Bulk amorphous alloys based on quaternary NiZrTiAl alloy system, and the extension of this quaternary system to higher order alloys by the addition of one or more alloying elements, methods of casting such alloys, and articles made of such alloys are provided.

Example embodiments relate to extreme ultraviolet absorbing alloys. One example embodiment includes an alloy. The alloy includes one or more first elements selected from: a first list consisting of: Ag, Ni, Co, and Fe; and a second list consisting of: Ru, Rh, Pd, Os, Ir, and Pt. The alloy also includes one or more second elements selected from: the first list, if the one or more first elements are not selected from the first list; and a third list consisting of Sb and Te. An atomic ratio between the one or more first elements and the one or more second elements is between 1:1 and 1:5 if the one or more second elements are selected from the third list and between 1:1 and 1:19 if the one or more second elements are not selected from the third list.

A process for producing an amorphous ductile brazing foil is provided. According to one example embodiment, the method includes providing a molten mass, and rapidly solidifying the molten mass on a moving cooling surface with a cooling speed of more than approximately 10.sup.5 C./sec to produce an amorphous ductile brazing foil. A process for joining two or more parts is also provided. The process includes inserting a brazing foil between two or more parts to be joined, wherein the parts to be joined have a higher melting temperature than that the brazing foil to form a solder joint and the brazing foil comprises an amorphous, ductile Ni-based brazing foil; heating the solder joint to a temperature above the liquidus temperature of the brazing foil to form a heated solder joint; and cooling the heated solder joint, thereby forming a brazed joint between the parts to be joined.

A process for producing an amorphous ductile brazing foil is provided. According to one example embodiment, the method includes providing a molten mass, and rapidly solidifying the molten mass on a moving cooling surface with a cooling speed of more than approximately 10.sup.5 C./sec to produce an amorphous ductile brazing foil. A process for joining two or more parts is also provided. The process includes inserting a brazing foil between two or more parts to be joined, wherein the parts to be joined have a higher melting temperature than that the brazing foil to form a solder joint and the brazing foil comprises an amorphous, ductile Ni-based brazing foil; heating the solder joint to a temperature above the liquidus temperature of the brazing foil to form a heated solder joint; and cooling the heated solder joint, thereby forming a brazed joint between the parts to be joined.

The invention relates to a one-piece metal component including an electroformed metal body, the external surface of the body including, only over or to a predetermined depth, less trapped hydrogen than the rest of the electroformed metal body causing a hardening relative to the rest of the body in order to improve the wear resistance of the one-piece component while preserving a relative magnetic permeability of less than 10 and the ability to be driven or pressed fit.

The invention relates to a one-piece metal component including an electroformed metal body, the external surface of the body including, only over or to a predetermined depth, less trapped hydrogen than the rest of the electroformed metal body causing a hardening relative to the rest of the body in order to improve the wear resistance of the one-piece component while preserving a relative magnetic permeability of less than 10 and the ability to be driven or pressed fit.

An electromagnetic wave shielding thin film for shielding from electromagnetic waves generated in an electronic part is provided. The electromagnetic wave shielding thin film includes metal plate which has elastic limit of 1% or more, strength of 1000 MPa or more, and a volume fraction of an amorphous phase of 50% or more.

An electromagnetic wave shielding thin film for shielding from electromagnetic waves generated in an electronic part is provided. The electromagnetic wave shielding thin film includes metal plate which has elastic limit of 1% or more, strength of 1000 MPa or more, and a volume fraction of an amorphous phase of 50% or more.

The disclosure is directed to methods of forming metallic glass multilayers by depositing a liquid layer of a metallic glass forming alloy over a metallic glass layer, and to multilayered metallic glass articles produced using such methods.

The disclosure is directed to methods of forming metallic glass multilayers by depositing a liquid layer of a metallic glass forming alloy over a metallic glass layer, and to multilayered metallic glass articles produced using such methods.