There is provided a thermoelectric conversion material made of a full-Heusler alloy and capable of enhancing figure of merit. In order to solve the above problem, the thermoelectric conversion material is made of the full-Heusler alloy represented by the following composition formula: (Fe.sub.1-xM1.sub.x).sub.2+(Ti.sub.1-yM2.sub.y).sub.1+(A.sub.1-zM3.sub.z).sub.1+. A composition in a ternary phase diagram of FeTi-A is inside a hexagon having points (50, 37, 13), (45, 30, 25), (39.5, 25, 35.5), (50, 14, 36), (54, 21, 25), and (55.5, 25, 19.5) as apexes. Further, an amount of change VEC of an average valence electron number per atom VEC in the case of x=y=z=0 satisfies a relation 0<|VEC|0.2 or 0.2<|VEC|0.3.

The invention relates to a copper-nickel-zinc alloy with the following composition in weight percentages: 46.0 to 51.0% Cu, 8.0 to 11.0% Ni, 0.2 to 0.6% Mn, 0.05 to 0.5% Si, up to 0.8% of each of Fe and/or Co, the sum of the Fe content and double the Co content equaling at least 0.1 wt. %, residual Zn, and unavoidable impurities, wherein nickel-, iron-, and manganese-containing and/or nickel-, cobalt-, and manganese-containing mixed silicides are embedded into a microstructure consisting of - and -phases as spherical or ellipsoidal particles. The invention further relates to uses of a copper-nickel-zinc alloy according to the invention.

The invention relates to a copper-nickel-zinc alloy with the following composition in weight percentages: 46.0 to 51.0% Cu, 8.0 to 11.0% Ni, 0.2 to 0.6% Mn, 0.05 to 0.5% Si, up to 0.8% of each of Fe and/or Co, the sum of the Fe content and double the Co content equaling at least 0.1 wt. %, residual Zn, and unavoidable impurities, wherein nickel-, iron-, and manganese-containing and/or nickel-, cobalt-, and manganese-containing mixed silicides are embedded into a microstructure consisting of - and -phases as spherical or ellipsoidal particles. The invention further relates to uses of a copper-nickel-zinc alloy according to the invention.

Provided is an Au-based solder alloy that has high bonding reliability even when its Au content is lower than that of a conventional Au-based solder alloy.

The Au-based solder alloy is used for sealing or bonding a ceramic electronic component and made of an AuSnAg alloy containing 21.1 to 43.0% by mass of Sn, 0.1 to 15% by mass of Ag, and a balance of Au and inevitable impurities, an AuGeSn alloy containing 9.5 to 15% by mass of Ge, 2 to 10% by mass of Sn, and a balance of Au and inevitable impurities, or an AuAgGe alloy containing 5 to 18% by mass of Ag, 7 to 20% by mass of Ge, and a balance of Au and inevitable impurities. When the Au-based soldering ball is crushed in one direction, a maximum stress before cracking occurs is 2.010.sup.2 N/mm.sup.2 or more, and a square root of strain before the cracking occurs is 0.40 or more.

Disclosed herein is a shape memory alloy comprising 45 to 50 atomic percent nickel; and 1 to 30 atomic percent of at least one metalloid selected from the group consisting of germanium, antimony, zinc, gallium, tin, and a combination of one or more of the foregoing metalloids, with the remainder being titanium. The shape memory alloy may further contain aluminum. Disclosed herein too is a method of manufacturing the shape memory alloy.

Disclosed herein is a shape memory alloy comprising 45 to 50 atomic percent nickel; and 1 to 30 atomic percent of at least one metalloid selected from the group consisting of germanium, antimony, zinc, gallium, tin, and a combination of one or more of the foregoing metalloids, with the remainder being titanium. The shape memory alloy may further contain aluminum. Disclosed herein too is a method of manufacturing the shape memory alloy.

An anti-corrosion structure and a fuel cell employing the same are provided. The anti-corrosion structure includes an aluminum layer, a first anti-corrosion layer, and an intermediate layer disposed between the aluminum layer and the first anti-corrosion layer. In particular, the first anti-corrosion layer can be a nickel-tin-containing alloy layer, and the intermediate layer can be a nickel-tin-aluminum-containing alloy layer.

This invention consists of a device for the treatment and elimination of bacteria in combustible hydrocarbons, whose function is to ensure the purity of said fuels. The elimination of bacteria takes place catalytically thanks to the alloy of which its inner part is composed and the interaction with the casing containing it. This device has the advantage of having a more intense effect of eliminating microbiological contamination than other technologies. It is installed inside the fuel tanks. Its design allows that its presence in the tank does not cause damage to the components that may be inside it.

The invention is directed to the use of electrolytic bronze deposits as substitutes for the noble metal electroplating of electronic circuits, e.g. for use in electronic payment cards and identity cards. The invention also relates to a novel layer sequence of bronze layers.

The invention is directed to the use of electrolytic bronze deposits as substitutes for the noble metal electroplating of electronic circuits, e.g. for use in electronic payment cards and identity cards. The invention also relates to a novel layer sequence of bronze layers.