A chip arrangement including: a chip including a chip back side; a substrate including a surface with a plating; and a zinc-based solder alloy which attaches the chip back side to the plating on the surface of the substrate, the zinc-based solder alloy including, by weight, 1% to 30% aluminum, 0.5% to 20% germanium, and 0.5% to 20% gallium, wherein a balance of the zinc-based solder alloy is zinc.

A silver brazing material containing silver, copper, zinc, manganese, nickel, and tin as indispensable constituent elements. The silver brazing material includes 35 mass % or more and 45 mass % or less silver, 18 mass % or more and 28 mass % or less zinc, 2 mass % or more and 6 mass % or less manganese, 1.5 mass % or more and 6 mass % or less nickel, and 0.5 mass % or more and 5 mass % or less tin, with the balance being copper impurities. Within these compositional ranges, a predetermined relation is set between the manganese content and the nickel content, whereby the silver brazing material can be provided with excellent characteristics also in terms of processability or wettability. In the silver brazing material of the present invention, the silver content is reduced, and also melting point reduction and the narrowing of the temperature difference between solidus temperature and liquidus temperature are attempted.

An aluminium-zinc-hot-dipped and colour-coated steel plate having yield strength of ≥500 MPa and a high elongation and a manufacturing method thereof, with the chemical components in mass percentage of a substrate of the steel plate being: 0.07-0.15% of C, 0.02-0.5% of Si, 1.3-1.8% of Mn, N≤0.004%, S≤0.01%, Ti≤0.15%, Nb≤0.050%, and the balance being Fe and other inevitable impurities, and meanwhile satisfying the conditions of: (C+Mn/6)≥0.3%; Mn/S≥150; Nb satisfying 0.01%≤(Nb-0.22C-1.1N)≤0.05% where no Ti is contained; Ti satisfying 0.5≤Ti/C≤1.5 where no Nb is contained; and 0.04%≤(Ti+Nb)≤0.2% where Ti and Nb are added in combination. The steel plate has a tensile strength of ≥550 MPa, an elongation after fracture of ≥15%, a good strength and toughness and an excellent corrosion resistance.

An aluminium-zinc-hot-dipped and colour-coated steel plate having yield strength of ≥500 MPa and a high elongation and a manufacturing method thereof, with the chemical components in mass percentage of a substrate of the steel plate being: 0.07-0.15% of C, 0.02-0.5% of Si, 1.3-1.8% of Mn, N≤0.004%, S≤0.01%, Ti≤0.15%, Nb≤0.050%, and the balance being Fe and other inevitable impurities, and meanwhile satisfying the conditions of: (C+Mn/6)≥0.3%; Mn/S≥150; Nb satisfying 0.01%≤(Nb-0.22C-1.1N)≤0.05% where no Ti is contained; Ti satisfying 0.5≤Ti/C≤1.5 where no Nb is contained; and 0.04%≤(Ti+Nb)≤0.2% where Ti and Nb are added in combination. The steel plate has a tensile strength of ≥550 MPa, an elongation after fracture of ≥15%, a good strength and toughness and an excellent corrosion resistance.

A chip arrangement including a chip comprising a chip back side; a back side metallization on the chip back side, the back side metallization including a plurality of layers; a substrate comprising a surface with a metal layer; a zinc-based solder alloy configured to attach the back side metallization to the metal layer, the zinc-based solder alloy having by weight 8% to 20% aluminum, 0.5% to 20% magnesium, 0.5% to 20% gallium, and the balance zinc; wherein the metal layer is configured to provide a good wettability of the zinc-based solder alloy on the surface of the substrate. The plurality of layers may include one or more of a contact layer configured to contact a semiconductor material of the chip back side; a barrier layer; a solder reaction, and an oxidation protection layer configured to prevent oxidation of the solder reaction layer.

A chip arrangement including a chip comprising a chip back side; a back side metallization on the chip back side, the back side metallization including a plurality of layers; a substrate comprising a surface with a metal layer; a zinc-based solder alloy configured to attach the back side metallization to the metal layer, the zinc-based solder alloy having by weight 8% to 20% aluminum, 0.5% to 20% magnesium, 0.5% to 20% gallium, and the balance zinc; wherein the metal layer is configured to provide a good wettability of the zinc-based solder alloy on the surface of the substrate. The plurality of layers may include one or more of a contact layer configured to contact a semiconductor material of the chip back side; a barrier layer; a solder reaction, and an oxidation protection layer configured to prevent oxidation of the solder reaction layer.

The present invention provides a sintered metal friction material that has excellent wear resistance, heat resistance even at high load and has a higher friction coefficient while maintaining a friction coefficient and wear resistance that are hard to decrease, and has a reduced content of copper of less than 5 mass %. There is provided a sintered metal friction material characterized in that the sintered metal friction material comprises a sintered material of a friction material composition, the friction material composition comprises matrix metals and a friction modifier, the matrix metals comprise following 20 to 40 mass % of iron powder, 20 to 40 mass % of nickel powder, 0.5 to 10 mass % of zinc powder, 0.5 to 5 mass, of tin powder, 0.5 to 4 mass % of copper powder and 0.5 to 5 mass % of sintering assist powder.

There is provided a hot-stamped body including: a steel base metal; and a metallic layer formed on a surface of the steel base metal, wherein the metallic layer includes: an interface layer that contains, in mass %, Al: 30.0 to 36.0%, has a thickness of 100 nm to 15 m, and is located in an interface between the metallic layer and the steel base metal; and a principal layer that includes coexisting Zn phases and insular FeAl.sub.2 phases, is located on the interface layer, and has a thickness of 1 m to 40 m. This hot-stamped body is excellent in fatigue properties, corrosion resistance, and chipping resistance.

There is provided a hot-stamped body including: a steel base metal; and a metallic layer formed on a surface of the steel base metal, wherein the metallic layer includes: an interface layer that contains, in mass %, Al: 30.0 to 36.0%, has a thickness of 100 nm to 5 m, and is located in an interface between the metallic layer and the steel base metal; and a principal layer that includes coexisting MgZn.sub.2 phases and insular FeAl.sub.2 phases, is located on the interface layer, and has a thickness of 3 m to 40 m.

There is provided a hot-stamped body including: a steel base metal; and a metallic layer formed on a surface of the steel base metal, wherein the metallic layer includes: an interface layer that contains, in mass %, Al: 30.0 to 36.0%, has a thickness of 100 nm to 5 m, and is located in an interface between the metallic layer and the steel base metal; and a principal layer that includes coexisting MgZn.sub.2 phases and insular FeAl.sub.2 phases, is located on the interface layer, and has a thickness of 3 m to 40 m.