 wt % of indium, 0-6 wt % of bismuth, 0-2 wt % of antimony, 0-3 wt % of zinc, 0-0.6 wt % silver, 0-0.3 wt % of nickel, 0-0.8 wt % of cerium, 0-0.6 wt % of europium and the balance of tin. The liquid metal thermal interface material has excellent thermal conductivity and chemical stability in an operating environment of an insulated gate bipolar transistor (IGBT), and thus is very suitable for IGBT devices in large-scale industrial production and practical applications.

A hardenable AlMgSi-based aluminum alloy is shown. In order to provide a recycling-friendly, storage-stable and particularly thermosetting aluminum alloy, it is proposed that this aluminum alloy should contain from 0.6 to 1% by weight of magnesium (Mg), from 0.2 to 0.7% by weight of silicon (Si), from 0.16 to 0.7% by weight of iron (Fe), from 0.05 to 0.4% by weight of copper (Cu), a maximum of 0.15% by weight of manganese (Mn), a maximum of 0.35% by weight of chromium (Cr), a maximum of 0.2% by weight of zirconium (Zr), a maximum of 0.25% by weight of zinc (Zn), a maximum of 0.15% by weight of titanium (Ti), 0.005 to 0.075% by weight of tin (Sn) and/or indium (In), and the remainder aluminum and production-related unavoidable impurities, wherein the ratio of the weight percentages of Si/Fe is less than 2.5 and the content of Si is determined according to the equation wt. % Si=A+[0.3*(wt. % Fe)], with the parameter A being in the range of 0.17 to 0.4% by weight.

A hardenable AlMgSi-based aluminum alloy is shown. In order to provide a recycling-friendly, storage-stable and particularly thermosetting aluminum alloy, it is proposed that this aluminum alloy should contain from 0.6 to 1% by weight of magnesium (Mg), from 0.2 to 0.7% by weight of silicon (Si), from 0.16 to 0.7% by weight of iron (Fe), from 0.05 to 0.4% by weight of copper (Cu), a maximum of 0.15% by weight of manganese (Mn), a maximum of 0.35% by weight of chromium (Cr), a maximum of 0.2% by weight of zirconium (Zr), a maximum of 0.25% by weight of zinc (Zn), a maximum of 0.15% by weight of titanium (Ti), 0.005 to 0.075% by weight of tin (Sn) and/or indium (In), and the remainder aluminum and production-related unavoidable impurities, wherein the ratio of the weight percentages of Si/Fe is less than 2.5 and the content of Si is determined according to the equation wt. % Si=A+[0.3*(wt. % Fe)], with the parameter A being in the range of 0.17 to 0.4% by weight.

A sintered sliding material with excellent corrosion resistance, heat resistance, and wear resistance is provided. The sintered sliding material has a composition made of: 36-86 mass % of Ni; 1-11 mass % of Sn; 0.05-1.0 mass % of P; 1-9 mass % of C; and the Cu balance including inevitable impurities. The sintered sliding material is made of a sintered material of a plurality of grains of alloy of NiCu alloy or CuNi alloy, the NiCu alloy and the CuNi alloy containing Sn, P, C, and Si; has a structure in which pores are dispersedly formed in grain boundaries of the plurality of the grains of alloy; and as inevitable impurities in a matrix constituted from the grains of alloy, a C content is 0.6 mass % or less and a Si content is 0.15 mass % or less.

A sintered sliding material with excellent corrosion resistance, heat resistance, and wear resistance is provided. The sintered sliding material has a composition made of: 36-86 mass % of Ni; 1-11 mass % of Sn; 0.05-1.0 mass % of P; 1-9 mass % of C; and the Cu balance including inevitable impurities. The sintered sliding material is made of a sintered material of a plurality of grains of alloy of NiCu alloy or CuNi alloy, the NiCu alloy and the CuNi alloy containing Sn, P, C, and Si; has a structure in which pores are dispersedly formed in grain boundaries of the plurality of the grains of alloy; and as inevitable impurities in a matrix constituted from the grains of alloy, a C content is 0.6 mass % or less and a Si content is 0.15 mass % or less.

A conductive ball includes a copper ball, a nickel layer covering an outer surface of the copper ball, a copper layer covering an outer surface of the nickel layer, and a tin-based solder covering an outer surface of the copper layer. A copper weight of the copper layer relative to a summed weight of the tin-based solder and the copper layer is 0.7 wt % to 3 wt %.

A conductive ball includes a copper ball, a nickel layer covering an outer surface of the copper ball, a copper layer covering an outer surface of the nickel layer, and a tin-based solder covering an outer surface of the copper layer. A copper weight of the copper layer relative to a summed weight of the tin-based solder and the copper layer is 0.7 wt % to 3 wt %.

An electrically conducting material including a substrate composed of copper or a copper alloy, and a coating composed of at least one layer. The coating has an outermost layer consisting to an extent of at least 90 vol % of an intermetallic phase which is or includes Cu.sub.6Sn.sub.5. The surface of the outermost layer that faces away from the substrate has insular, silver-rich precipitations with an area fraction of 7 to 20%.